News – Page 1716 – EEJournal

Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology

December 11, 2013

Geneva, December 10, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Harvesting ambient light or thermal energy to power small electronic devices such as wireless sensors, smart-building and industrial equipment controls, wellness and wearable monitors, protects the environment by reducing CO₂ emissions, while eliminating batteries and power cabling, so finally enabling the Internet of Things (IoT) ecosystem. … Read More → "Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology"

DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP

December 11, 2013

SAN JOSE, CA–(Marketwired – December 10, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Digital Voice Systems, Inc. (DVSI) AMBE® Advanced Multi-Band Excitation wideband decoder software has been ported to the Cadence® Tensilica® HiFi Audio/Voice DSP family to enhance high-quality voice compression at low bit rates.

“The Cadence Tensilica HiFi Audio/Voice DSP family is an ideal, efficient platform for our AMBE voice compression products,” said Robert Maher, director of sales & marketing, DVSI. “It … Read More → "DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP"

Imec Demonstrates Strained Germanium FinFETs at IEDM 2013

December 10, 2013

Washington D.C., USA – December 10, 2013 – At this week’s IEEE International Electron Devices Meeting (IEDM 2013), imec reported the first functional strained germanium (Ge) quantum-well channel pMOS FinFETs, fabricated with a Si Fin replacement process on 300mm Si wafers. The device shows a possible evolution of the FinFET/trigate architecture for 7nm and 5nm CMOS technologies.

Since the 90nm technology, embedded SiGe source/drain has been a popular stressor method to produce strained Si that enhances pMOS devices. With diminishing device dimensions, the … Read More → "Imec Demonstrates Strained Germanium FinFETs at IEDM 2013"

Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology

December 10, 2013

Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead

December 10, 2013

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced a new record breaking 4.4M logic cell device, more than doubling its industry leading highest capacity Virtex®-7 2000T device, achieving two consecutive generations of high-end leadership, and delivering an extra node worth of customer value. As the highest end device of Xilinx’s All Programmable UltraScale™ portfolio, also announced today, the Virtex® UltraScale™ VU440 3D … Read More → "Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead"

Micron’s High-Density 45nm Serial NOR Flash Doubles Programming Speed for Embedded Applications

December 10, 2013

BOISE, Idaho, December 10, 2013 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface. These new MT25Q SPI NOR devices offer a cost-effective solution with high performance, enhanced security and drop-in compatibility with legacy NOR devices, enabling high-density SPI NOR adoption in consumer, automotive, industrial and networking applications.

Micron’s MT25Q devices satisfy embedded application requirements with best-in-class 2 MB/s programming speed. In addition, MT25Q devices offer improved erase performance and 66 MB/s read … Read More → "Micron’s High-Density 45nm Serial NOR Flash Doubles Programming Speed for Embedded Applications"

Xilinx 20nm All Programmable UltraScale Portfolio Now Available with ASIC-class Architecture and ASIC-strength Design Solution

December 10, 2013

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced availability of its 20nm All Programmable UltraScale™ portfolio with product documentation and Vivado® Design Suite support. Xilinx shipped its first 20nm silicon in early November 2013, continuing to execute on an aggressive UltraScale device rollout. These devices deliver an ASIC-class advantage with the industry’s only ASIC-class programmable architecture coupled with the Vivado ASIC-strength design suite and UltraFast™ design methodology.

The new Xilinx® UltraScale product portfolio … Read More → "Xilinx 20nm All Programmable UltraScale Portfolio Now Available with ASIC-class Architecture and ASIC-strength Design Solution"

Leti Presentation at IEDM 2013 Will Report Phase-Change Memory Developments for Microcontroller Embedded Applications

December 9, 2013

GRENOBLE, France – Dec. 6, 2013 – A CEA-Leti and STMicroelectronics paper at IEDM 2013 in December will present an innovative back-end-of-line (BEOL), phase-change memory (PCM) technology that is positioned to become the dominant new embedded non-volatile memory (NVM) technology in future microcontroller applications.

The BEOL memory solution is based on a new Ge-rich Ge₂Sb₂Te₅ material with N- or C-dopants. It is able to optimize the SET performance and the high temperature thermal stability of phase-change memories.

These innovative materials have been extensively characterized through physicochemical analysis and electrical tests and have … Read More → "Leti Presentation at IEDM 2013 Will Report Phase-Change Memory Developments for Microcontroller Embedded Applications"

Abilis Systems Achieves First-Pass Silicon Success with DesignWare ARC Processors, Interface IP and Synopsys Professional Services

December 9, 2013

MOUNTAIN VIEW, Calif., Dec. 9, 2013 /PRNewswire/ —

Highlights:

Achieved first-pass silicon success for its secure media processor using Synopsys’ DesignWare ARC Processors, Interface IP, Embedded Memories and Memory Test and Repair
Deployed a validated 65-nm design flow in six weeks using Synopsys’ Lynx Design System, accelerating tapeout by three months
Reduced design iterations with IP integration and physical design assistance from Synopsys’ experienced design consultants

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic … Read More → "Abilis Systems Achieves First-Pass Silicon Success with DesignWare ARC Processors, Interface IP and Synopsys Professional Services"

New Accurate Temperature Sensors Now Offered by Oven Industries Inc

December 6, 2013

Oven Industries, Inc. offers a wide variety of accurate temperature sensors, from thermistors and thermocouples, to resistance thermometers. From ensuring accuracy and ensuring that the high-quality sensor probes are easily integrated with other PID temperature controller systems, Oven Industries, Inc. is leading the way with temperature sensors.

Visitors to the Oven Industries website can find a useful “Temperature Sensor Selection Guide,” which can help with selection of the correct sensor probe for the right project. The guide shows the tolerance level, model number, temperature range and key details about the five accurate temperature sensors that the company … Read More → "New Accurate Temperature Sensors Now Offered by Oven Industries Inc"

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