News – Page 1886 – EEJournal

MIPS Technologies and Ingenic Semiconductor Announce Availability of World’s First Android™ ‘Ice Cream Sandwich’ Tablet

December 5, 2011

SUNNYVALE, Calif. – December 5, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, and Ingenic Semiconductor, a leading China-based CPU provider for mobile multimedia applications, today announced worldwide availability of the world’s first tablet based on Android ™ 4.0, known as ‘Ice Cream Sandwich’, that is retailing for less than $100 (U.S). The tablet is powered by Ingenic’s JZ4770 mobile applications processor, which leverages a MIPS-Based™ XBurst™ CPU running at 1GHz.

According to Andy Rubin, senior … Read More → "MIPS Technologies and Ingenic Semiconductor Announce Availability of World’s First Android™ ‘Ice Cream Sandwich’ Tablet"

New I/O Extension Module Adds Analog and Digital I/O Processing Capabilities to FPGA Computing Boards

December 5, 2011

WIXOM, Mich., Dec. 5, 2011 /PRNewswire/ — The new AXM-75 is a multi-function I/O extension module that adds A/D, D/A, and digital I/O signal processing functions to a Read More → "New I/O Extension Module Adds Analog and Digital I/O Processing Capabilities to FPGA Computing Boards"

KLA-Tencor Introduces Additions To Sensarray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions

December 5, 2011

MILPITAS, Calif., December 5, 2011—KLA-Tencor Corporation (NASDAQ: KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related industries, today introduced new additions to its SensArray portfolio of advanced wireless temperature monitoring wafers. The portfolio implements time-based, in-situ temperature monitoring to capture the effect of the process environment on production wafers, which helps integrated circuit (IC) manufacturers improve their capital equipment ROI.

Developed through collaboration with leading IC manufacturers and original equipment manufacturers (OEMs), the EtchTemp™-SE (ET-SE), … Read More → "KLA-Tencor Introduces Additions To Sensarray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions"

Cymer Reduces Chipmakers’ Operating Costs With the Next Generation Gas Lifetime eXtension – iGLX™

December 2, 2011

SAN DIEGO, Nov. 28, 2011 /PRNewswire/ — Cymer, Inc. (Nasdaq: CYMI), the world’s leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its third-generation Gas Lifetime eXtension (iGLX™) control system for Argon Fluoride (ArF) immersion light sources. An exclusive offering for chipmakers with OnPulse®, the value-added feature is an improvement over previous generations of gas management … Read More → "Cymer Reduces Chipmakers’ Operating Costs With the Next Generation Gas Lifetime eXtension – iGLX™"

Thinfilm and Polyera Partner to Bring Printed CMOS Memory to Market

December 2, 2011

OSLO, November 30 – Thin Film Electronics ASA (“Thinfilm”) today announced a partnership with Polyera – a developer and supplier of high-performance functional materials for the flexible and printed electronics industry. Thinfilm and Polyera will jointly develop organic semiconductor materials for high-volume printing of Thinfilm Addressable Memory^TM and printed integrated systems. The collaboration brings printed integrated systems, such as smart sensor tags, closer to commercial availability.

Magma’s Latest Version of FineSim Pro Delivers 3X Faster Runtime, Allowing SPICE-Accurate Simulation of Very Large Analog/Mixed-Signal Designs

December 2, 2011

SAN JOSE, Calif., Nov. 30, 2011 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced the availability of a new version of the FineSim™ Pro full-chip circuit-level simulation product that delivers 3X faster runtime than previous versions while continuing to deliver SPICE-accurate results. As an example, FineSim Pro was able to simulate a large post-layout design containing more than 75K MOS devices and more than 2.9 million parasitic resistors and capacitors in a little over an hour. With this latest version, chip designers can better address the growing complexity of verification and increasing … Read More → "Magma’s Latest Version of FineSim Pro Delivers 3X Faster Runtime, Allowing SPICE-Accurate Simulation of Very Large Analog/Mixed-Signal Designs"

LPRS launch the IQRF Wireless Design challenge – Total prize money of $10,000 across all categories

December 2, 2011

LPRS, Europe’s leading supplier of short-range radio devices, announces the launch of the IQRF wireless design challenge. Running from 1st December 2011 to 31st March 2012 the challenge is open to all RF designers to create a new and innovative wireless communication or control solution based on the simple to use IQFR wireless mesh components with a total of $10,000 to be awarded to winning designs across all categories.

Registration is open to anyone who designs an application based on the IQRF platform. To register for the competition visit … Read More → "LPRS launch the IQRF Wireless Design challenge – Total prize money of $10,000 across all categories"

Renesas Electronics Introduces Compact Lithium-ion Battery Charging Control IC Supporting USB Charging

December 2, 2011

Dusseldorf, November 30, 2011 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced a charging control integrated circuit (IC), the R2A20055NS, that achieves further miniaturization and safe charging control for single-cell lithium-ion batteries used in portable devices.

Lithium-ion batteries are used in a wide range of portable equipment, from cell phones to digital still cameras, media players, personal navigation devices and tablet PCs. Lithium-ion batteries have a high energy density and can contribute to equipment miniaturization. At the same time, however, they … Read More → "Renesas Electronics Introduces Compact Lithium-ion Battery Charging Control IC Supporting USB Charging"

Amplicon launch new division – Engineering Services

December 2, 2011

Brighton, UK, 30^th November 2011 – Amplicon has announced the introduction of a new division, Engineering Services. This new venture, as well as creating new employment opportunities, is to provide the market place with a trusted partner who can be viewed as an extension of the customers own team creating value that can be delivered straight to the bottom line.

Whilst Amplicon is already renowned for supplying high quality complex systems, the new Amplicon Engineering Services division combines the best engineering practice over a range of disciplines such as mechanical, electrical and electronic engineering … Read More → "Amplicon launch new division – Engineering Services"

SpringSoft Targets Chip Finishing Applications With New Laker Blitz

December 2, 2011

HSINCHU, Taiwan, November 29, 2011 – SpringSoft, Inc., a global supplier of specialized IC design software, today announced immediate availability of the Laker Blitz chip-level layout editor, a new software product targeting chip finishing applications and the latest addition to its popular family of Laker custom IC design and layout automation solutions. The Laker Blitz product enables high-speed viewing and editing of chip-level layouts to streamline tapeout-to-manufacturing operations. It is ideally suited for designs with massive data sets, such as advanced-node system-on-chip (SoC) implementations and large memory chips that are widely used in consumer& … Read More → "SpringSoft Targets Chip Finishing Applications With New Laker Blitz"

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