industry news archive
Subscribe Now

Imec demonstrates low power beamforming transceiver chipset for 60GHz multi-Gbit wireless communication

San Francisco (USA) – February 19, 2013 – Imec, in collaboration with Panasonic Corporation (Japan), has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60GHz radio transceiver chipset with low power consumption, that delivers high data rates over short distances. Imec drastically boosted the link budget of the system by introducing beamforming  into the radio architecture. This multi-Gbit 60GHz chipset paves the way toward small size, low-power, low-cost, high-data rate solutions for battery-operated consumer devices, such as smart phones and tablets. 

“Exchange of gigabytes of data between mobile devices requires a viable 60GHz technology that balances cost, size and … Read More → "Imec demonstrates low power beamforming transceiver chipset for 60GHz multi-Gbit wireless communication"

CEVA Introduces MUST™ Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework

MOUNTAIN VIEW, Calif., Feb. 19, 2013 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced a suite of advanced  processor and multi-core technologies to further enhance the CEVA-XC DSP architecture framework for high performance wireless applications including wireless terminals, small cells, access points, metro and macro base-stations. Among the new enhancements are: comprehensive multi-core features, high-throughput vector floating-point processing and a complete set of co-processor engines offering power-efficient hardware-software partitioning. … Read More → "CEVA Introduces MUST™ Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework"

Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications

SAN JOSE, Calif., Feb. 20, 2013 – Xilinx, Inc. (NASDAQ: XLNX) announced today the availability of its new Gigabit class 1024QAM point-to-point (PtP) microwave modem IP (intellectual property) for backhaul applications.  Designed with significant input from Tier 1 OEMs and powered by Xilinx’s 28nm All Programmable devices, this modem solution represents a tremendous opportunity for wireless OEMs to incorporate differentiated, flexible and programmable capabilities in their cost-sensitive and performance-driven microwave backhaul platforms.

Mobile backhaul is a critical CAPEX focus area for carriers worldwide as they upgrade their networks to support the hyper growth in mobile … Read More → "Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications"

Silicon Labs and Sigfox Collaborate To Unleash The Potential of The Internet Of Things

AUSTIN, Texas, and TOULOUSE, France – Feb. 20, 2013 – Silicon Labs (NASDAQ:SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, and SIGFOX, the first operator of a cellular network fully dedicated to machine-to-machine (M2M) and Internet of Things (IoT) communications, today announced a first-of-a-kind collaboration for the rapidly emerging IoT market.

The combination of Silicon Labs’ EZRadioPRO® wireless transceivers and SIGFOX’s unique Ultra-Narrowband (UNB) technology enables long-range wireless Internet connectivity solutions for a wide array of devices such as smart meters, patient monitors, security devices, street lights and environmental sensors. EZRadioPRO transceivers offer industry-leading wireless … Read More → "Silicon Labs and Sigfox Collaborate To Unleash The Potential of The Internet Of Things"

TI spins motors in minutes with sensorless, brushless DC motor drivers

DALLAS (Feb. 20, 2013) – Texas Instruments Incorporated (TI) (NYSE:NASDAQ) today introduced two 3-phase, brushless DC (BLDC) motor drivers that allow designers to spin motors in minutes rather than months. Traditional BLDC motor designs require five to 10 components, along with firmware. The sensorless 5-V, 680-mA DRV10866 and the 12-V, 1.5-A DRV11873 cuts this component count to one with no firmware required, significantly reducing board space and system costs, while helping customers speed their time to market. The devices also provide the lowest operating voltage and standby current to reduce power consumption by up to 75 percent. For more information or to place … Read More → "TI spins motors in minutes with sensorless, brushless DC motor drivers"

Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013

February 20, 2013 – Ottawa, Canada: Elliptic Technologies, a leading provider of complete embedded security and content protection solutions, today announced that the company will exhibit at the RSA Conference in San Francisco, February 25 – March 1, at booth #135 Elliptic’s content protection solutions, featuring the tVaultTM family of products, which integrate seamlessly with ARM-based platforms and Global Platform compliant Trusted Execution Environments (TEE).  These solutions are designed … Read More → "Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013"

CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform

MOUNTAIN VIEW, Calif., – February 19, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Sensory, Inc., the leader in speech technologies for consumer products, today announced that the companies have partnered to offer an advanced voice recognition solution based on the industry-leading CEVA-TeakLite-4 DSP and Sensory’s TrulyHandsfree™ always on voice activation technology. The solution includes Sensory’s innovative Low Power Speech Detector technology, which dramatically reduces power consumption … Read More → "CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform"

Imec Presents Low-Power Chip for Intra-Cardiac Ventricular Fibrillation Detection

San Francisco, USA – February 19, 2013 – Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus. An important step toward next-generation Cardiac Resynchronization Therapy solutions, the new chip delivers innovative signal processing functionalities and consumes only 20µW when all channels are active, enabling the miniaturization of implantable devices.

Robust and accurate Heart Rate (HR) monitoring of the right and left ventricles and right atrium is essential for implantable devices for Cardiac Resynchronization Therapy. And accurate motion … Read More → "Imec Presents Low-Power Chip for Intra-Cardiac Ventricular Fibrillation Detection"

Wind River Debuts Patent-Pending Packet Acceleration Technology and Real-Time Traffic Analysis for Intelligent Networks

ALAMEDA, Calif. – Feb. 19, 2013 – Wind River®, a world leader in embedded and mobile software, has introduced patent-pending packet acceleration technology and added a data plane software engine for network traffic flow analysis to the Wind River Intelligent Network Platform. The software platform is ideal for designing 4G/LTE wireless applications, firewall solutions and equipment requiring scalable packet analysis for the imminent wave of intelligent networks.

Wind River Intelligent Socket Layer, a new packet acceleration technology added to the Wind River Application Acceleration Engine, assists in scenarios such as the … Read More → "Wind River Debuts Patent-Pending Packet Acceleration Technology and Real-Time Traffic Analysis for Intelligent Networks"

EMA Releases TimingDesigner 9.3 with New Documentation Graphics and a Multi-Diagram Interface

Rochester, NY (February 19, 2013) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced a new release of its static timing analysis tool, TimingDesigner 9.3, making the customization of diagrams and documentation easier and users more productive.

 “With a fresh, redesigned user interface and improved controls, TimingDesigner 9.3 is the most intuitive timing analysis tool on the market,” said Manny Marcano, president and CEO of EMA. “We’ve made several useful additions to diagram and spreadsheet styling, as well as enhancements … Read More → "EMA Releases TimingDesigner 9.3 with New Documentation Graphics and a Multi-Diagram Interface"

featured blogs
Mar 27, 2026
I've decided to learn to speak without moving my lips and (hopefully) without losing my dignity....