News – Page 1872 – EEJournal

Accellera Systems Initiative Launches Working Group to Standardize Interoperability of Multiple Language Verification Environments and Components

April 2, 2013

NAPA, Calif., April 3, 2013– Accellera Systems Initiative (Accellera), an independent non-profit organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards for design and verification, today announces the formation of a new Multi-language Working Group (MLWG). The mission of the MLWG is to create a standard and functional reference for interoperability of multi-language verification environments and components. Accellera is calling for participation in the newly formed group. Accellera members and the industry at large are invited to join the … Read More → "Accellera Systems Initiative Launches Working Group to Standardize Interoperability of Multiple Language Verification Environments and Components"

FMEA Compliant, 45V LDO Features 3µA IQ

April 2, 2013

MILPITAS, CA – April 2, 2013 – Linear Technology Corporation announces the LT3007, the latest member in a family of high voltage, micropower, robust PNP-based LDOs, featuring an ultralow 3µA quiescent current. The LT3007’s high input voltage capability, spanning 2.0V to 45V with an adjustable output voltage ranging from 0.6V to 44.5V, enables operation in a wide variety of application spaces. The LT3007’s pinout is FMEA (Failure Mode Effects Analysis) compliant – the output stays at or … Read More → "FMEA Compliant, 45V LDO Features 3µA IQ"

Real Time Logic Secures ASIC-Powered Devices as OEMs Gear Up for High-Volume M2M Market

April 2, 2013

Monarch Beach, CA, April 2, 2013 ? Real Time Logic, device web server and security specialist, now supports TLS 1.2 with its improved security and encryption in the latest version ofSharkSSL, a compact, fast cryptographic engine that delivers high-performance security. With this release, SharkSSL Version 2.5 extends its secure connectivity for resource-constrained, small-footprint processors to low-cost, high-volume ASIC-powered M2M devices commonly used in large-scale networks for municipal utility … Read More → "Real Time Logic Secures ASIC-Powered Devices as OEMs Gear Up for High-Volume M2M Market"

Sidense 1T-OTP NVM Qualified for 150 Degrees C Automotive High-Reliability Requirements on TSMC’s BCD Process

April 2, 2013

Ottawa, Canada – (April 1, 2013) – Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, announced today that the Company’s 1T-OTP macros for TSMC’s 180nm BCD 1.8/5V/HV and G 1.8/5V processes have met all of TSMC’s IP9000 Assessment program requirements. Sidense OTP macros are fully qualified for -40ºC to 150°C read and field-programmable operations to support applications such as automotive electronics that require reliable operation and long-life data retention in high-temperature environments.

Sidense has already licensed its Automotive Grade 1T-OTP macros to many top fabless semiconductor … Read More → "Sidense 1T-OTP NVM Qualified for 150 Degrees C Automotive High-Reliability Requirements on TSMC’s BCD Process"

ProPlus Design Solutions Unveils Next-Generation Pure SPICE Simulator for Giga-Scale Simulations

April 2, 2013

SAN JOSE, CALIF. –– April 2, 2013 –– ProPlus Design Solutions, Inc. (www.proplussolutions.com), the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications, today launched NanoSpice™, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation.

In announcing NanoSpice, ProPlus unveiled an innovative licensing model with simplified and practical control for parallelization, making it a cost-effective and … Read More → "ProPlus Design Solutions Unveils Next-Generation Pure SPICE Simulator for Giga-Scale Simulations"

6WIND Announces Virtual Switch Acceleration Software Providing 10x Performance Improvement Over Standard Open vSwitch

April 2, 2013

PARIS, April 2, 2013 — 6WIND, the gold standard for data plane processing in software-defined networks, today announced extensions to its 6WINDGate™ networking software that delivers a 10x performance improvement for virtual switches. Targeted for use in cloud and telecom data centers, these new capabilities address critical scalability challenges faced by service providers. 6WIND will demonstrate this solution, in partnership with Big Switch Networks and Ixia, at the Open Networking Summit in Santa Clara, CA from April 15^th through 17^th.

High-performance virtual switches are critical to supporting the increasing number of virtual machines used … Read More → "6WIND Announces Virtual Switch Acceleration Software Providing 10x Performance Improvement Over Standard Open vSwitch"

Qseven Starter Kit with AMD Embedded G-Series APU

April 2, 2013

Stutensee, Germany – MSC Vertriebs GmbH is announcing the availability of a new Qseven Starter Kit based on MSC’s Qseven modules featuring the AMD Embedded G-Series APU (Accelerated Processing Units). The MSC Q7-SK-A50M-EP4 Starter Kit consists of MSC’s 3.5” Qseven baseboard Q7-MB-EP4 with suitable heatspreader and heatsink and an integrated power supply with cable kit. The kit comes with a ready-to-run Linux installation in Flash Disk to enable an out-of-the-box functional experience. Optionally, a TFT kit can be ordered which provides for a 12.1” LCD panel with XGA resolution (1024 x 768), the appropriate cable kit for operation off … Read More → "Qseven Starter Kit with AMD Embedded G-Series APU"

ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC’s 16nm FinFET Technology

April 2, 2013

HSINCHU, Taiwan and CAMBRIDGE, England, April 2, 2013 /PRNewswire/ — ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARM® Cortex™-A57 processor on FinFET process technology. The Cortex-A57 processor is ARM’s highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on … Read More → "ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC’s 16nm FinFET Technology"

OpenMP Consortium Announces 2013 IWOMP Workshop, Sept 15-17 in Canberra, Australia

April 2, 2013

Champaign, Illinois – April 2, 2013 – The OpenMP Consortium announces the ninth International Workshop on OpenMP (IWOMP), which is the premier forum present and discuss issues, trends, recent research ideas and results related to parallel programming with OpenMP. The international workshop affords an opportunity for OpenMP users as well as developers to come together for discussions and sharing new ideas and information on this topic.

IWOMP 2013 will be a three-day event. … Read More → "OpenMP Consortium Announces 2013 IWOMP Workshop, Sept 15-17 in Canberra, Australia"

TI’s advanced haptic driver makes adding tactile feedback to consumer and industrial products easy

April 2, 2013

DALLAS (April 2, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a haptic driver that makes it easy to add realistic tactile feedback effects to consumer and industrial products, such as smartphones, tablets, ebooks, refrigerators, microwave ovens and washing machines. The DRV2605 is the only eccentric rotating mass actuator (ERM) and linear resonant actuator (LRA) haptic driver pre-loaded with a library of 123 distinct haptic … Read More → "TI’s advanced haptic driver makes adding tactile feedback to consumer and industrial products easy"