industry news archive
Subscribe Now

Complete Development Tools Platform Further Simplifies MCU Design Process

DESIGN WEST, San Jose, CA, April 23, 2013 – Atmel Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced it has further simplified the MCU design process with the launch of its integrated development tools platform, a complete hardware and software platform specifically designed to support Atmel® MCUs and its recently shipping ARM® Cortex™-M4-based SAM4L family.

As software design continues to become more complex in today’s embedded hardware designs, and is increasingly used to differentiate end-customer products, complete solutions that provide designers with all the necessary tools and … Read More → "Complete Development Tools Platform Further Simplifies MCU Design Process"

congatec Presents First x86 Quad-Core SOC Type 6 COM Express Compact Module

DESIGN West, San Jose, California, April 23rd, 2013 * * *  congatec, a leading manufacturer of embedded computer modules, extends its COM Express product range with processors from the AMD Embedded G-Series SOC (System-On-Chip) family. This single-chip solution is based on AMD technology and integrates the next-generation computing power of the “Jaguar” based processor and AMD Radeon™ graphics cores in a compact package.

Users benefit from outstanding multimedia performance, an excellent performance-per-watt ratio and flexible task allocation on the CPU and GPU. Thanks to these features, the new conga-TCG module is an ideal solution for cost-sensitive visualization and … Read More → "congatec Presents First x86 Quad-Core SOC Type 6 COM Express Compact Module"

Jumpstart and explore sensor fusion applications with new Sensor Hub BoosterPack from Texas Instruments

San Jose, CA (April 23, 2013) – Expanding its low-cost microcontroller (MCU) development ecosystem with sensor fusion technology, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the Sensor Hub BoosterPack for the Tiva™ C Series TM4C123G LaunchPad at DESIGN West 2013. This new Sensor Hub BoosterPack (BOOSTXL-SENSHUB) is a cost-effective, plug-in daughter card that allows ARM® Cortex™-M4 MCU developers to create products with up to seven types of motion and environmental sensing capabilities. This easy-to-use BoosterPack and accompanying Read More → "Jumpstart and explore sensor fusion applications with new Sensor Hub BoosterPack from Texas Instruments"

QuickLogic’s VEE-Pico Catalog CSSP

  • Catalog CSSP provides system designers with “plug-and-play” solution
  • Increases projector viewability without increasing power consumption
  • Based on field-proven, mass production technology

Sunnyvale, CA – April 23, 2013 – QuickLogic Corporation (NASDAQ: QUIK), the innovator in low power Customer Specific Standard Products (CSSPs), announced today that its VEE-Pico Catalog CSSP gives system designers of embedded, accessory and stand-alone pico projectors a quick and easy way to increase the viewability of their projectors without increasing the power consumption of their handheld devices.  This is done … Read More → "QuickLogic’s VEE-Pico Catalog CSSP"

New EnOcean software opens door to world of energy harvesting wireless technology

With EnOcean Link, EnOcean has launched the first middleware for energy harvesting wireless technology. OEMs can now integrate EnOcean technology easier and faster into a wide range of applications and systems, such as those in smart homes. The software provides a universal interface for wireless communication and automatically interprets information from EnOcean telegrams. As a result, sensor data such as moisture or temperature is automatically arranged so that different devices, servers and … Read More → "New EnOcean software opens door to world of energy harvesting wireless technology"

Small in size, big on power: New microbatteries a boost for electronics

CHAMPAIGN, Ill. — Though they be but little, they are fierce. The most powerful batteries on the planet are only a few millimeters in size, yet they pack such a punch that a driver could use a cellphone powered by these batteries to jump-start a dead car battery – and then recharge the phone in the blink of an eye.

Developed by researchers at the University of Illinois at Urbana-Champaign, the new microbatteries out-power even the best supercapacitors and could drive new applications in radio communications and compact electronics.

Led by Read More → "Small in size, big on power: New microbatteries a boost for electronics"

Microchip Expands Embedded Wireless Portfolio With New Bluetooth®, Wi-Fi® and ZigBee® Products

CHANDLER, Ariz., April 22, 2013 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced a major expansion of its embedded-wireless portfolio from the DESIGN West/Embedded Systems Conference in San Jose.  The Bluetooth® additions include the PIC32 Bluetooth Audio Development Kit, featuring modules, stacks and CODECs, and XBee®footprint-compatible socket modules with integrated stacks.  The new Wi-Fi®  … Read More → "Microchip Expands Embedded Wireless Portfolio With New Bluetooth®, Wi-Fi® and ZigBee® Products"

IAR Systems’ powerful tools adds edge to new RX100 series from Renesas Electronics

Uppsala, Sweden—April 22, 2013—As the only tools provider covering the entire range of Renesas’ 8/16/32-bit microcontroller families, IAR Systems® is proud to announce full support for the newly introduced RX111 microcontrollers. As a result of IAR Systems’ strategic alliance with Renesas, immediate support for the group is available in the world-leading C/C++ development tool suite IAR Embedded Workbench®. IAR Systems also releases a free 64KB KickStart version of IAR Embedded Workbench to support all RX devices, including the new RX111 microcontrollers.

Recent enhancements to IAR Embedded Workbench for RX include an extended … Read More → "IAR Systems’ powerful tools adds edge to new RX100 series from Renesas Electronics"

Silicon Labs Introduces the First Single-Chip Digital Radio Receivers for Consumer Electronics

AUSTIN, Texas – Apr. 22, 2013 – Silicon Labs (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s first single-die antenna-input-to-audio-output digital radio receiver solution developed for the global portable and consumer electronics markets. Leveraging software-defined radio technology, the new monolithic Si468x receiver ICs bring FM, HD Radio™ and DAB/DAB+ broadcast capabilities to a wide range of audio applications, from price-sensitive clock and tabletop radios to mainstream mini/micro audio systems and CD boomboxes to high-end multimedia devices with displays such as mobile … Read More → "Silicon Labs Introduces the First Single-Chip Digital Radio Receivers for Consumer Electronics"

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....