News – Page 1812 – EEJournal

QuickLogic’s ArcticLink III VX CSSP has been used in Samsung’s GALAXY Tab 3 7.0 Tablet

August 6, 2013

Sunnyvale, CA – August 6, 2013 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low-power programmable Customer Specific Standard Products (CSSPs), today announced that the ArcticLink® III VX CSSP has been used in Samsung’s GALAXY Tab 3 7.0 tablet. The GALAXY Tab 3 7.0 features a 7-inch 1024 x 600 display, a dual-core 1.2 GHz processor, 8/16GB of on-board memory, and the Android “Jelly Bean” operating system. The QuickLogic ArcticLink III VX device provides a display interface bridging solution and extends battery life through a combination of intelligent backlight modulation and visual restoration.

The integrated … Read More → "QuickLogic’s ArcticLink III VX CSSP has been used in Samsung’s GALAXY Tab 3 7.0 Tablet"

NRL Researchers Discover Novel Material for Cooling of Electronic Devices

August 5, 2013

A team of theoretical physicists at the U.S. Naval Research Laboratory (NRL) and Boston College has identified cubic boron arsenide as a material with an extraordinarily high thermal conductivity and the potential to transfer heat more effectively from electronic devices than diamond, the best-known thermal conductor to date.

Schematic of thermal management in electronics: Local temperature increases occur as a result of current flow in active regions of devices and can lead to degradation of device performance. Materials with high thermal conductivities are used in heat spreading and sinking to conduct heat … Read More → "NRL Researchers Discover Novel Material for Cooling of Electronic Devices"

CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices

August 5, 2013

MOUNTAIN VIEW, Calif., – August 5, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of its digital video stabilizer (DVS) software module for theCEVA-MM3000 imaging and vision platforms, bringing advanced imaging capabilities to next generation smartphones and mobile devices. The DVS module is fully optimized to run in real-time using minimal processing workloads and very low memory bandwidth on the CEVA-MM3000 platforms. For example, … Read More → "CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices"

Laird Announces Release of Wireless Charging Coil Modules

August 5, 2013

August 2, 2013 – Laird, a global technology company, announced the release of the new RWC5353 Series Wireless Charging Coil Modules. The RWC5353 Series improves efficiency and performance while minimizing electromagnetic interference (EMI) in wireless charging devices.

The new RWC5353 series are transmitter coil modules that meet the Wireless Power Consortium’s WPC) Qi standard, the global standard for wireless charging. With more than 20 million people using Qi-phones, the market for wireless charging devices is poised for explosive growth.

“Laird is … Read More → "Laird Announces Release of Wireless Charging Coil Modules"

Crossbar Emerges from Stealth-Mode; Unveils Crossbar RRAM Non-Volatile Memory Technology

August 5, 2013

Highest Capacity: Up to 1 Terabyte (TB) of Storage on a Single Chip; Multiple Terabytes with 3D Stacking
Lowest Power: Extends Battery Life to Weeks, Months or Years
Highest Performance: 20x Faster Write than NAND
Easiest SOC Integration: Simple Stacking on Logic in Standard CMOS at Most Advanced Nodes
Most Reliable: 10x the Endurance of NAND; Approaching DRAM Reliability

SANTA CLARA, CA – AUGUST 5, 2013 – Emerging from stealth-mode today, Crossbar, … Read More → "Crossbar Emerges from Stealth-Mode; Unveils Crossbar RRAM Non-Volatile Memory Technology"

CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms

August 5, 2013

MOUNTAIN VIEW, Calif., – August 5, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of a new Application Developer Kit (ADK) for the CEVA-MM3000 imaging and vision platforms. The ADK was developed in-house and serves to substantially simplify the overall software development experience, shortening the product design cycle and providing significant memory bandwidth and power consumption savings. CEVA’s imaging experts utilized the ADK to develop its new low … Read More → "CEVA Announces New Application Developer Kit for CEVA-MM3000 Imaging & Vision Platforms"

Cadence to Present, Exhibit and Sponsor Flash Memory Summit 2013

August 5, 2013

SAN JOSE, CA–(Marketwired – August 05, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its sponsorship of the Flash Memory Summit, a conference and exhibition that highlights innovation for consumer, computer and communications applications. In addition to being a platinum sponsor of this conference, Cadence is … Read More → "Cadence to Present, Exhibit and Sponsor Flash Memory Summit 2013"

IAR Systems supports new Kinetis E series microcontrollers from Freescale

August 5, 2013

Uppsala, Sweden—August 5, 2013—IAR Systems® is proud to announce comprehensive support for the highly efficient, newly introduced Kinetis® E series microcontrollers from Freescale® Semiconductor. The support is available using IAR Embedded Workbench® for ARM®, which is a complete set of high-performance tools for embedded development.

The Kinetis E series microcontrollers (MCUs) are ideal for white goods and industrial applications – equipment commonly operating in high-noise environments – such as dishwashers, refrigerators, home and building control systems and motor control fans. The new MCUs – the first 5V, 32-bit MCUs … Read More → "IAR Systems supports new Kinetis E series microcontrollers from Freescale"

Synopsys and Lattice Semiconductor Extend Multi-Year FPGA Synthesis OEM Agreement

August 5, 2013

MOUNTAIN VIEW, Calif., Aug. 5, 2013

Highlights:

Multi-year contract renewal provides Lattice FPGA and CPLD users with Synopsys’ technology-leading Synplify Pro logic synthesis tool
Synplify Pro has been optimized for Lattice Semiconductor devices to deliver optimal Quality of Results (QoR) and fast timing closure
Seamless integration with Lattice Diamond design software provides users with an integrated design flow for FPGA exploration, implementation and timing analysis

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP … Read More → "Synopsys and Lattice Semiconductor Extend Multi-Year FPGA Synthesis OEM Agreement"

Nanopower Buck-Boost DC/DC with Energy Harvesting Battery Life Extender

August 5, 2013

MILPITAS, CA – August 5, 2013 – Linear Technology announces the LTC3330, a complete regulating energy harvesting solution that delivers up to 50mA of continuous output current to extend battery life when harvestable energy is available. The LTC3330 requires no supply current from the battery when providing regulated power to the load from harvested energy and only 750nA operating when powered from the … Read More → "Nanopower Buck-Boost DC/DC with Energy Harvesting Battery Life Extender"