Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates Newest 28nm 7 Series FPGAs at DesignCon 2012
SAN JOSE, Calif., Jan. 26, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at DesignCon 2012 in Santa Clara, from January 30 – Feburary 2, at the Santa Clara Convention Center, Booth #732. Xilinx Corporate Vice President, FPGA Development and Silicon Technology, Liam Madden, will jumpstart Xilinx’s activities by discussing the benefits and drawbacks of 3D IC standards in the Why Do We Need 3D Design Standards? panel. Xilinx industry experts will also present papers on Stacked Silicon interposer technology and the design benefits of using the Zynq™-7000 Extensible Processing Platform (EPP). Throughout the week, Xilinx … Read More → "Xilinx Discusses Stacked Silicon Interconnect Technologies and Demonstrates Newest 28nm 7 Series FPGAs at DesignCon 2012"