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Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X

February 14, 2014

SAN JOSE, Calif., February 13, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the availability of Cadence® Tensilica® HiFi Audio Tunneling for Android?. As the industry’s first Android-compatible technology for a licensed digital signal processor (DSP), Tensilica HiFi Audio Tunneling for Android takes full advantage of enhancements in the recent KitKat release to prolong battery life in smartphones and mobile devices. The solution can cut audio processing power by up to 14X, which results in double the smartphone playback time. KitKat audio tunneling was developed based on input from the Low … Read More → "Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X"

Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP

February 14, 2014

GRENOBLE, France – February 14, 2014 – CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.

The device, produced by ST in their 28nm UTBB fully depleted SOI process technology, allows body-bias-voltage scaling from 0V to +2V, decreases minimum circuit operating voltage, and supports clock-frequency operation of 460MHz at 400mV.

The demonstrator achieves UWVR, greater energy efficiency, and unprecedented levels of efficiency in voltage and frequency using a combination of design techniques. ST and Leti developed and optimized standard cells libraries over … Read More → "Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP"

New, Intelligent System for Machine Vision

February 13, 2014

February 11, 2013, Irvine, CA – Advantech, a global embedded computing leader who provides embedded and intelligent platform solutions across multiple vertical markets, has just released the AIIS-1240 & AIIS-1440, new PoE and USB3 camera controllers for vision inspection. AIIS, abbreviated from Advantech Intelligent Inspection System, is Advantech’s newest dedicated solution aiming automated optical inspection (AOI), including packaging inspection, label inspection, wafer inspection, alignment inspection, and other applications that rely heavily on machine vision. These self-contained PoE and USB3 controllers feature performance computing with Power over Ethernet (PoE)/USB3.0, a rich I/O interface, plus extended product longevity, all in a … Read More → "New, Intelligent System for Machine Vision"

Jumpstart IoT Application Designs with NFC Discovery Kit from STMicroelectronics

February 13, 2014

Geneva, February 13, 2014 – At Embedded World 2014, STMicroelectronics will unveil an easy-access development platform for its M24SR dynamic NFC tags that are now entering volume production in all memory densities and package options. Accelerating the design of IoT applications, ST’s M24SR Discovery Kit contains everything engineers need to start adding NFC connectivity to any kind of … Read More → "Jumpstart IoT Application Designs with NFC Discovery Kit from STMicroelectronics"

4DSP Introduces the FMC151 DC Coupled Dual Channel A/D-D/A Card for Wide Spectrum Applications

February 13, 2014

February 13, 2014, AUSTIN, TX, USA – 4DSP announced today the release of a new DC Coupled analog-to-digital / digital-to-analog card based on the FPGA Mezzanine Card standard (FMC – VITA 57.1) for multi-channel data acquisition and high-speed signal processing and recording.

The FMC151, a wideband transceiver solution, provides two channels of 14-bit A/D at 250Msps and two channels of 16-bit D/A at 800Msps. The design is based on TI’s ADS62P49 ADC and TI’s DAC3283 DAC. The analog signal inputs are DC coupled connecting to MMCX/SSMC coax connectors on the front panel and the input. The input … Read More → "4DSP Introduces the FMC151 DC Coupled Dual Channel A/D-D/A Card for Wide Spectrum Applications"

Fujitsu Laboratories and imec Holst Centre Develop Wireless Transceiver Technology for Medical Devices

February 12, 2014

Kawasaki, Japan, and Eindhoven, The Netherlands, February 12, 2014 – Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

While the subject of high expectations for medical applications, wireless monitoring of brainwaves or other vital signs has in the past required over a dozen milliwatts (mW) of electric power. Now, however, by optimizing the architecture and circuitry, Fujitsu Laboratories and … Read More → "Fujitsu Laboratories and imec Holst Centre Develop Wireless Transceiver Technology for Medical Devices"

Allegro MicroSystems, LLC Introduces a New Single Element, Tooth Detecting Speed Sensor IC

February 12, 2014

Worcester, MA – February 12, 2014 – Allegro MicroSystems, LLC introduces a unique addition to Allegro’s camshaft sensor family of products. As a single element, non-TPOS sensor it provides first falling edge detection, high running-mode edge accuracy, and direction/orientation insensitivity over the full operating range of air gap, speed, and temperature. Allegro’s Read More → "Allegro MicroSystems, LLC Introduces a New Single Element, Tooth Detecting Speed Sensor IC"

Synopsys, Realtek and UMC Collaborate on Industry’s First Single-Chip Ultra High Definition Smart TV SoC

February 12, 2014

HSINCHU, Taiwan and MOUNTAIN VIEW, Calif., Feb. 12, 2014 /PRNewswire/ —

Highlights:

Cadence Showcases System Development Solutions for Advanced Driver Assistance Systems at embedded world 2014

February 12, 2014

FELDKIRCHEN, Germany, Feb. 12, 2014—At this year’s embedded world Exhibition & Conference, visitors to the Cadence Design Systems, Inc. (NASDAQ: CDNS) booth can learn about early software development, hardware/software integration and co-verification of embedded subsystems. The Cadence® System Development Suite enables accelerated system integration, validation, and bring-up for concurrent hardware/software design and verification. A showcase of the company’s latest system development solutions focusing on advanced driver assistance systems is scheduled to be demonstrated.

In addition, visitors can learn about Cadence IP offerings such as Tensilica® Dataplane Processor Units (DPUs), the latest … Read More → "Cadence Showcases System Development Solutions for Advanced Driver Assistance Systems at embedded world 2014"

Class D Audio Amplifier from Diodes Incorporated Reduces Component Count

February 12, 2014

Plano, Texas – February 12, 2014 – Integrating an advanced 32-step up/down volume control, the PAM8407 Class D audio amplifier from Diodes Incorporated enables a reduction in component count in a variety of stereo speaker applications, including PCs, docking stations and wireless speakers.

Able to drive dual 4? speakers at 3W per channel, from a 5V supply, the amplifier provides designers with simple two key up/down volume control and high-quality sound reproduction.  With its fully differential inputs, the device ensures low noise, high PSRR and … Read More → "Class D Audio Amplifier from Diodes Incorporated Reduces Component Count"

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