News – Page 2 – EEJournal

Zuken Unveils Panel Builder 2026 for E3.series to Advance Connected Manufacturing

Supports design reuse, automation, and real-time collaboration from design to production.

December 2, 2025

WESTFORD, Mass., December 2, 2025 — Zuken today announced the release of Panel Builder 2026 for E3.series, the latest update to its advanced manufacturing design platform within the E3.series suite. Built for control panel and switchgear production, Panel Builder 2026 enables engineering and manufacturing teams to generate intelligent wiring and assembly instructions directly from electrical design data, improving consistency, speed, and traceability.

The 2026 release introduces advanced new capabilities that enhance collaboration, streamline workflows, and scale production across increasingly complex manufacturing environments, Teams can deliver more panels in less time while maintaining quality and alignment with engineering intent.

New Receivers Product Line Ideal for Over-the-Ear Speaker Applications

December 2, 2025

LAKE OSWEGO, Ore. — December 2, 2025 — Same Sky’s Read More → "New Receivers Product Line Ideal for Over-the-Ear Speaker Applications"

DigiKey Launches 2025 DigiWish Holiday Giveaway for Global Engineering Community

The annual DigiWish contest returns Dec. 1-24, giving engineers, makers and tech enthusiasts a chance to win daily prizes and a $500 DigiKey shopping spree

December 2, 2025

THIEF RIVER FALLS, Minnesota, USA – DigiKey, the leading global electronic components and automation products distributor, has kicked off its 17th annual DigiWish Giveaway, which runs Dec. 1-24, 2025. The popular holiday giveaway offers entrants a chance to win DigiKey product … Read More → "DigiKey Launches 2025 DigiWish Holiday Giveaway for Global Engineering Community"

TDK presents new S series inrush current limiters for up to 35 A and 750 J in high-power applications

December 2, 2025

December 02, 2025

TDK Corporation (TSE:6762) introduces the new S series inrush current limiters (ICLs), comprising the S30 (ordering code: B57130S0*M000) and S36 (B57136S0*M100) families of NTC thermistors. With maximum steady-state currents of up to 35 A and energy absorption capabilities of up to 750 J, the components are optimized for high-power applications that demand reliable suppression of inrush currents. Typical applications include switch-mode power supplies, frequency converters, photovoltaic inverters, uninterruptible power supplies, and soft-start motors.

The S30 series features disk diameters of 30 mm, 7.5 mm lead spacing, and maximum … Read More → "TDK presents new S series inrush current limiters for up to 35 A and 750 J in high-power applications"

Taoglas Expands Low-Cost, Compact Chip Antenna Range for Wi-Fi® 6/7, UWB and ISM Applications

December 2, 2025

San Diego, CA, 2 December 2025 – Taoglas®, a trusted provider of advanced RF and antenna solutions, today announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimized for Wi-Fi® 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new Read More →

SECO expands its Edge AI portfolio with new applications for safety, energy-efficient vision, and geospatial analysis

New applications extend SECO’s AI capabilities with solutions for environmental analysis, real-time safety, and efficient edge intelligence

December 2, 2025

Arezzo, Italy – December 2, 2025 – SECO has introduced a new set of Edge AI applications that enhance capabilities in safety monitoring, low-power machine vision, geospatial analysis, and intelligent video understanding. The release strengthens SECO’s growing ecosystem of production-ready AI solutions designed for deployment across industrial and embedded environments.

The new additions include Land-Cover Change Detection, an advanced computer vision application that analyzes satellite or aerial imagery to automatically identify and map land-cover changes such as deforestation or urbanization. This capability is essential for environmental monitoring, sustainable urban planning, and ecological impact assessments.

SECO is also expanding … Read More → "SECO expands its Edge AI portfolio with new applications for safety, energy-efficient vision, and geospatial analysis"

SECORA™ ID V2 platform enables industry’s first FIDO Level 3+ certified secured authentication solutions

December 1, 2025

Munich, Germany – 1 December 2025 – As cyberattacks exploiting security vulnerabilities rise across industries, secured authentication is becoming critical for safeguarding digital identities. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) reinforces its position as a leader in advanced security solutions with the world’s first FIDO CTAP2.1 Authenticator Level 3+ certificates on the SECORA™ ID V2 platform. The Infineon FIDO applet is part of Infineon’s applet collection and runs on the SECORA ID V2 platform, the same base as Eviden’s recently Level 3+ certified … Read More → "SECORA™ ID V2 platform enables industry’s first FIDO Level 3+ certified secured authentication solutions"

NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design

December 1, 2025

Key Highlights

Multi-year collaboration spans NVIDIA CUDA accelerated computing, agentic and physical AI, and Omniverse digital twins to achieve simulation speed and scale previously unattainable through traditional CPU computing – opening new market opportunities across engineering.
To further adoption of GPU-accelerated engineering solutions, the companies will collaborate in engineering and marketing activities.
NVIDIA invested $2 billion in Synopsys common stock.

SUNNYVALE, Calif., Dec. 1, 2025 /Read More → "NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design"

Marvell Extends Collaboration with Microsoft, Expanding Azure Global Cloud Security Services in Europe

Expands Use Cases for Marvell-powered, Cloud-based Security Services in the Region, Adding to Existing Offerings in Asia and North America

December 1, 2025

SANTA CLARA, Calif. – Dec. 1, 2025 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced that Microsoft expanded the use cases for its cloud-based security offerings powered by Marvell^® LiquidSecurity^® hardware security modules (HSMs) for customers in Europe, adding to existing cloud-based security offerings in Asia and North America. The announcement follows two new European certifications awarded to Marvell for LiquidSecurity earlier … Read More → "Marvell Extends Collaboration with Microsoft, Expanding Azure Global Cloud Security Services in Europe"

STMicroelectronics extends highly integrated VIPerGaN family with 65-Watt flyback converter in Power QFN

December 1, 2025

Geneva, Switzerland, December 1, 2025 — STMicroelectronics has added VIPerGaN65W, a 65 Watt flyback converter, in the VIPerGaN series that combines a 700V GaN transistor and quasi-resonant PWM control IC in a single QFN 5×6 package. Joining the VIPerGaN50W announced previously, the new VIPerGaN65W extends opportunities for customers to develop … Read More → "STMicroelectronics extends highly integrated VIPerGaN family with 65-Watt flyback converter in Power QFN"