NUREMBERG, GERMANY – March 10, 2026 – At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT products and applications: MediaTek Genio Pro, Genio 420 and Genio 360. The Genio Pro series is MediaTek’s premium offering for high-performance IoT and embedded offerings, while Genio 420 and Genio 360 bring efficient system-level edge AI performance to smart home, retail, industrial, and commercial IoT devices.</ … Read More → "MediaTek Adds New Genio Platforms to Bring AI Processing to Robotics, Drones, and Industrial IoT"
HighTec Drives Automotive Software Development on Renesas RH850/U2x MCUs with LLVM-Based Rust and C/C++ Toolchains
March 12, 2026
| Saarbruecken, Germany, March 9, 2026 – HighTec EDV-Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified LLVM-based HighTec Rust and C/C++ compiler toolchain available for Renesas RH850/U2x microcontrollers. Embedded developers working on this high-performance 32-bit Automotive RH850 family from Renesas can now integrate memory-safe Rust with their existing C/C++ codebase. This hybrid approach enables fast innovation cycles in zone/domain controllers, powertrain, chassis or other safety-critical applications, especially in the context of software-defined vehicles ( … Read More → "HighTec Drives Automotive Software Development on Renesas RH850/U2x MCUs with LLVM-Based Rust and C/C++ Toolchains" |
Xanadu and AMD Accelerate Quantum Computing for Aerospace and Engineering
March 12, 2026
TORONTO, March 10, 2026 (GLOBE NEWSWIRE) — Xanadu Quantum Technologies Inc. (“Xanadu”), a leading photonic quantum computing company, today announced a major step forward in bringing quantum computing closer to real-world aerospace and engineering applications by leveraging AMD HPC and AI technologies. By combining Xanadu’s PennyLane quantum software with AMD high-performance computing solutions on the AMD DevCloud, Xanadu successfully demonstrated how advanced aerospace simulations can be prepared and run in … Read More → "Xanadu and AMD Accelerate Quantum Computing for Aerospace and Engineering"
NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI
March 11, 2026
- First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package
- Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement
- Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market
NUREMBERG, Germany, March 9, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, … Read More → "NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI"
Axelera® AI Adds Kudelski Labs’ Security IP to Europa Chip to Enable Secure, High-Performance Edge AI
March 11, 2026
CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Read More → "Axelera® AI Adds Kudelski Labs’ Security IP to Europa Chip to Enable Secure, High-Performance Edge AI"
IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications
March 11, 2026
| Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to help customers maintain stable, reproducible toolchains across long product lifecycles.
Across safety-critical industries including automotive, industrial automation, and medical technology, embedded software must remain maintainable, rebuildable, and updatable for many years after products enter production. Development teams are expected to deliver updates, resolve issues, and adapt to evolving requirements while maintaining consistency in tools, workflows, and build environments. In this context, toolchain stability becomes critical, … Read More → "IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications" |
BANF and Silicon Labs Digitize the “Last Analog Domain” with Intelligent Tire Monitoring Solution
March 11, 2026
Seoul, South Korea and Austin, TX — March 10, 2026 — BANF, a Korean intelligent tire system company, and Silicon Labs, the leading innovator in low-power wireless, today announced a breakthrough in tire monitoring technology. By integrating Silicon Labs’ ultra-low-power Bluetooth® LE SoC, the BG22, into its in-tire sensor platform, BANF has developed a real-time, high-resolution tire data processing system designed for autonomous vehicles and connected fleet environments.
For decades, tires have represented an industry “black box.” Traditional Tire Pressure Monitoring Systems (TPMS) provide alerts only when pressure drops significantly, limiting their ability to prevent fuel inefficiency or safety risks at … Read More → "BANF and Silicon Labs Digitize the “Last Analog Domain” with Intelligent Tire Monitoring Solution"
Dukosi to Debut Novel Module-level Communication Solution using Near Field Wireless at Embedded World 2026
March 11, 2026
EDINBURGH, United Kingdom, 9 March, 2026 — Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of high-power battery systems, introduces a novel module-level communication solution with near field wireless connectivity for highly secure and more reliable battery systems than traditional wired and far field wireless designs. This innovative module communication link, DK-NFLNK™ is a simple upgrade path from traditional wired and far field wireless BMS architectures to a more reliable battery solution that offers synchronous, module-level measurements to the BMS host using Dukosi’s proprietary contactless communication protocol based on C-SynQ®. Dukosi is introducing DK-NFLNK™ at Embedded World this … Read More → "Dukosi to Debut Novel Module-level Communication Solution using Near Field Wireless at Embedded World 2026"
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