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Agilent Technologies Integrates Device Modeling Flow with Shipment of Newest SPICE Model Extraction and Qualification Software

SANTA CLARA, Calif., March 13, 2013 – Agilent Technologies Inc. (NYSE: A) today announced shipment of the latest release of its industry-leading SPICE model extraction tool,Model Builder Program, and SPICE qualification tool, Model Quality Assurance.

MBP and MQA 2013 feature major enhancements designed to enable device modeling engineers to deliver higher-quality models to their customers. Chief among them are a fully integrated data flow across Agilent’s device modeling platform and the ability to establish and enforce standard … Read More → "Agilent Technologies Integrates Device Modeling Flow with Shipment of Newest SPICE Model Extraction and Qualification Software"

Mentor Graphics Empowers 32-bit Microcontroller Development with Connectivity and a Small Footprint Binary RTOS with Nucleus SmartFit

WILSONVILLE, Ore., March 15,  2013— Mentor Graphics Corporation (NASDAQ: MENT) today announced the Nucleus® SmartFit product, a cost-effective, binary version of the Nucleus RTOS (real time operating system) optimized to fit the limited internal memory of 32-bit MCUs. The Nucleus SmartFit product also includes Sourcery™ CodeBench development tools and provides developers with broad connectivity and power consumption options for developing products based on 32-bit microcontrollers (MCUs).

“32-bit MCUs provide an ideal hardware platform for devices that connect themselves to the Internet, such as those in machine-to-machine (M2M) applications or the Internet of Things,” said Scot … Read More → "Mentor Graphics Empowers 32-bit Microcontroller Development with Connectivity and a Small Footprint Binary RTOS with Nucleus SmartFit"

NeoPhotonics Announces New Variable Power Intradyne Coherent Receiver (VICR) for High-Capacity 100G Optical Networks

Anaheim, California – March 15, 2013 – NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of photonic integrated circuit, or PIC, based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced a new 100G Variable Power Intradyne Coherent Receiver (VICR).  The PIC-based VICR integrates a variable optical attenuator (VOA) on the signal path and is designed to increase dynamic range and improve the optical signal to noise ratio (OSNR) for both single channel and multiple coincident signals.  This capability is designed to enable service providers to better manage network capacity in colorless coherent networks.  NeoPhotonics is currently sampling the VICR … Read More → "NeoPhotonics Announces New Variable Power Intradyne Coherent Receiver (VICR) for High-Capacity 100G Optical Networks"

API Technologies to Showcase the ION™ SA5600-SAL: Avaya® SAL Edition at Enterprise Connect 2013

ORLANDO, FL – March 15, 2013 – API Technologies Corp. (NASDAQ:ATNY) (“API” or the “Company”), a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announced today that it will showcase its full line of enterprise security products including the ION™ SA5600-SAL: Avaya® SAL Edition, at the Enterprise Connect Conference and Exposition (Booth #331) to be held March 18-21, 2013 in Orlando, FL.

“The ION SA5600-SAL is a plug and play Secure Access Link gateway security appliance with a full standalone SAL Gateway preinstalled. It provides IP and secure dial-up connectivity to Avaya and heritage … Read More → "API Technologies to Showcase the ION™ SA5600-SAL: Avaya® SAL Edition at Enterprise Connect 2013"

Silicon Designs Announces Global Market Launch of Low-Cost USB-Powered Data Acquisition System with FFT Analysis and Display

March 14, 2013 – Kirkland, Washington, USA – Silicon Designs, Inc., (SDI) a global industry leader in the design and manufacture of highly rugged industrial-grade MEMS capacitive accelerometer chips and modules, today announced the global market launch of its Model 3330 G-Logger, a low-cost, USB-powered portable data acquisition system with the same powerful FFT analysis and display capabilities typically found in much more expensive systems.

