ACTON, MASS. –– March 5, 2013 –– Carbon Design Systems® Inc. (www.carbondesignsystems.com) announced today that its newest Carbon Performance Analysis Kit (CPAK™) featuring the ARM® Cortex™-R7 processor is available for download from the Carbon IP Exchange web portal (www.carbonipexchange.com).
Unterpremstaetten, Austria (March 4, 2013) — ams AG (SIX: AMS), a leading worldwide designer and manufacturer of high-performance analog ICs for consumer & communications, industrial & medical and automotive applications, today introduced a new intelligent LED driver for mobile phone cameras that maximizes the brightness of the flash without causing the phone’s battery to fall below its minimum operating voltage.
The AS3649 LED driver uses an innovative “diagnostic pulse” – a burst of controlled high current lasting a few milliseconds – immediately before every flash operation. During this pulse the device measures the momentary voltage across the terminals of the phone’ … Read More → "Brighter, clearer images from mobile phone cameras as ams introduces intelligent flash LED driver"
SAN JOSE, Calif. – March 4, 2013 – Motor control application designers are now moving away from the traditional universal or AC motor design to a more sophisticated brushless DC (BLDC) motor or permanent magnet synchronous motor (PMSM) design. However, choosing either of these methods can be challenging if the designer has limited access to advanced, complex motor control algorithms. This can lead to significant spending of research and development resources and longer design times.
To help designers with these cost and software burdens, Fairchild Semiconductor (NYSE: FCS) developed the Read More → "Fairchild Semiconductor’s BLDC/PMSM Motor Controller with Parallel Processing Cores Provides Simple Conversion of AC Motor Control Designs"
SUNNYVALE, California, February 25, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ devices, announced its third generation 9-axis MotionTracking device with the lowest power and best-in-class performance. The world’s smallest 9-axis solution, the MPU-9350 combines an accelerometer, gyroscope, and electronic compass into a 3x3x1mm QFN package. At 6.7mW, the MPU-9350 has 28% lower power consumption than its predecessor and comes with the industry’s only integrated Digital Motion Processor™ (DMP). The DMP, together with an embedded FIFO, offloads high-frequency motion … Read More → "InvenSense® Introduces the World’s Lowest Power 9-Axis MotionTracking Device"
SAN JOSE, Calif.– DigitalOptics Corporation (DigitalOptics or DOCTM), a wholly owned subsidiary of Tessera Technologies, Inc. (TSRA), today introduced mems|cam™, a microelectromechanical system (MEMS) autofocus camera module for smartphones.
The mems|cam modules harness the performance advantages of MEMS technology to deliver dramatically improved speed, power, and precision in smartphone cameras. DigitalOptics has demonstrated that mems|camoffers significantly faster autofocus, at 1 percent of the power consumption of traditional voice coil motor (VCM) autofocus technology. DOC’s mems|cam components provide micron-level … Read More → "DigitalOptics Corporation Launches mems|cam"
SUNNYVALE, California, February 25, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ devices, announced the world’s lowest profile and lowest power 3-axis MEMS gyroscope designed for Smartphones, Tablets, Smart TVs, and Gaming devices. The trend toward thinner devices in the consumer electronics market has created demand for components with a maximum height of 0.8mm to allow flexible board placement. Low profile components also offer the advantage of allowing for thicker batteries with extended operating time. The ITG-3501, with an industry first 0.75 … Read More → "InvenSense® Unveils World’s Lowest Profile 3-Axis Gyroscope for MotionTracking Applications"
SAN JOSE, Calif., March 4, 2013 – Xilinx, Inc. (NASDAQ: XLNX) today announced
solutions for significant and growing gaps in ASIC and ASSP offerings targeting next-generation smarter networks and data centers. In order to fill these gaps, Xilinx has been acquiring and developing a SmartCORE™ IP portfolio and a critical mass of application specialists and services that leverage Xilinx’s All Programmable FPGAs, SoCs, and 3D ICs. These solutions target customers who need to rapidly create, differentiate, and evolve intelligent, fabric-centric data centers and software defined networks (SDN), ‘many-band’ self-organizing networks (SON) for LTE and … Read More → "Xilinx Solutions Target Growing ASIC and ASSP Gaps for Next-Generation Smarter Networks and Data Centers"
ALBUQUERQUE, N.M. – March 4, 2013 – Skorpios Technologies, Inc., an innovator in silicon photonic technology, today announced demonstration of a full C-band tunable CMOS photonic laser manufactured in a commercial foundry utilizing its proprietary STAB process. The application of this wafer scale integration process results in a photonic CMOS Integrated Circuit (IC) that is planar and hermetically encapsulated. Additionally, the Skorpios CMOS laser IC does not require any costly post-fabrication assembly processes such as flip-chip bonding, turning mirrors, lenses or active alignments. Characterization of the initial devices demonstrates that the laser performance is appropriate for applications from datacenter interconnects to the … Read More → "Skorpios Technologies Demonstrates CMOS Tunable Laser"
CHICAGO – Feb. 20, 2013 –The BeagleBone is one of the most popular open source hardware platforms ever developed, and its legion of fans around the world are now able to get their first look at the next generation board at the element14 engineering community.
Offering higher performance and more memory, the next generation BeagleBone’s lower cost will be especially attractive to students and hobbyists. Availability is slated for late April, but enthusiasts can queue now by registering their interest at Read More → "Next generation BeagleBone previews at element14"
Embedded World, Nuremberg, Germany—February 26, 2013— Today, IAR Systems® announces further enhancements to its innovative Power Debugging technology. At Embedded World in Germany, the company demonstrates new functionality in its world-leading development tool suite IAR Embedded Workbench® for ARM®. This functionality includes detailed in-circuit power measurements made possible by IAR Systems’ new I-scope™ probe.
Power Debugging provides developers with information about how the software implementation of an embedded system affects the system’s power consumption. This technology is available using the C-SPY® Debugger included in IAR Embedded Workbench together with IAR Systems’ in-circuit debugging … Read More → "IAR Systems further strengthens product portfolio for power analysis"
