News – Page 1823 – EEJournal

Xilinx’s Zynq-7000 All Programmable SoCs Enable Mobilicom’s Advanced Peer-to-Peer Software-Defined Radios

July 16, 2013

SAN JOSE, Calif., July 16, 2013 – Xilinx, Inc. (NASDAQ: XLNX) today announced that at the heart of Mobilicom’s new MCU-30 software-defined radio (SDR) is Xilinx’s Zynq®-7030 All Programmable System-on-a-Chip (SoC), a member of Xilinx’s Zynq-7000 family. Mobilicom’s MCU-30 SDR is a very small, flexible, light-weight, battery-powered wireless radio that can be embedded into a wide variety of devices – from security cameras to public safety – … Read More → "Xilinx’s Zynq-7000 All Programmable SoCs Enable Mobilicom’s Advanced Peer-to-Peer Software-Defined Radios"

Proterra Standardizes on Electrical Systems Design and Wire Harness Engineering Tools from Mentor Graphics

July 16, 2013

WILSONVILLE, Ore., July 16, 2013—Mentor Graphics Corporation (NASDAQ: MENT) today announced that the leading provider of zero-emission commercial transit solutions, Proterra Inc., has standardized on the Mentor Graphics® VeSys® tools for its electrical systems design and manufacture of wire harnesses. Proterra will be using the VeSys tools to help design and manufacture heavy-duty, electric drive systems, energy storage systems, vehicle control systems, transit buses, and the world’s first all-electric, fast-charge transit bus.

The VeSys tools are a suite of wiring and harness … Read More → "Proterra Standardizes on Electrical Systems Design and Wire Harness Engineering Tools from Mentor Graphics"

Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform

July 16, 2013

SAN JOSE, CA–(Marketwired – July 16, 2013) – Cadence Design Systems (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Hitachi reduced development time and accelerated time to market for new IT products by utilizing the Cadence® Rapid Prototyping Platform. Hitachi collaborated with Cadence as a strategic partner on an integrated verification and early software development environment to enhance quality and shorten turnaround time for Hitachi’s new IT products. Hitachi successfully implemented a system-level … Read More → "Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform"

Neonode Launches Circular Multi-Touch and Proximity Platform for Wearable Tech

July 16, 2013

SANTA CLARA, Calif., July 16, 2013 (GLOBE NEWSWIRE) — Neonode Inc., (Nasdaq:NEON), the optical touch technology company, today announced the release of a new, unique and versatile Circular Multisensing® platform developed for wearable electronics and accessories. The solution is especially developed for a wide range of fast-growing new market segments, such as fashion-tech, sports & fitness, medical, gaming & lifestyle, and portable infotainment.

The new waterproof and cost-efficient solution is specifically engineered to add enhanced … Read More → "Neonode Launches Circular Multi-Touch and Proximity Platform for Wearable Tech"

Compact 400 Watt power supply capable of 700 Watt peak

July 16, 2013

XP Power today announced the SDL400 series of 400 Watt single and dual output AC-DC power supplies. These compact units, suitable for 1U applications, are available in four mechanical formats: U channel, U channel with cover (-C option), top fan cover (-F option) and end fan cover (-E option). All of the formats apart from the top fan mounted version are less than 1.6 inches (39.9 mm) high. A variable speed fan is used to reduce audible noise at lower load conditions and extend fan life in the –E and –F models. For applications without a fan or forced air flow, … Read More → "Compact 400 Watt power supply capable of 700 Watt peak"

UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node

July 16, 2013

SAN JOSE, CA–(Marketwired – July 16, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS

New flows incorporate the industry’s leading DFM prevention, analysis, and signoff capabilities
Cadence technologies selected after extensive benchmark testing
DFM solutions to boost productivity and enhance yield for customers

Cadence Design Systems, Inc. (NASDAQ: CDNS</ … Read More → "UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node"

STMicroelectronics to Showcase its Latest Solutions for Sense and Power Applications at TECHNO-FRONTIER 2013

July 16, 2013

Tokyo, July 16, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will be exhibiting at TECHNO-FRONTIER 2013. At the ST Booth 1D-201, you can witness various demonstrations and see the development boards that focus on the power solutions that promote an effective use of resources, and the sensing solutions that improve user experiences, increase customer benefits, and contribute to the realization of a new lifestyle for people.

Sensing Solutions

Sensing our surroundings and the environmental information in our homes so that the info can improve our lives … Read More → "STMicroelectronics to Showcase its Latest Solutions for Sense and Power Applications at TECHNO-FRONTIER 2013"

EMA Announces a New Enhanced Version of CircuitSpace

July 16, 2013

Rochester, NY (July 16, 2013) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced CircuitSpace 5.0 with enhanced features to improve the usability and productivity for circuit board design placement, replication, and design reuse in Cadence® Allegro® PCB Designer. “CircuitSpace enables engineers to expedite the PCB design requirements with a higher level of quality and reproducibility from the placement phase of the design cycle through design review and verification,” said Manny Marcano, president and CEO of EMA. “We strive to … Read More → "EMA Announces a New Enhanced Version of CircuitSpace"

Micron Unveils 16-Nanometer Flash Memory Technology

July 16, 2013

Boise, Idaho, July 16, 2013 – Micron Technology, Inc., (Nasdaq:MU) today announced that it is sampling next-generation, 16-nanometer (nm) process technology, enabling the industry’s smallest 128-gigabit (Gb) multi-level cell (MLC) NAND Flash memory devices. The 16nm node is not only the leading Flash process, but it is also the most advanced processing node for any sampling semiconductor device. It solidifies Micron’s leadership position in storage technology development and delivers on the company’s vision to provide the most advanced semiconductor solutions.

Micron’s 128Gb MLC NAND Flash memory devices are targeted at applications like consumer SSDs, removable … Read More → "Micron Unveils 16-Nanometer Flash Memory Technology"

Altium releases Maxim Integrated Board-Level Design Content Online

July 16, 2013

Shanghai, China – 16 July 2013 – Altium Limited, a global leader in Smart System Design Automation and provider of solutions for 3D PCB design (Read More → "Altium releases Maxim Integrated Board-Level Design Content Online"