The three-channel Model 3330 is designed to optimize the low-noise performance characteristics of all Silicon Designs single and triaxial MEMS variable capacitance accelerometer modules with analog output … Read More → "Silicon Designs Announces Global Market Launch of Low-Cost USB-Powered Data Acquisition System with FFT Analysis and Display"

eSOL’s FAT File System is selected for Wii U

Tokyo, Japan. March 14, 2013 – eSOL, a leading developer of real-time embedded software solutions, announced today that eSOL’s PrFILE2 FAT file system is used in Nintendo’s Wii U(TM) game console. PrFILE2 provides file operation functions including data reading, and writing for the SD memory card attached to the Wii U.

The PrFILE2 FAT file system is part of eSOL’s eCROS real-time OS-based software platform. eCROS consists of the eT-Kernel real-time OS, the eBinder integrated development environment, middleware software including PrFILE2, USB stacks, network protocols and GUI, and professional support services. PrFILE2 offers … Read More → "eSOL’s FAT File System is selected for Wii U"

Microprecision Electronics SA announces 120/240 VAC Panel Mount LEDs for Power Indication

Vouvry, Switzerland — March 14, 2013 — Microprecision Electronics  introduces bipolar LEDs in its range of panel mount LED’s in varied housing styles for front or rear panel mounting in response to international demand. The pre-wired assembly of a red, green or yellow bipolar LED and a resistor will work directly off a 120 VAC or 240 VAC line as a LED power indicator or as a drop-in replacement for neon indicators. 

Front mount housing options include the 100/600 series domed cylindrical and flush plastic lenses, or the rugged CR/BR/CC series screw on metal housings for 0.312” (7.92 mm) holes. Rear mount … Read More → "Microprecision Electronics SA announces 120/240 VAC Panel Mount LEDs for Power Indication"

Xalyo Systems Announces XS-AMC5, a Highly Integrated Multi-Rate Multi-Protocol PHY AMC

Geneva, Switzerland – March 14, 2013 – Xalyo Systems today announces XS-AMC5, a highly integrated Multi-Rate Multi-Protocol PHY Advanced Mezzanine Card (AMC) supporting efficient and flexible Optical Transport Network (ITU-T G.709 OTN) switching, mapping and multiplexing at ODU0/ODUflex granularity.

“XS-AMC5 is the industry’s first Advanced Mezzanine Card providing OTN connectivity” said Andre Wiesel, founder and president of Xalyo Systems. “Its high level of integration will provide our customers with a compact, power savvy and cost effective OTN solution.”

XS-AMC5 provides one high-speed SFP+ network interface supporting OTU2 or OC-192/STM-64 and three lower-speed SFP client interfaces supporting … Read More → "Xalyo Systems Announces XS-AMC5, a Highly Integrated Multi-Rate Multi-Protocol PHY AMC"

TEWS TECHNOLOGIES Introduces 32 Channel M-LVDS FMC Mezzanine Module

TEWS today announced the TFMC684 an FMC (FPGA Mezzanine Card) Mezzanine Module complying with the ANSI/VITA 57.1 standard used to add a 32bit M-LVDS (Multipoint Low Voltage Differential Signaling) I/O Interface to FMC Carrier Cards. Designed for high-speed data acquisition and generation, the TFMC684 is ideal for applications in process control, transportation, COTS, test and simulation.

The Low Pin Count FMC Connector provides 32 independent control signals which configure the direction of each M-LVDS Line Driver/Receiver.

The 32 data lines are routed as single-ended traces from the FMC Connector to the M-LVDS Transceivers … Read More → "TEWS TECHNOLOGIES Introduces 32 Channel M-LVDS FMC Mezzanine Module"

Nanoplas Announces Revolutionary Dry-Etching Technology Enabling Unlimited Selectivity at 20nm Node and Beyond

ST-ÉGRÈVE, France – March 14, 2013 – Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.

Nanoplas’s new Atomic-Layer Downstream Etching (ALDE®) processing allows etching rate and selectivity to be controlled independently, which provides virtually unlimited selectivity. Based on the company’s new inductively coupled plasma (ICP) source, ALDE® features atomic-layer control at wafer-surface level. 

“Nanoplas’s Atomic-Layer Downstream Etching technology enables a new class of plasma-based … Read More → "Nanoplas Announces Revolutionary Dry-Etching Technology Enabling Unlimited Selectivity at 20nm Node and Beyond"

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