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Micron and Samsung Launch Consortium to Break Down the Memory Wall

BOISE, Idaho and SEOUL, Korea, Oct. 6, 2011 (GLOBE NEWSWIRE) — Samsung Electronics Co., Ltd. and Micron Technology, Inc. (Nasdaq:MU), — world leaders in memory technology — today announced the creation of a consortium for OEMs, enablers and integrators that will collaborate in developing and implementing an open interface specification for an innovative new memory technology called the Hybrid Memory Cube (HMC).

Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with fellow developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to … Read More → "Micron and Samsung Launch Consortium to Break Down the Memory Wall"

Super Talent Introduces new Green-Line VLP for Servers

October 7, 2011 – Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design … Read More → "Super Talent Introduces new Green-Line VLP for Servers"

eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms

SUNNYVALE, CA – October 7, 2011 – eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), and MIPS Technologies (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores, announced the tapeout of a high-performance, three-way microprocessor cluster on GLOBALFOUNDRIES’ leading-edge, low-power 28nm-SLP process technology. Wafers are currently running in GLOBALFOUNDRIES’ Fab 1 in Dresden, Germany, with silicon expected in early 2012. SoC designs can start immediately. MIPS provided the RTL based on its leading-edge MIPS32® 1074Kf™ Coherent Processing System (CPS), and eSilicon performed the synthesis and timing-driven layout, optimizing the design to achieve true worst-case … Read More → "eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms"

Arasan Chip Systems Announces 1080p HD Display Support with MIPI DSI IP

San Jose, California – October 6, 2011 -Arasan Chip Systems, Inc.(“Arasan”), a leading provider of Total IP Solutions, announced today that the company continues to push the limits of production ready MIPI DSI IPs through the introduction of 1080p High-Definition Display support on its popular DSI Host and Device IP’s.Such high resolutions are available with a refresh rate … Read More → "Arasan Chip Systems Announces 1080p HD Display Support with MIPI DSI IP"

Synopsys Acquires Extreme DA

MOUNTAIN VIEW, Calif., Oct. 7, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, announced today that it has completed the acquisition of Extreme DA™, a privately held company headquartered in Santa Clara, California that develops software to improve integrated circuit (IC) design performance, power consumption and manufacturing yields. The acquisition extends Synopsys’ expertise in static timing analysis and multicore software development by adding technology and engineering talent to accelerate advancements in Synopsys’ timing analysis solutions. In addition to having access to technology that … Read More → "Synopsys Acquires Extreme DA"

Kilopass Non Volatile Memory XPM Intellectual Property Core Holds Configuration Data in Haier Digital TV Decoder

Santa Clara, Calif., October 4, 2011 –– Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that its XPM IP is integrated into a Haier Set Top Box (STB) decoder SoC targeting the global high-growth STB market.  Configuration data for mixed signal components are programmed in Kilopass XPM IP for each Haier SoC during final test and can be reprogrammed once installed to accommodate wear in the mixed signal components over time. 

“We are pleased with our choice of the Kilopass XPM IP,” said … Read More → "Kilopass Non Volatile Memory XPM Intellectual Property Core Holds Configuration Data in Haier Digital TV Decoder"

Atmel maXTouch E Series Powers Samsung’s Galaxy Note and Galaxy Tab 7.7 Touchscreens

San Jose, Calif., October 3, 2011—Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, today announced that Samsung Electronics has selected devices in the maXTouch® E Series to power touchscreens in several flagship smartphones and tablets for 2011. Following the success of the Ultra-Slim Galaxy Tab 10.1 powered by the Atmel Read More → "Atmel maXTouch E Series Powers Samsung’s Galaxy Note and Galaxy Tab 7.7 Touchscreens"

Meggitt Sensing Systems Introduces Endevco Handheld Accelerometer Signal Output Simulator and Tachometer

October 4, 2011 – San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has announced the global market introduction of the Endevco® model 4830A, a handheld, lightweight battery-operated electronic instrument, designed to simulate a variety of transducer outputs. The simulator offers a convenient and portable means of verifying instrumentation settings and cable integrity in aerospace and automotive test cells, as well as other in-laboratory and field testing environments.

Available output signals from the model 4830A include single-ended and differential charge (pC), single-ended voltage (mV) and current-sinking ISOTRON® (IEPE). The … Read More → "Meggitt Sensing Systems Introduces Endevco Handheld Accelerometer Signal Output Simulator and Tachometer"

eXplano Tech to offer new Professional training course on UMTS and HSPA/HSPA+ targeted at those who wish to gain maximum expertise and knowledge in a minimum amount of time.

Luton, UK, 6 October 2011 – This month marks the 10th anniversary of the first 3G network launched by NTT Docomo on the 1st October 2001. According to a report by Global Mobile Suppliers Association (GSA) there are 753 million UMTS subscribers including 467 million HSPA users. There are 136 commercial HSPA+ networks in operation and this is set to rise to 170 by the end of 2011. HSPA/HSPA+ is the most serious contender to the roll out of LTE. 

Currently, the mobile industry focus is on LTE, however, with the advancement of HSPA as a competitor to LTE, in recognition to that … Read More → "eXplano Tech to offer new Professional training course on UMTS and HSPA/HSPA+ targeted at those who wish to gain maximum expertise and knowledge in a minimum amount of time."

Zuken offers faster design and improved communications between logical design and PCB layout

October 6, 2011 ? Munich, Germany and Westford, MA, USA ? Zuken announces CADSTAR Placement Planner, which helps electronic engineers communicate their intent and provide guidance to the PCB designer more effectively, without time-consuming iterations that can cause unnecessary delays. Zuken developed Placement Planner, an add-on to CADSTAR Schematics, as a price-competitive solution in response to engineers who do not require full CADSTAR functionality.

Placement Planner helps improve design flow between logical design and PCB layout, whether conducting placement studies for space planning or defining the location of critical components. It also helps maintain … Read More → "Zuken offers faster design and improved communications between logical design and PCB layout"

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