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Algo-Logic Systems launches Full Order-Book running on single-FPGA platform

August 29, 2013

Santa Clara, California, August 29, 2013 – Algo-Logic Systems, a recognized leader in providing hardware-accelerated, deterministic, ultra-low-latency products, systems and solutions for accelerated finance, packet processing and embedded system industries, today announced availability of their new Full Order-Book solution. The Full Order-Book performs all book building processing and reporting as logic inside a single FPGA. The Low Latency Order-Book is designed using the on-chip memory for customer book sizes with many thousands of open orders, a dozen symbols, and reporting of ten L-2 levels. For use-cases where millions of open orders, thousands of symbols, and … Read More → "Algo-Logic Systems launches Full Order-Book running on single-FPGA platform"

Compact Linear Translation Stage for Nanopositioning

August 29, 2013

Auburn, MA – precision motion specialist PI (Physik Instrumente) LP – offers a new type of positioning stage based on a miniaturized ceramic inertia drive.

The PI miCos LPS-45 linear translation stage is designed to position samples along a precisely guided path with distances up to 1 inch. The position of the moving platform is measured by an optical linear encoder with nanometer resolution and controlled in closed-loop operation by a compact electronic motion controller.

Drive Principle

Several versions of the LPS45 are available, for applications in air, vacuum and even for … Read More → "Compact Linear Translation Stage for Nanopositioning"

Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products

August 29, 2013

SAN JOSE, CA–(Marketwired – August 29, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Mellanox Technologies, a leading supplier of high-performance, end-to-end interconnect solutions for data center servers and storage systems, has selected the Cadence® Palladium® XP Verification Computing Platform for the development of its leading-edge server and storage products. By allowing hardware and software system integration prior to silicon availability, the Palladium XP platform improved the time … Read More → "Cadence Palladium XP Platform Chosen by Mellanox Technologies to Shorten Development Time of Interconnect Products"

ITTIA DB SQL Flexibility Extends to Multi-Core for Embedded Data Connectivity and Management

August 29, 2013

August 29, 2013 — Bellevue, WA — ITTIA, a leader in modern embedded and mobile database software, equips applications with safe and efficient storage on single-core and multi-core systems. ITTIA DB SQL addresses the challenge of increasing data volume on multi-core systems; and by expanding its commitment to help manufacturers of embedded devices, ITTIA helps them to manage and connect data – regardless of size – as well as to leverage the performance of multi-core systems. In order for manufacturers of embedded devices to process and analyze all the data generated on a multi-core system, … Read More → "ITTIA DB SQL Flexibility Extends to Multi-Core for Embedded Data Connectivity and Management"

STMicroelectronics Boosts ‘Appcessory’ Boom with Industry’s Most Energy-Efficient Single-Chip Bluetooth 4.0 Network Processor

August 29, 2013

Geneva, August 29, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled the industry’s most energy-efficient Bluetooth® 4.0 Low-Energy Single-Mode chip enabling longer runtimes and smaller, lighter batteries in a wide range of wireless “appcessories” such as fitness wristbands, smart eyewear, or interactive clothes.

ST’s BlueNRG network processor provides the functions needed to link the Bluetooth® Smart device to a Bluetooth® Smart Ready host such … Read More → "STMicroelectronics Boosts ‘Appcessory’ Boom with Industry’s Most Energy-Efficient Single-Chip Bluetooth 4.0 Network Processor"

Industry’s first 12G UHD-SDI reclocker for 4K broadcast video systems

August 29, 2013

DALLAS (August 29, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s first 12G ultra-high-definition (UHD) serial digital interface (SDI) reclocker with integrated signal conditioning. The four-channel LMH1256 doubles the transmission rate of competing 6G devices, allowing broadcast video equipment to capture, record and play back 4K video signals at 60 Hz over a single link of coaxial cable. The LMH1256 reclocker addresses next-generation systems, including digital video routers, switches, encoders/decoders, modular cards, multi-viewers and display monitors. For more information and to order samples, visitRead More → "Industry’s first 12G UHD-SDI reclocker for 4K broadcast video systems"

University of Fairfax partners with Defense Acquisition University on Cybersecurity

August 29, 2013

TYSONS CORNER, VA – Military and civilian government employees and contractors who have completed Defense Acquisition University (DAU) coursework may now be able to receive graduate credit towards a master’s or doctoral degree in cybersecurity from the University of Fairfax (UoF).  Under an agreement signed by the two institutions last week, the UoF has conducted a prior learning assessment for a variety of DAU courses and assigned appropriate academic credit toward one of their accredited graduate degrees.

‘This partnership will  help the participants better understand the cybersecurity impact in developing and managing acquisition programs, projects, and systems … Read More → "University of Fairfax partners with Defense Acquisition University on Cybersecurity"

Entegris and Imec Collaborate on 3D Wafer Handling and Shipping Challenges

August 28, 2013

BILLERICA, Mass., and LEUVEN, Belgium., August 28, 2013 – Entegris, Inc. (Nasdaq: ENTG), a leader in contamination control and materials handling technologies for highly demanding advanced manufacturing environments, and imec, a world-leading research center in nanoelectronics, announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.

3D IC technology, a process by which multiple semiconductor dies are stacked into a single device, is aimed at increasing the functionality and performance of next-generation integrated circuits while reducing footprint and power … Read More → "Entegris and Imec Collaborate on 3D Wafer Handling and Shipping Challenges"

Atmel Ships New ARM Cortex M0+ Processor-based MCUs in Volume

August 28, 2013

ESC Brazil 2013, Sao Paulo, Brazil, August 28, 2013 – Atmel Corporation (NASDAQ: ATML), a global leader in microcontroller (MCU) and touch solutions, today announced the company is shipping in production quantities its new Atmel® SAM D20, the first series in a new family of ultra-low power embedded Flash microcontrollers based on the ARM® Cortex®-M0+ processor.

In this era of the Internet of Things (IoT), products used in building automation, consumer electronics, smart metering, and industrial controls are becoming smarter and more connected. With Atmel’ … Read More → "Atmel Ships New ARM Cortex M0+ Processor-based MCUs in Volume"

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