News – Page 1894 – EEJournal

250mA Wide VIN Range Buck-Boost Charge Pump Offers Low Conducted and Radiated Noise

March 19, 2013

MILPITAS, CA – March 19, 2013 – Linear Technology Corporation announces the LTC3245, a versatile 250mA high voltage buck-boost charge pump. The LTC3245 uses switched capacitor fractional conversion to maintain regulation over a wide range of input voltage from 2.7V to 38V and produces a regulated output of 3.3V, 5V or adjustable (2.5V to 5V). Internal circuitry automatically selects the conversion ratio (2:1, 1:1 or 1:2) to optimize efficiency as input voltage and load conditions vary. Low … Read More → "250mA Wide VIN Range Buck-Boost Charge Pump Offers Low Conducted and Radiated Noise"

STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP

March 19, 2013

Geneva, Switzerland, and Grenoble, France, March 19, 2013 — STMicroelectronics (NYSE:STM) and CMP (Circuits Multi Projets®) today announced that ST’s THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units^[1], is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP. ST is releasing this process technology to third parties as a prototyping and foundry service to encourage new developments in motion-sensing … Read More → "STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP"

Accellera Systems Initiative completes SystemC AMS 2.0 standard for mixed-signal design of electronic systems

March 19, 2013

GRENOBLE, France, March 19, 2013 (at the Design Automation and Test in Europe Conference) – Accellera Systems Initiative, an independent non-profit organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards for design and verification, today announces completion of the SystemC® Analog /Mixed-Signal (AMS) 2.0 extensions. SystemC AMS 2.0 is an industry-driven mixed-signal standard for electronic system-level design. The SystemC AMS 2.0 language reference manual (LRM) is available for download under SystemC open-source license at www.accellera.org.

The AMS 2.0 … Read More → "Accellera Systems Initiative completes SystemC AMS 2.0 standard for mixed-signal design of electronic systems"

Micronas Standardizes on Synopsys’ Design and Verification Solutions for Automotive Designs

March 19, 2013

MOUNTAIN VIEW, Calif., March 19, 2013 /PRNewswire/ — Micronas, (SIX Swiss Exchange: MASN), known and recognized in the automotive and industrial business as a global partner for intelligent, sensor-based system solutions, and Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Micronas has standardized on Synopsys’ custom and digital solutions for the design and verification of semiconductors used in automotive and industrial applications. The solution includes Galaxy Custom Designer^® for custom IC design, HSPICE^® for circuit simulation, StarRC^™ for gate-level and … Read More → "Micronas Standardizes on Synopsys’ Design and Verification Solutions for Automotive Designs"

Xilinx Stays a Generation Ahead in All Programmable SoCs for Smarter Wireless, Broadcast, Medical and Military Systems

March 19, 2013

SAN JOSE, Calif., March 19, 2013 – Xilinx, Inc. (NASDAQ: XLNX) today unveiled its new Zynq™-7100 All Programmable SoCs, the latest addition to its Zynq-7000 family, which integrates the industry’s highest performance digital signal processing (DSP) to meet the most demanding programmable systems integration requirements of next-generation ‘smart’ wireless, broadcast, medical and military applications.

The combination of industry-leading signal processing performance and ARM® processor-based analytics and control make the Zynq-7100 All Programmable SoC the industry’s most highly integrated … Read More → "Xilinx Stays a Generation Ahead in All Programmable SoCs for Smarter Wireless, Broadcast, Medical and Military Systems"

NeoPhotonics Announces 100G CFP2 Transceivers for Datacom and Telecom Applications

March 19, 2013

Anaheim, California – March 19, 2013 – NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of photonic integrated circuits, or PIC, based modules and subsystems for bandwidth-intensive, high speed communications networks, announces the introduction of two new 100G CFP2 transceiver modules. The new 100G CFP2 modules include both the popular 10×10 MSA transceiver based on the “10×10” PIC architecture developed by NeoPhotonics and the “4×25” 100GBASE-LR4 transceiver. The CFP2 form factor is a hot pluggable module that is designed to offer lower power and smaller size compared to current generation CFP transceivers and to enable doubling of the … Read More → "NeoPhotonics Announces 100G CFP2 Transceivers for Datacom and Telecom Applications"

Sigma Launches Z-Wave® Next Gen Product Portfolio

March 19, 2013

MILPITAS, Calif. — March 19, 2013 — Sigma Designs® (Nasdaq: SIGM), a leading provider of System-on-Chip (SoC) solutions for home entertainment, connectivity and converging multimedia delivery, today announced its “Z-Wave Next Gen” product portfolio. Designed for Original Equipment Manufacturers (OEM) and service providers interested in developing home control products and services, the new platform enables Sigma’s partners to bring new products to market substantially faster at lower cost with customizable reference designs and with new hardware featuring higher performance and more memory. The introduction of this next-generation portfolio builds on Z-Wave’s growth in the home control market with over 700 interoperable devices, … Read More → "Sigma Launches Z-Wave® Next Gen Product Portfolio"

TI introduces industry’s first reconfigurable DC arc detect reference solution

March 19, 2013

LONG BEACH, Calif., (March 19, 2013) – Today at the Applied Power Electronics Conference (APEC), Texas Instruments Incorporated (TI) (NASDAQ: TXN) introduced the industry’s first fully programmable DC arc detect reference solution. The RD-195 makes it faster and easier for designers to address a growing need to safeguard high-power DC systems, such as automobile and aircraft battery management systems, industrial factory equipment, and photovoltaic units, against … Read More → "TI introduces industry’s first reconfigurable DC arc detect reference solution"

Real Intent to Exhibit at SNUG Designer Community Expo in Silicon Valley

March 18, 2013

SUNNYVALE, CALIF. – (MARKET WIRE) Mar. 18, 2013 –

Who:

Real Intent, whose advanced verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness

What:

Will exhibit its Ascent products for early functional verification prior to synthesis, and its Meridian products for advanced sign-off verification not possible … Read More → "Real Intent to Exhibit at SNUG Designer Community Expo in Silicon Valley"

NXP Launches Industry’s First Dual-Modem AISG Transceiver for Wireless Base Stations

March 18, 2013

Eindhoven, Netherlands, March 18, 2013 – NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices (ALDs) such as tower-mounted amplifiers (TMAs) and remote electric tilt (RET) antennas. The new family includes the industry’s first fully integrated dual-modem AISG transceivers, as well as the first AISG system solution to integrate an ARM® Cortex™-M3 processor alongside two AISG modems. DSP-based and programmable, NXP’s AISG transceivers offer significant flexibility, making it easy to … Read More → "NXP Launches Industry’s First Dual-Modem AISG Transceiver for Wireless Base Stations"

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