News – Page 1994 – EEJournal

Ericsson Unveils New High-Density Digital Power Module for Highly Efficient Power Consumption Control

July 10, 2012

New digital power module embeds ‘Ericsson DC/DC Energy Optimizer’ to deliver industry-leading energy-saving performance
Output voltage is a tightly regulated +/-2% over the full operational range from 36V to 75V
High and very flat efficiency curve from low- to full-load operation
Very fast response loop to input voltage transients
Output power up to 300W for datacom applications

Ericsson has unveiled the second model in its 32-bit processor-based FRIDA II 3E* digital Advanced Bus Converter (ABC) family: the BMR457. Following the launch last month of its … Read More → "Ericsson Unveils New High-Density Digital Power Module for Highly Efficient Power Consumption Control"

Xilinx Sponsors NI LabVIEW FPGA Innovation Award at NIWeek 2012

July 10, 2012

SAN JOSE, Calif. July 10, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its sponsorship of a Graphical System Design Achievement Award at NIWeek 2012. The featured award titled, “The NI LabVIEW FPGA Innovation Award,” will recognize the paper that details the most innovative application using National Instruments (NI) LabVIEW graphical system design software to program the field programmable gate array (FPGA) in NI hardware including PXI-based R Series … Read More → "Xilinx Sponsors NI LabVIEW FPGA Innovation Award at NIWeek 2012"

Chipmakers Adopt Cymer’s SmartPulse™

July 10, 2012

SAN DIEGO, July 9, 2012—Cymer, Inc. (Nasdaq: CYMI), the world’s leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its SmartPulse™ data management tool for light source performance monitoring has been adopted by leading chipmakers, with installations at multiple chipmaker sites around the world since its introduction in October 2011.

SmartPulse data can be uploaded to a fab-wide fault detection and classification (FDC) system, which … Read More → "Chipmakers Adopt Cymer’s SmartPulse™"

Imec First to Demonstrate Nanophotonics Components on 300mm Silicon Photonics Wafers Using Optical Lithography

July 10, 2012

SEMICON WEST (San Francisco, USA) – July 9, 2012 – Imec today announces the world-first realization of functional sub-100nm photonics components with optical lithography on 300mm silicon photonics wafer technology. Using 193nm immersion lithography, imec achieved the lowest propagation loss ever reported in silicon wire waveguides, and succeeded in patterning simpler and more efficient fiber couplers. Imec’s achievement is an important step in bringing Si photonics technology in line with CMOS industry standards.

Imec’s industrial affiliation program on optical I/O explores the use of photonics solutions for realizing high-bandwidth I/O in high performance computing systems. The … Read More → "Imec First to Demonstrate Nanophotonics Components on 300mm Silicon Photonics Wafers Using Optical Lithography"

KLA-Tencor Announces Installation of First 450mm-Capable Surfscan® SP3 Systems

July 10, 2012

MILPITAS, Calif., July 9, 2012 – Today KLA-Tencor Corporation (NASDAQ: KLAC) announced the installation of its first process control systems capable of handling and inspecting 450mm wafers: a new configuration of the market-leading Surfscan^® SP3 platform called the Surfscan SP3 450. Fully automated, these unpatterned wafer inspection systems are designed to meet the demanding defect and surface quality characterization requirements of the 20nm node and beyond, enabling control of the manufacturing process for 450mm polished silicon and epitaxial silicon substrates. The Surfscan SP3 450 also delivers critical capability for manufacturers of 450 … Read More → "KLA-Tencor Announces Installation of First 450mm-Capable Surfscan® SP3 Systems"

Flemish Government to Support imec’s 450mm Clean Room

July 9, 2012

SEMICON WEST (San Francisco, USA), July 9, 2012 – The Flemish Minister of Innovation, Ingrid Lieten, has announced to invest in the building of imec’s 450mm clean room facilities. Imec strives to keep playing a world-leading role in research on the most advanced semiconductor processes and technologies. With the combination of a state-of-the-art 300mm clean room and the transition to 450mm, imec will be able to keep on delivering its partners topnotch research on (sub)-10nm devices enabling the future growth of the global nanoelectronics industry.

To secure the future of the semiconductor industry in Europe, Europe must … Read More → "Flemish Government to Support imec’s 450mm Clean Room"

MSC samples Qseven™ Module with new very low-power AMD® Embedded G-Series Processor

July 9, 2012

Stutensee, Germany – MSC Vertriebs GmbH announced support for the new low-power AMD^® G-T16R with AMD Radeon™ HD6250 Accelerated Processing Unit (APU) for cost-sensitive applications on its Qseven™ module MSC Q7-A50M. Samples of the MSC Q7-A50M are available featuring the AMD G-T16R (single core, 615MHz), G-T40E (dual core, 1GHz) and G-T40R (single core, 1GHz).

The module version using the AMD G-T16R APU comes at a particularly economic price despite the sizeable computing performance and excellent graphics capability available from the integrated AMD Radeon™ HD6250 Graphics Processing Unit ( … Read More → "MSC samples Qseven™ Module with new very low-power AMD® Embedded G-Series Processor"

Lattice Announces Strategic Partnership With UMC

July 9, 2012

HILLSBORO, OR – July 9, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced a long term technology partnership with United Microelectronics Corporation (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry. As part of this partnership, Lattice and UMC will continue work, already underway, on non-volatile products based on advanced technology nodes and then quickly expand their efforts to include other Lattice product lines.

“As Lattice has pursued increasingly price- and power-sensitive markets, from communications infrastructure to consumer mobile devices, we have recognized that having a … Read More → "Lattice Announces Strategic Partnership With UMC"

Mentor Graphics Announces Support for the Multi-threaded MIPS32 34K Core with the Nucleus SMP RTOS

July 9, 2012

WILSONVILLE, Ore., July 9, 2012—Mentor Graphics Corporation (NASDAQ: MENT), with its flagship Nucleus® Real Time Operating System (RTOS), today announced the Nucleus product integration and SMP (symmetric multiprocessing) support for the MIPS32 34K core that utilizes MIPS Technologies’ MT (hardware Multi-Threading) technology. The combination demonstrated increased embedded application performance of over 20%, without increasing power consumption or silicon size. The Nucleus product is the industry’s first RTOS to demonstrate significant performance gains using MIPS Technologies’ Virtual Processing Engines (VPEs) over a single-core approach.

The balance between increased performance and power consumption for connected devices is … Read More → "Mentor Graphics Announces Support for the Multi-threaded MIPS32 34K Core with the Nucleus SMP RTOS"

Synopsys’ DesignWare IP for PCI Express with Support for Low-Power Sub-States Successfully Taped Out in Multiple Designs

July 9, 2012

MOUNTAIN VIEW, Calif., July 9, 2012 /PRNewswire/ —

Highlights:

Synopsys is the first IP provider to offer new “off” and “snooze” power states (L1 sub-states) in PCI Express® controller IP
Ten customer designs have integrated Synopsys’ new PCI Express IP with L1 sub-states into camera, card reader, networking and wireless applications, with multiple product tapeouts
L1 sub-state implementation can reduce PCI Express standby power consumption by approximately 99 percent

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture … Read More → "Synopsys’ DesignWare IP for PCI Express with Support for Low-Power Sub-States Successfully Taped Out in Multiple Designs"

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