News – Page 1825 – EEJournal

Silicon Labs Speeds DSP Smart Sensor System Design with Wonder Gecko MCU Development Kits

July 12, 2013

AUSTIN, Texas – July 10, 2013 – Silicon Labs (Nasdaq: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today introduced development kits and application software demonstrations for the EFM32 Wonder Gecko microcontroller (MCU) family, which was developed by Energy Micro, recently acquired by Silicon Labs. The Wonder Gecko MCU line is based on the ARM® Cortex™-M4 processor core, which provides a full DSP instruction set and includes a hardware floating point unit (FPU) for faster computation performance. The development kits and software examples are designed to help embedded engineers leverage 32 … Read More → "Silicon Labs Speeds DSP Smart Sensor System Design with Wonder Gecko MCU Development Kits"

Avnet Embedded Launches Rorke Global Solutions™

July 12, 2013

PHOENIX – July 9, 2013 — Avnet Embedded, a division of Read More → "Avnet Embedded Launches Rorke Global Solutions™"

Tektronix Donates Oscilloscopes to Support NASA Rocket Design Education Program

July 12, 2013

BEAVERTON, Ore., July 11, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced that it has donated DPO2012B oscilloscopes to 2013 NASA Student Launch Projects Challenge winning teams. This is the third year that Tektronix has donated oscilloscopes< … Read More → "Tektronix Donates Oscilloscopes to Support NASA Rocket Design Education Program"

SEMATECH and TNO Establish Partnership to Enable Development of Measurement Standards for Semiconductor Component and Material Outgassing

July 12, 2013

ALBANY, N.Y. and Netherlands – July 9, 2013 – SEMATECH and TNO, an organization for applied scientific research, announced today that they have established a strategic partnership aimed to enable measurement standards for establishing traceability for outgassing rates and leak rate measurement in semiconductor tools and processing.

Semiconductor manufacturers are facing new contamination control and monitoring challenges, including component and materials’ outgassing which can introduce a variety of contaminants into semiconductor fabs, impacting many processes. The objective of the project is to develop metrological procedures and guidelines for the measurement of equipment that will help the industry to have recommended … Read More → "SEMATECH and TNO Establish Partnership to Enable Development of Measurement Standards for Semiconductor Component and Material Outgassing"

Real Intent Joins Synopsys in-Sync Program

July 11, 2013

SUNNYVALE, Calif. – July 8, 2013 – Real Intent, Inc., a leading provider of EDA advanced sign-off verification solutions, today announced it has joined the Synopsys in-Sync™ program for two of its flows – the Synopsys VCS® Verilog simulator tie-in to Real Intent’s Ascent™ and Meridian™ products; and the Synopsys HDL Compiler™ tool flow tie-in to its Meridian products.

“Since our beginning, Synopsys has advanced tool interoperability via standards organizations and our own programs including in-Sync,” said Karen Bartleson, senior director of … Read More → "Real Intent Joins Synopsys in-Sync Program"

ADLINK Introduces 4-CH 24-bit USB-2405 Dynamic Signal Acquisition Module

July 11, 2013

July 10, 2013 – SAN JOSE, CA – ADLINK Technology, Inc. announces the release of its new four-channel USB 2.0 dynamic signal acquisition module, the USB-2405. A built-in IEPE excitation current source provides 2mA on each AI channel, and BNC connectors enable the USB-2405 to provide high accuracy and excellent dynamic performance for microphone and accelerometer measurement in vibration and acoustic applications. Featuring superior accuracy with low temperature drift, built-in anti-aliasing filters, support for flexible trigger mode, and USB bus power, the USB-2405 embodies an ideal portable solution for time-frequency analysis and research.

High Accuracy with Low … Read More → "ADLINK Introduces 4-CH 24-bit USB-2405 Dynamic Signal Acquisition Module"

Aldec Verifies Compatibility of Northwest Logic’s PCI Express Cores with HES-7™ SoC/ASIC Prototyping Platform

July 11, 2013

Henderson, Nevada – July 11, 2013 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions, today announced that engineers incorporating high-speed PCI Express data transmission into their SoC and ASIC designs can accelerate their time-to-market utilizing Northwest Logic PCI Express IP Cores with Aldec’s HES-7™ prototyping platform.

“Northwest Logic’s PCI Express IP cores enable designers to quickly create PCI Express-based SoC designs for a variety of markets including embedded applications, server development, communications, and more,” said … Read More → "Aldec Verifies Compatibility of Northwest Logic’s PCI Express Cores with HES-7™ SoC/ASIC Prototyping Platform"

Researchers develop systems that convert ordinary language to code

July 11, 2013

CAMBRIDGE, Mass- In a pair of recent papers, researchers at MIT’s Computer Science and Artificial Intelligence Laboratory have demonstrated that, for a few specific tasks, it’s possible to write computer programs using ordinary language rather than special-purpose programming languages.

The work may be of some help to programmers, and it could let nonprogrammers manipulate common types of files — like word-processing documents and spreadsheets — in ways that previously required familiarity with programming languages. But the researchers’ methods could also prove applicable to other programming tasks, expanding the range of contexts in which programmers … Read More → "Researchers develop systems that convert ordinary language to code"

TI introduces motor driver family with integrated power management and CAN interface for use in automotive functional safety applications

July 11, 2013

DALLAS (July 11, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today expanded the industry’s first automotive motor driver family intended to help TI customers design automotive applications to meet the functional safety requirements of ISO 26262. With three new devices added today, the DRV32xx-Q1 family now comprises four 3-phase, brushless, pre-FET motor drivers equipped with built-in diagnostic capabilities. The DRV3202-Q1 offers automotive system designers integrated power management and CAN interface to help reduce board space and design complexity in their safety-critical applications. The DRV3203-Q1 and DRV3204-Q1 help TI … Read More → "TI introduces motor driver family with integrated power management and CAN interface for use in automotive functional safety applications"

Soitec’s RF SOI wafers now mainstream in mass producing smartphones’ switches

July 11, 2013

San Francisco, California, July 10, 2013 — Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced at the Semicon West trade show that its silicon-on-insulator (SOI) technologies are now mainstream for manufacturing switches and antenna-tuners, key RF components used in all cell phones and tablet computers. According to the industry research firm Yole Développement, more than 65 percent of substrates used in fabricating switches for handsets are SOI based, showing the massive adoption of RF SOI for this booming electronic market experiencing double-digit growth. Now, chip manufacturers are relying on SOI technology … Read More → "Soitec’s RF SOI wafers now mainstream in mass producing smartphones’ switches"