News – Page 1927 – EEJournal

Unique 64-thermopile infrared array sensor available from Avnet Abacus enables contactless temperature detection

January 21, 2013

Poing, Germany, 21 January, 2013: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors and a business unit of Avnet Electronics Marketing EMEA, a business region of Avnet, Inc. (NYSE: AVT), has announced the availability of Grid-EYE, a unique new passive infrared array sensor developed by Panasonic Electric Works, the industrial devices division of Panasonic Corporation.

Based on Panasonic’s advanced MEMS technology, Grid-EYE features 64 thermopile elements in an 8 x 8 grid format. The combination of a built-in thermistor and an integrated circuit (IC) enables temperature sensing in a small Surface Mount Technology ( … Read More → "Unique 64-thermopile infrared array sensor available from Avnet Abacus enables contactless temperature detection"

Cadence to Showcase Allegro and Sigrity Technologies “Better Together” at DesignCon 2013

January 21, 2013

SAN JOSE, CA–(Marketwire – January 21, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a global leader in electronic design innovation, will showcase the company’s Allegro® printed circuit board http://www.cadence.com/cadence/ … Read More → "Cadence to Showcase Allegro and Sigrity Technologies “Better Together” at DesignCon 2013"

Linear Dimensions Semiconductor Inc. Jolts MEMS Industry at CES Las Vegas, Introducing its New Line of MEMsiics® Microelectromechanical Device Interface and Driver ICs

January 21, 2013

Las Vegas, NV (PRWEB) January 10, 2013 – Linear Dimensions Semiconductor Inc. today introduced its MEMsiics® line of microelectromechanical drivers and high voltage interface ICs (integrated circuits). MEMsiics® represent the state of the art in low power, high through-put, multi-channel MEMs interface ICs, boasting the tightest accuracies in the industry, coupled with the smallest footprint form factors, lowest channel to channel coupling capacitances and in many cases, integrated high voltage power rail generators. MEMsiics® save space, reduce component count, and save enough power to reduce heat sinking and cooling requirements.

MEMsiics® are … Read More → "Linear Dimensions Semiconductor Inc. Jolts MEMS Industry at CES Las Vegas, Introducing its New Line of MEMsiics® Microelectromechanical Device Interface and Driver ICs"

Freescale Boosts Verification Productivity with Synopsys Verification IP

January 21, 2013

MOUNTAIN VIEW, Calif., Jan. 21, 2013 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced advancements in its longstanding verification collaboration with Freescale® Semiconductor. With a focus on addressing the increasing complexities of system-on-chip (SoC) verification, Freescale teams are leveraging Synopsys’ innovations in next-generation verification IP (VIP), simulation performance, debug technology and methodology development. This collaboration is targeted to achieve better schedule predictability and lower overall verification costs for Freescale’s complex SoCs.

“Over the last few years, our designs have led a very … Read More → "Freescale Boosts Verification Productivity with Synopsys Verification IP"

Agilent Technologies to Demonstrate Newest High-Speed Digital Design and Test Solutions at DesignCon

January 17, 2013

SANTA CLARA, Calif., Jan. 15, 2013 – Agilent Technologies Inc. (NYSE:A) today announced it will demonstrate its high-speed digital design and test solutions at DesignCon, Jan. 28- 31, at the Santa Clara Convention Center (Booth 201).

“DesignCon provides an opportunity for Agilent to share our latest experiences in high-speed digital design solutions and demonstrate a wide range of essential tools … Read More → "Agilent Technologies to Demonstrate Newest High-Speed Digital Design and Test Solutions at DesignCon"

Common Embedded ARM Cortex™ A9 i.MX 6 Platform

January 17, 2013

Laguna Hills, California — January 15, 2013 — Cadia Networks, an innovative global supplier of application specific board level products and systems for a wide range of embedded computing applications, today announced the release of two new products using a common embedded ARM Cortex™ A9 i.MX 6 platform: OPS-5332A and CNS-5332B. Both products are targeted for digital signage applications and provide a complete, seamless embedded platform for customers with a range of performance and features, while allowing for the re-use of customer’s application code in either a standalone system or embedded OPS module without any modifications or recompiling.

Avnet Embedded and Calxeda Showcase ARM-Based Solutions

January 17, 2013

SANTA CLARA, Calif.—January 16, 2013 — Avnet Embedded, a division of Avnet … Read More → "Avnet Embedded and Calxeda Showcase ARM-Based Solutions"

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

January 17, 2013

Leuven (Belgium) – January 17, 2013 – Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.

The initial focus of the collaboration was on developing metrology aimed at detecting voids after temporary wafer bonding, allowing for proper rework of 3D wafers. Temporary wafer (de) … Read More → "PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy"

Tektronix Introduces New 32 Gb/s Multi-Channel Bit Error Rate Testers for 100G Network Design & Test

January 17, 2013

BEAVERTON, Ore., January 17, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced a new series of high-speed pattern generators and error detectors to support optical and serial data communications testing on signals as fast as 32 Gb/s. The new PPG3000 Series Pattern Generators <http://www.tektronix.com/PPG3000> and PED3000 Series Bit Error Detectors <http://www.tektronix.com/PED3000> feature multi-channel pattern generation with channel-specific … Read More → "Tektronix Introduces New 32 Gb/s Multi-Channel Bit Error Rate Testers for 100G Network Design & Test"

TI integrates USB on C2000™ Piccolo™ real-time, floating-point microcontrollers, enabling on-the-go field diagnostics and communications

January 17, 2013

Jan 17, 2013 – HOUSTON, Jan. 17, 2013 /PRNewswire/ — Helping customers develop end products requiring on-site connectivity, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced its newest 32-bit, real-time C2000™ Piccolo™ F2806xU microcontrollers (MCU) with integrated USB connectivity.

In many applications, such as consumer and industrial motor control systems, industrial power systems, telecom and data systems, wind and solar energy generation and general power electronic applications, being able to access diagnostics and make on-the-go changes in the field is critical. … Read More → "TI integrates USB on C2000™ Piccolo™ real-time, floating-point microcontrollers, enabling on-the-go field diagnostics and communications"