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Fujitsu Semiconductor Expands Use of Calibre for Advanced IC Physical Verification and Design for Manufacturing

WILSONVILLE, Ore., January 23, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced that Fujitsu Semiconductor Limited has expanded its use of the Calibre® platform, incorporating the latest Calibre physical verification and design for manufacturing (DFM) capabilities in its design enabling flow for all Fujitsu Semiconductor projects, including its most advanced analog and digital designs. The selection was driven by the Calibre product’s industry-leading accuracy and performance, which address design complexity at advanced nodes, as well as new Calibre productivity features. For example, the Calibre platform provides pattern matching for fast identification of litho hotspots and other … Read More → "Fujitsu Semiconductor Expands Use of Calibre for Advanced IC Physical Verification and Design for Manufacturing"

New Infineon 32-bit Microcontroller Family XMC4000 for Industrial Applications Combines Powerful Application-optimized Peripherals and ARM® Cortex™-M4 processor; Samples Available in March 2012

Neubiberg, Germany – January 23, 2012 – Today Infineon Technologies introduced its new XMC4000 32-bit microcontroller family, which uses the Cortex™-M4 processor from ARM®. Infineon applied more than 30 years of experience in the development of microcontrollers with application-optimized peripherals and outstanding real-time capability in its design of the XMC4000 family, and combines this with the advantages of a widely distributed core architecture. The XMC4000 family supports three main trends in industrial applications: It helps to improve energy efficiency, supports a large number of communication standards and reduces software complexity during development. The target applications of … Read More → "New Infineon 32-bit Microcontroller Family XMC4000 for Industrial Applications Combines Powerful Application-optimized Peripherals and ARM® Cortex™-M4 processor; Samples Available in March 2012"

Mouser Offering Qi (“chee”) Solutions for Wireless Charging

January 18, 2012 – Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced it is stocking components in support of the Wireless Power Consortium’s Qi (pronounced “chee”) global standards for interoperability between wireless … Read More → "Mouser Offering Qi (“chee”) Solutions for Wireless Charging"

TEWS TECHNOLOGIES introduces Spartan-6 AMC for MTCA.4

Halstenbek, Germany – January 19th, 2012. TEWS TECHNOLOGIES today announced the TAMC651, a standard single Mid-Size or Full-Size AMC.1 module conforming to MTCA.4 (Micro TCA Enhancements for Rear I/O and Precision Timing) with a user-programmable XC6SLX45T-2 or XC6SLX100T-2 Spartan-6 FPGA. Designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required, the TAMC651 provides a number of advantages including a customizable interface for unique applications and a FPGA-based design to extend product lifecycle. 

The Spartan-6’s integrated PCIe Endpoint Block is connected to AMC port 4. AMC … Read More → "TEWS TECHNOLOGIES introduces Spartan-6 AMC for MTCA.4"

KLA-Tencor Announces New Flagship Wafer Inspection Solution Suite to Support Advanced Design-Rule Chip Manufacturing

MILPITAS, Calif., Jan. 19, 2012—Today KLA-Tencor Corporation (NASDAQ: KLAC), announced three new wafer defect inspection systems for leading-edge chip manufacturers: the 2900, Puma 9650 and eS800 systems. This new flagship suite is designed to address the wide range of defect issues that new materials, structures and design rules have imposed on manufacturers of advanced chips. The new 2900 Series broadband optical wafer defect inspection platform extends optical wafer defect inspection to new limits, with significant strides forward in defect capture on challenging layers and die areas, and capture … Read More → "KLA-Tencor Announces New Flagship Wafer Inspection Solution Suite to Support Advanced Design-Rule Chip Manufacturing"

Miyachi Unitek Unveils Uniflow®4 and Uniflow®4R Power Supply

MONROVIA, CA – Miyachi Unitek Corporation, a leading manufacturer of welding equipment and systems, announces the release of its new Uniflow®4  pulsed heat control system, a power supply that provides targeted heating and precision temperature control for hot bar reflow soldering, heat seal bonding and conductive adhesive bonding. The new model is a major update, with a variety of new hardware improvements, process control features, and flexible options.

The Uniflow4 is ideal … Read More → "Miyachi Unitek Unveils Uniflow®4 and Uniflow®4R Power Supply"

TI unveils fastest, highest-performance analog front end for femtocells and portable software-defined radio

DALLAS  (Jan. 19, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) introduced today the industry’s fastest, highest-performance analog front end (AFE) for femtocell base stations and portable software-defined radio (SDR) applications. The low-power, 12-bit AFE7225 integrates a dual 125-MSPS analog-to-digital converter (ADC) and dual 250-MSPS digital-to-analog converter (DAC). It operates 25-percent faster than the competition, while increasing the signal-to-noise ratio (SNR) by 2 dB and providing up to five times the DAC output current. For more information and to order samples of these new AFEs, visit Read More → "TI unveils fastest, highest-performance analog front end for femtocells and portable software-defined radio"

Introducing TI’s SimpleLink product family: The industry’s broadest portfolio of easy-to-use wireless connectivity solutions

DALLAS (January 18, 2012) /PRNewswire/ — Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQTXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.

The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: … Read More → "Introducing TI’s SimpleLink product family: The industry’s broadest portfolio of easy-to-use wireless connectivity solutions"

RFMD Expands Industry-Leading Portfolio Of High Performance 2.4GHz Front End Modules For ZigBee®/HAN Applications

GREENSBORO, N.C., January 10, 2012 – RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the release of the RFFM6201, a 2.4GHz band single-chip Zigbee® front-end module (FEM) featuring an integrated power amplifier, low noise … Read More → "RFMD Expands Industry-Leading Portfolio Of High Performance 2.4GHz Front End Modules For ZigBee®/HAN Applications"

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