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Nextreme Offers New Thermoelectric Series for Energy Harvesting

DURHAM, N.C. (November 7, 2012) — Nextreme Thermal Solutions, the leader in micro-scale thermal management and power generation solutions, today announced a new series of thin-film thermoelectric power generators that offer higher power, more robust mechanical design and ease of integration with common sources of thermal energy. The eTEG™ PG8000 Series harvests waste heat from thermal sources, converting it into electricity for a variety of self-powered applications in the wireless sensor, automotive, aerospace, industrial and medical device markets.

The eTEG PG8000 Series includes five new modules that can produce between 2.7mW to 21.6 mW … Read More → "Nextreme Offers New Thermoelectric Series for Energy Harvesting"

Atollic announces Code Time RTOS support into TrueSTUDIO

Jonkoping, Sweden, 6 November 2012 – Atollic® today announced that the Abassi RTOS from Code Time Technologies can be used with their award-winning integrated development environment TrueSTUDIO®. In addition, Atollic have added trial RTOS project code into their online example projects repository, TrueSTORE®, greatly simplifying getting started using the Abassi RTOS.

“In the past few years, microcontrollers have increased in performance at a remarkable pace yet memory and CPU utilization are still at a premium.” comments Magnus Unemyr, Vice President of Sales and Marketing at Atollic. “Code Time Technologies have addressed … Read More → "Atollic announces Code Time RTOS support into TrueSTUDIO"

Lattice To Showcase FPGA-Based Security & Surveillance Solutions At China Security Exop

HILLSBORO, OR  NOVEMBER 7, 2012  Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will demonstrate several new FPGA-based camera designs at the China Security Expo in Beijing, China, from December 3 through December 6.  Several of the camera solutions that will be featured were developed with Lattice partner organizations. The Lattice booth will be in Hall E1 at location Y13-14.  More information about the China Security Expo is available at http://www.securitychina.com.cn/ … Read More → "Lattice To Showcase FPGA-Based Security & Surveillance Solutions At China Security Exop"

Rail-to-Rail 80V Power Monitor Measures Current & Voltage with +/-0.75% Accuracy

MILPITAS, CA – November 7, 2012 – Linear Technology Corporation introduces the LTC2945, a wide range I²C system monitor that monitors the current, voltage and power of any 0V to 80V rail. In many cases, prior power monitoring solutions are limited to 3V to 5V supplies and monitor voltages less than 36V, requiring additional circuitry to monitor higher voltages. The LTC2945 has flexible power supply options, deriving power from a 4V … Read More → "Rail-to-Rail 80V Power Monitor Measures Current & Voltage with +/-0.75% Accuracy"

Altera’s Functional Safety Data Package for Industrial Applications Accelerates Design Time and Reduces Certification Risks

SAN JOSE, Calif., Nov. 7, 2012 /PRNewswire/ — Altera Corporation (Nasdaq: ALTR) today announced the availability of an updated version of its functional safety data package for automotive, industrial, medical and defense applications. Altera’s 2012 functional safety data package includes additional device support and enhanced software support, allowing customers using Cyclone® IV FPGAs to reduce risks and adhere to the latest safety regulations when developing safety-critical designs. The updated functional safety data package accelerates customer’ … Read More → "Altera’s Functional Safety Data Package for Industrial Applications Accelerates Design Time and Reduces Certification Risks"

NANIUM Extends Wafer-Level Packaging (WLP) Offer by Including Fan-In WLP Volume Production On 300mm Wafers

PORTO, Portugal – Nov. 7, 2012 – NANIUM, a leading provider of semiconductor packaging, test and engineering services, today announced that it has extended its offering to include fan-in WLP volume production on 300mm wafers.

NANIUM earlier this year licensed Flip Chip International’s (FCI) Spheron® Plated Cu Redistribution technology to provide solutions for 300mm wafer-level chip scale packaging (WLCSP) using fan-in WLP processes. After completing line setup and qualification for that technology, the company added the capability to manufacture fan-in WLP products, which extends its service portfolio using the latest technology on 300mm wafers.

“The conventional fan-in variant … Read More → "NANIUM Extends Wafer-Level Packaging (WLP) Offer by Including Fan-In WLP Volume Production On 300mm Wafers"

Mentor Graphics New Tessent IJTAG Product Automates IP Test and Debug Integration in Large SoC Designs

WILSONVILLE, Ore., November 6, 2012-Mentor Graphics Corporation (NASDAQ:MENT) today announced its new TessentR IJTAG solution, which allows designers to easily reuse test, monitoring and debugging logic embedded in existing IP blocks. Supporting the IEEE P1687 (IJTAG) standard, the solution automatically retargets test and debug commands and generates an integrated hierarchical control and data network with a single top-level interface for an entire SoC. The solution, which supports any embedded instrumentation compliant to the P1687 standard, can be used where pin count is limited or </ … Read More → "Mentor Graphics New Tessent IJTAG Product Automates IP Test and Debug Integration in Large SoC Designs"

Aldec Boosts VHDL Simulation Performance

Henderson, NV – November 5, 2012 – Aldec, Inc. announced the release of its mixed language advanced verification platform,Riviera-PRO™ 2012.10.  The release delivers numerous stability and performance improvements, support for the latest versions of industry-standard SystemVerilog verification libraries, new language constructs, new debugging tools, and improved interfaces to other industry leading EDA tools. 

Riviera-PRO delivers a 20% VHDL simulation performance gain over previous releases. “We keep developing and delivering not only new productivity features, but also innovative core engine optimizations to boost simulation performance in VHDL and SystemVerilog to support the … Read More → "Aldec Boosts VHDL Simulation Performance"

Agilent Technologies Introduces Electrical Redriver Modeling Solution to Solve Key Challenges in Designing Chip-to-Chip Links

SANTA CLARA, Calif., Nov. 5, 2012 – Agilent Technologies Inc. (NYSE:A) today introduced a redriver modeling solution designed to quickly and accurately solve the challenge posed by signal distortion in multigigabit-per-second systems.

The redriver modeling solution, available in the Advanced Design System 2012 Transient Convolution Element and SystemVue 2012 AMI Modeling Kit, is used to design electrical redrivers into high-speed chip-to-chip digital links.

Before the multigigabit era, chip-to-chip digital signals could propagate across an entire … Read More → "Agilent Technologies Introduces Electrical Redriver Modeling Solution to Solve Key Challenges in Designing Chip-to-Chip Links"

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