HYPRES Announces Commercial Availability of New Chip Fabrication Process for Next Generation Superconducting Electronics Circuits
Elmsford, New York (July 08, 2013)—HYPRES, Inc., the Digital Superconductor Company™, announces the commercial availability of its newest six-layer planarized chip fabrication process. This new process increases the integration level of superconducting ICs and critical current density of Josephson junctions, making it ideal for customers developing high performance, energy efficient solutions for high-end computing, advanced wireless communications and instrumentation.
“This is an exciting milestone for HYPRES, its customers, and the superconductor electronics community,” said Oleg Mukhanov, Ph.D., Chief Technology Officer at HYPRES. “Next generation superconductor circuit development requires commercially available fabrication processes well beyond today’ … Read More → "HYPRES Announces Commercial Availability of New Chip Fabrication Process for Next Generation Superconducting Electronics Circuits"

