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CEVA Reaches Major Shipment Milestone, Surpassing 4 Billion CEVA-powered Chips

MOUNTAIN VIEW, Calif. – October 16, 2012 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has reached a number of key milestones in relation to customer shipments and technology adoption, reaffirming CEVA’s position as the world’s leading DSP licensing company.

Milestone highlights include:

Micron 20nm NAND Flash Powers Skyera’s Highest-Capacity “Skyhawk” Enterprise Solid-State Storage System

SAN JOSE, Calif., 2012-10-16 17:00 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU) today announced another new storage industry milestone—the integration of its 20nm NAND flash storage media into a high-endurance, high-capacity enterprise system. San Jose-based Skyera is using Micron’s 20nm, 128 gigabit (Gb) Read More → "Micron 20nm NAND Flash Powers Skyera’s Highest-Capacity “Skyhawk” Enterprise Solid-State Storage System"

TSMC Selects Cadence Virtuoso and Encounter Platforms for Its 20nm Design Infrastructure, Spanning Custom/Analog, Digital and Mixed-Signal Design

SAN JOSE, CA–(Marketwire – October 16, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has selected Cadence® solutions for its 20-nanometer design infrastructure. The solutions cover the Virtuoso® custom/analog and Read More → "TSMC Selects Cadence Virtuoso and Encounter Platforms for Its 20nm Design Infrastructure, Spanning Custom/Analog, Digital and Mixed-Signal Design"

Microsemi Delivers New Low Power Voice Solutions for Residential Gateways

ALISO VIEJO, Calif.—Oct. 16, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will unveil its fourth generation subscriber line chipset at the Broadband World Forum (BBWF) tradeshow today in Amsterdam. The new ZL880 series features low power, dual-channel wideband foreign exchange service (FXS) voice solutions for broadband residential gateways, cable embedded multimedia terminal adapters (eMTAs) and fiber to the premise (F TTX) applications. Microsemi will showcase the ZL880 series as well as the VeriVoice line test software in stand D45 at the tradeshow.

“Power efficiency, … Read More → "Microsemi Delivers New Low Power Voice Solutions for Residential Gateways"

element14 drives the Raspberry Pi revolution forward with new “Double Memory” 512MB board

LONDON – Oct. 15, 2012 – element14, the first collaborative community and electronics store for design engineers and electronics enthusiasts and a part of global electronics distributor Premier Farnell [LON:PFL], today announced its continued partnership with Raspberry Pi with the launch of a new 512MB board version of the revolutionary, credit-card sized computer. Now with double the RAM, the new higher performance Raspberry Pi 512MB board is suited to multimedia, high-memory and mobile applications. The additional memory is also an enabler … Read More → "element14 drives the Raspberry Pi revolution forward with new “Double Memory” 512MB board"

Cypress Delivers New Version of PSoC Designer™ IDE To Speed and Simplify Embedded Designs

San Jose, Calif., October 12, 2012 –Cypress Semiconductor Corp. (NASDAQ: CY), today introduced PSoC Designer™ 5.3, a new version of its Integrated Design Environment (IDE) for the PSoC® 1 Programmable System-on-Chip architecture. The new version includes over 30 new or enhanced User Modules, which are free “Virtual Chips,” represented by an icon, that are used to integrate multiple ICs and system interfaces into a single PSoC device. Also included in Version 5.3 are multiple new features to make designing with PSoC faster and easier.

Some of the new User Modules in Version 5.3 are a gas-sensing analog front end (AFE), a fan … Read More → "Cypress Delivers New Version of PSoC Designer™ IDE To Speed and Simplify Embedded Designs"

Renesas Electronics America Expands Solutions Ecosystem for Low-Power RL78 MCUs

SANTA CLARA, Calif., October 12, 2012 – Renesas Electronics America Inc. today announced it has expanded its portfolio of solutions for the low-power RL78/G14 microcontroller (MCU) family in order to simplify systems development and decrease time-to-market. Designed to deliver performance and power-efficiency while incorporating advanced on-chip peripherals, the RL78/G14 MCUs are ideal for a number of applications including low-power consumer and wireless systems, household appliances, home healthcare, HVAC equipment and industrial automation systems. With today’s announcement, Renesas offers a new Read More → "Renesas Electronics America Expands Solutions Ecosystem for Low-Power RL78 MCUs"

Fox’s New XpressO TCXOs Provide Custom Frequencies up to 250 MHz with Quick Delivery

Fort Myers, Fla. October 2012 – Fox Electronics, a leading global supplier of frequency control solutions and an IDT company, has enhanced its innovative XpressO line of low jitter configurable oscillators with the XpressO-TC, a new TCXO version with custom frequencies up to 250 MHz.  As w ith all XpressO oscillators, the new TCXOs can be delivered in less than ten working days, a major improvement over the standard lead times of competitive offerings.

Part of the FXTC-HE73 series, the new HCMOS … Read More → "Fox’s New XpressO TCXOs Provide Custom Frequencies up to 250 MHz with Quick Delivery"

ITRI Tapes Out 3D-IC Chip Using Cadence Technology

SAN JOSE, CA–(Marketwire – October 15, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that its full suite of 3D-IC technologies were deployed by Taiwan’s Industrial Technology Research Institute (ITRI) to develop a 3D-IC chip. Working together, engineers from Cadence® and ITRI used the integrated Cadence 3D-IC flow to implement, analyze, and verify the test chip — a wide I/O memory stack with through-silicon vias (TSVs). The 3D-IC approach — in which multiple ICs are stacked … Read More → "ITRI Tapes Out 3D-IC Chip Using Cadence Technology"

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