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Cardinal Components, Inc., Introduces A New Real Time Plus™ Line, Integrating Real Time Clock, Crystal, And Solid State Battery With Re-Charging Circuit, In A Discrete SMD RoHS Compliant Package.

September 23, 2013

WAYNE, N.J., Sept. 23, 2013 /PRNewswire/ — Cardinal Components, Inc., a leader in manufacturing of integrated electronic components and timing solutions, is introducing a new functional module product line called Real Time Plus™ (RTP™).   RTP™ integrates a full-featured Real Time Clock with a two-wire I2C control, a RoHS Solid State Battery (ENERCHIP™ enabled), trickle charge-recharging circuit, power management circuit, and a 32 kHz watch crystal, all in an SMD package, also available in a plastic LGA. The RTP™  incorporates 8 Bytes of Ram and 2 Bytes of EEPROM for … Read More → "Cardinal Components, Inc., Introduces A New Real Time Plus™ Line, Integrating Real Time Clock, Crystal, And Solid State Battery With Re-Charging Circuit, In A Discrete SMD RoHS Compliant Package."

MEMS Accelerometer from STMicroelectronics Is Part of Newly Launched Brain Sentry Impact Sensor

September 23, 2013

Geneva, September 23, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that the just-launched Brain Sentry Impact Sensor™, a lightweight helmet-mounted impact-monitoring device, uses ST’s MEMS accelerometer to monitor head impacts that may cause concussions or other brain injuries.

ST’s low-power, high-g tri-axial accelerometer integrated in the Brain Sentry Impact Sensor accurately measures acceleration in all directions produced … Read More → "MEMS Accelerometer from STMicroelectronics Is Part of Newly Launched Brain Sentry Impact Sensor"

Synopsys Implementation Solution Included in TSMC 16-nm Reference Flow for FinFET Design

September 23, 2013

MOUNTAIN VIEW, Calif., Sept. 23, 2013 /PRNewswire/ —

Highlights:

  • Multi-year collaboration delivers proven 16-nm design flow and methodology
  • Synopsys tools are under V0.5 certification and moving forward to V1.0 for FinFET solutions in extraction, P&R, custom design, physical verification, STA, circuit simulation and power rail integrity analysis
  • 16-nm FinFET Reference Flow solution deployed for early adopters of TSMC 16-nm FinFET process

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used … Read More → "Synopsys Implementation Solution Included in TSMC 16-nm Reference Flow for FinFET Design"

VESA Refreshes DisplayID Standard to Support Higher Resolutions and Tiled Displays

September 23, 2013

NEWARK, CA (23 September 2013) ? The Video Electronics Standards Association (VESA®) today announced the publication of VESA?s Display Identification Data Standard (DisplayID) version 1.3. Delivering on the Association?s promise to create standards that address emerging trends in display technology–including higher resolutions and pixels per inch (PPI)–the latest version of DisplayID now includes support for resolutions at 4K and beyond, tiled display topologies, stereo 3D formats and additional timing standards.

?Every day, increasing transmission rates, video resolutions, PPI and processing capabilities are making new display capabilities available … Read More → "VESA Refreshes DisplayID Standard to Support Higher Resolutions and Tiled Displays"

Eurotech Announces Everyware Software Framework 2.0 for Improved Device Lifecycle Management in Machine-to-Machine Applications

September 23, 2013

Columbia, MD – September 23, 2013 – Eurotech, a leading supplier of embedded technologies, products and systems, today announces the launch of theEveryware™ Software Framework (ESF) 2.0 to give developers proven machine-to-machine (M2M) building blocks and solid built-in remote device and application management. ESF 2.0 provides a cost-effective, flexible and IT-oriented framework to build next generation connected device applications including the ability to remotely configure and upgrade the application throughout its lifecycle.

“Already proven to simplify connected device application development, ESF now gives developers even more tools to evolve their projects once devices … Read More → "Eurotech Announces Everyware Software Framework 2.0 for Improved Device Lifecycle Management in Machine-to-Machine Applications"

Smart Data Concentrator evaluation module from Texas Instruments provides flexible platform to connect and manage more than 2,000 e-meters

September 23, 2013

DALLAS (Sept. 23, 2013) – Enabling robust automated meter reading (AMR), advanced metering infrastructure (AMI), and sensor network automation applications, Texas Instruments (TI) (NASDAQ: TXN) today announced the Smart Data Concentrator evaluation module (EVM) with accompanying power line communication (PLC) system-on-module and supporting software for smart grid developers. The highly integrated TMDSDC3359 EVM provides the ultimate level of flexibility and scalability with numerous performance, cost and connectivity options so developers can create data concentrator designs that can adapt to many worldwide smart grid standards. For more information about this new Smart Data … Read More → "Smart Data Concentrator evaluation module from Texas Instruments provides flexible platform to connect and manage more than 2,000 e-meters"

Avnet Abacus broadens product availability on TE Connectivity range

September 23, 2013

Poing, Germany, 23 September 2013: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors and a business unit of Avnet Electronics Marketing EMEA, a business region of Avnet, Inc. (NYSE: AVT), has announced a significant service enhancement for its customers in Europe on components purchased from the TE Connectivity product portfolio.

The distributor can offer a reduced minimum order quantity (MOQ) on approximately 140,000 TE Connectivity parts, including connectors, relays, passive components, EMC filters, switches, antennas and cables. This gives customers … Read More → "Avnet Abacus broadens product availability on TE Connectivity range"

Sidense Exhibiting and Presenting at TSMC Open Innovation Platform (OIP) Ecosystem Forum

September 20, 2013

Ottawa, Canada and Santa Clara, Calif.

What

Sidense exhibiting and speaking at the TSMC OIP Forum

Where

San Jose Convention Center

150 West San Carlos Street 
San Jose, CA 95110

When

Tuesday, October 1

8:00AM to 6:00PM

Sidense’s R&D Director to present at 4:30:

An Antifuse-based Non-Volatile Memory for Advanced Process Nodes and FinFET Technologies

< … Read More → "Sidense Exhibiting and Presenting at TSMC Open Innovation Platform (OIP) Ecosystem Forum"

Real Intent to Present and Exhibit Verification Solutions at Verify 2013 Japan

September 20, 2013

SUNNYVALE, Calif. – Sept. 20, 2013

Who

Real Intent, whose advanced verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness

What

Will make a presentation and exhibit its Ascent Lint and Meridian CDC products as one of eight organizer companies and a dozen select companies exhibiting at the Verify 2013 … Read More → "Real Intent to Present and Exhibit Verification Solutions at Verify 2013 Japan"

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