News – Page 1791 – EEJournal

Cadence Digital and Custom/Analog Tools Included in TSMC Reference Flows to Enable 16nm FinFET Designs

September 20, 2013

SAN JOSE, CA–(Marketwired – September 19, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS

Digital design tools support TSMC 16nm Reference Flow using a 16nm FinFET quad-core design with an ARM Cortex-A15, pairing the most advanced geometry with the high-performance ARM Cortex mobile processor
Custom/analog design tools support TSMC 16nm Custom Design Reference Flow with optimized 16nm native SKILL PDKs, granting designers immediate access to the most advanced Virtuoso features
Cadence tools, including new Tempus … Read More → "Cadence Digital and Custom/Analog Tools Included in TSMC Reference Flows to Enable 16nm FinFET Designs"

Ultra-Low-Power, Context-Aware Motion-Recognition Platform to Result from STMicroelectronics and Movea Cooperation

September 20, 2013

Grenoble, France and Geneva, Switzerland – September 20, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Movea (www.movea.com), a leading provider of data-fusion and motion-processing technologies for consumer electronics, today announced their agreement to integrate Movea’s SmartMotion technology into the STM32F401 microcontroller operating as a low-power sensor-hub controller.

The integration of Movea’s high-accuracy motion-processing models into the STM32F401 will enable mobile-device manufacturers and application developers to deliver … Read More → "Ultra-Low-Power, Context-Aware Motion-Recognition Platform to Result from STMicroelectronics and Movea Cooperation"

Real Intent Unveils Major Enhancements in Ascent XV for Early Functional Verification of Digital Designs

September 19, 2013

SUNNYVALE, Calif. – Sept. 19, 2013 – Real Intent, Inc., a leading provider of EDA software products today announced a new release of its Ascent X-VerificationSystem (XV) tool for early functional analysis of digital designs, adding significant enhancements for initialization analysis, and the detection and management of unknown logic values (X’s). All Ascent products find elusive bugs and eliminate sources of uncertainty that are difficult to uncover using traditional RTL simulation, leading to both improved … Read More → "Real Intent Unveils Major Enhancements in Ascent XV for Early Functional Verification of Digital Designs"

Rovi and STMicroelectronics to Accelerate HEVC Adoption Across Digital Entertainment Ecosystem

September 19, 2013

AMSTERDAM, The Netherlands, Sept. 17, 2013 (GLOBE NEWSWIRE) — IBC 2013 — Driving digital entertainment innovation, Rovi Corporation (Nasdaq:ROVI) and STMicroelectronics today announced they are working to help service providers recognize the benefits of High Efficiency Video Codec (HEVC/H.265). ST is integrating HEVC decoding support for both streaming and downloadable content into its set-top box System-on-Chip (SoC) families, codenamed ‘Cannes’ and ‘Monaco’, while Rovi is delivering an end-to-end solution for the creation, secure delivery, and playback of HEVC.

Rovi and ST … Read More → "Rovi and STMicroelectronics to Accelerate HEVC Adoption Across Digital Entertainment Ecosystem"

Mentor Graphics Tools Included in TSMC’s 3D-IC Reference Flow for True 3D Stacking Integration

September 19, 2013

WILSONVILLE, Ore., September 19, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced that its solutions have been validated by TSMC with a true 3D stacking test vehicle for TSMC’s 3D-IC Reference Flow. The flow expands support from silicon interposer offerings to include TSV-based, stacked die designs. Specific Mentor® offerings include capabilities for metal routing and bump implementation, multi-chip physical verification and connectivity checking, chip interface and TSV parasitics extraction, thermal simulation, and comprehensive pre- and post-package testing.

The Mentor Graphics® 3D-IC flow for … Read More → "Mentor Graphics Tools Included in TSMC’s 3D-IC Reference Flow for True 3D Stacking Integration"

ADLINK Announces PXIe-9529, Newest High-Density Dynamic Signal Acquisition Module for Sound and Vibration Testing

September 19, 2013

September 17, 2013 – Schaumburg, IL – IEEE AUTOTESTCON – ADLINK Technology, Inc., a leading provider of embedded computing products for test & measurement, today announced the release of its new PXI Express dynamic signal acquisition module, the PXIe-9529, featuring up to eight 24-bit analog input channels simultaneously sampling at 192 kS/s and a 108 dB dynamic range to provide ample power for high density, high channel count signal measurement. The PXIe-9529 features a vibration-optimized lower AC cutoff frequency of 0.3 Hz, and all input channels incorporate 4 mA bias current for integrated electronic piezoelectric (IEPE) signal conditioning for accelerometers and microphones, positioning the … Read More → "ADLINK Announces PXIe-9529, Newest High-Density Dynamic Signal Acquisition Module for Sound and Vibration Testing"

Newark element14 Extends Design Support for New STM32 ARM Cortex-M Microcontrollers from STMicroelectronics

September 19, 2013

Sept. 18, 2013 – Chicago – CooCox, the highly integrated ARM^® Cortex™-M design environment (IDE) from Newark element14, has been extended to support the new STMicroelectronics Value-Line of microcontrollers (MCUs), enabling designers to quickly develop applications across the STM32 Value-Line MCUs.

The new design support is a dividend of the close collaboration between ST and Premier Farnell (LSE:pfl), parent company of Newark elemtn14. By using the CooCox, IDE engineers can efficiently work at a high level of abstraction to build, compile and debug their designs and leverage the … Read More → "Newark element14 Extends Design Support for New STM32 ARM Cortex-M Microcontrollers from STMicroelectronics"

110V LED Controller with Spread Spectrum Frequency Modulation & Robust Short-Circuit Protection

September 19, 2013

MILPITAS, CA – September 19, 2013 – Linear Technology announces the LT3795, a 110V, high-side current sense DC/DC converter designed to regulate a current or voltage to a constant value, ideal for driving high brightness (HB) LEDs. Its 4.5V to 110V input voltage range makes it appropriate for a wide variety of applications, including automotive, industrial and architectural lighting. The LT3795 … Read More → "110V LED Controller with Spread Spectrum Frequency Modulation & Robust Short-Circuit Protection"

TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking

September 19, 2013

SAN JOSE, CA–(Marketwired – September 19, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

Highlights:

New reference flow enhances CoWoS™ (chip-on-wafer-on-substrate) chip design
Flow certified using a memory-on-logic design with a 3D stack

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has collaborated with Cadence … Read More → "TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking"

Xilinx Showcases 100G Link Running at OTN Data Rates at ECOC 2013

September 18, 2013

SAN JOSE, Calif., Sept. 18, 2013 — Xilinx, Inc., (NASDAQ: XLNX), in participation with the Optical Internetworking Forum (OIF), will demonstrate a 100G link running at OTN data rates at ECOC in London. Xilinx’s demonstration showcases an implementation of next generation Nx 100G capabilities, enabling customers to design and deliver more efficient communications systems forsmarter networks. Visit Xilinx at … Read More → "Xilinx Showcases 100G Link Running at OTN Data Rates at ECOC 2013"