News – Page 1710 – EEJournal

Spansion Dual-Quad Serial Flash Delivers Industry-Leading Performance for Graphic-Rich Applications

December 19, 2013

SUNNYVALE, Calif., Dec. 18, 2013 /PRNewswire/ — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, today announced a new family of serial peripheral interface (SPI) flash memory with the industry’s highest read performance and smallest package footprint addressing the needs of graphics-rich applications like automotive instrument clusters and industrial human machine interfaces. The Spansion(®) FL Dual-Quad SPI family provides fast boot times and code execution, and quick graphic performance with 160MB/s read throughput, a 240% improvement over the fastest alternative SPI solutions.</ … Read More → "Spansion Dual-Quad Serial Flash Delivers Industry-Leading Performance for Graphic-Rich Applications"

GE Extends DLynx* Series with New Dual 12-Amp Point of Load Modules

December 19, 2013

New High Density Devices Ideal for Communications, Industrial, Medical and Military Applications
Single Module with Dual 12-Amp Outputs Achieves Higher Density Versus Two Individual Modules

DALLAS—Dec. 19, 2013—GE’s Critical Power business (NYSE: GE) today introduced its UDXS1212 non-isolated point of load (POL) DC-DC board-mounted power module, offering an industry-leading 30 percent reduction in board space over previous and competing solutions. The new DLynx< … Read More → "GE Extends DLynx* Series with New Dual 12-Amp Point of Load Modules"

STMicroelectronics Joins ARM mbed Project

December 19, 2013

Cambridge, UK; Geneva, Switzerland; December 19, 2013 – ARM, the world’s leading semiconductor supplier, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, todayannounced that ST has joined the ARM® mbed™ Project. The agreement will give developers using ST’s STM32 microcontroller range, based on the ARM Cortex^®-M-based processor series free access to the mbed software, development tools and online collaboration platform, enabling them to realize their own visions for the new wave of intelligent electronics products.

ARM mbed is a collaborative industry project to nurture the Internet of Things (IoT) … Read More → "STMicroelectronics Joins ARM mbed Project"

Resettable Fuse from Diodes Incorporated Enhances System Reliability

December 19, 2013

Plano, Texas – December 19th, 2013 – For hot plug consumer and industrial products, including external disks, printers and servers, the NIS5132 resettable electronic fuse from Diodes Incorporated helps raise power system reliability, by protecting against shutdown and catastrophic failures. By allowing a product to restart, the device enables a reduction in unnecessary field returns.

Operating over a wide input voltage range from 9V to 18V, and provided in the small, low-profile DFN3030-10 package, the 3.6A rated NIS5132 integrates a low on-resistance NMOS buffer … Read More → "Resettable Fuse from Diodes Incorporated Enhances System Reliability"

IAR Systems updates its popular development tools for Atmel AVR 8-bit microcontrollers

December 19, 2013

Uppsala, Sweden—December 19, 2013—Today, IAR Systems® introduces a new version of its complete C/C++ development toolchain IAR Embedded Workbench® for AVR. The toolchain, popular with the AVR community, has been updated to version 6.30 that includes improved compiler optimizations as well as new device support and updated user guides.

Despite growth in system complexity and an industry focusing on 32-bit microcontrollers, AVR 8-bits are continuously being used in many embedded applications such as automotive applications, battery management and different wireless solutions. IAR Systems has a large … Read More → "IAR Systems updates its popular development tools for Atmel AVR 8-bit microcontrollers"

Avnet Electronics Marketing Americas Looks to “Internet of Things” as a Top Technology Trend in 2014

December 19, 2013

PHOENIX – The Internet of Things (IoT) is expected to grow to 26 billion units installed in 2020, according to Gartner. Avnet Electronics MarketingAmericas, a business region of Avnet, Inc. (NYSE: AVT), sees opportunity in the key technologies that make the connected devices revolution a reality. From sensors to wireless solutions and processors, engineers can leverage Avnet’s broad portfolio of products and in-house technical expertise to stay ahead of the IoT wave.</ … Read More → "Avnet Electronics Marketing Americas Looks to “Internet of Things” as a Top Technology Trend in 2014"

Dual 3A, 4MHz, Synchronous Step-Down Regulators with DDR Memory Now Offered in High Reliability H Grade & Military MP Grade to +150°C

December 19, 2013

MILPITAS, CA – December 19, 2013 – Linear Technology introduces new high reliability H grade and military MP grade versions of the LTC3615 and Read More → "Dual 3A, 4MHz, Synchronous Step-Down Regulators with DDR Memory Now Offered in High Reliability H Grade & Military MP Grade to +150°C"

Telit Unwraps First Positioning Module Based on MediaTek’s Single Chip Multi-GNSS Receiver SoC Technology

December 19, 2013

RALEIGH, N.C. and LONDON – December 19, 2013 – Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services, today announced the market introduction of Jupiter SL869 V2, the second generation of one of its top performing positioning products. The new module is based on the low-power MT3333 from MediaTek. The complete multi-GNSS receiver features easy integration and superior battery-life performance, able to discover and simultaneously track multiple constellations. It also delivers a high-sensitivity RF front-end, enhancing reliability and functionality of geo-location aware consumer, commercial and industrial devices.

The Jupiter SL869 V2 supports GPS, QZSS … Read More → "Telit Unwraps First Positioning Module Based on MediaTek’s Single Chip Multi-GNSS Receiver SoC Technology"

DTS-HD Decoder Now Available on Cadence Tensilica HiFi DSP Cores

December 18, 2013

CALABASAS, Calif.–DTS, Inc. (Nasdaq: DTSI), a leader in high-definition audio solutions and audio enhancement technologies, and Cadence Design Systems, Inc. (NASDAQ:CDNS), a leader in global electronic design innovation, today announced the availability of DTS’ all-new DTS-HD decoder for DTS-HD and DTS-HD … Read More → "DTS-HD Decoder Now Available on Cadence Tensilica HiFi DSP Cores"

Microchip Announces New 5 GHz 50 ohm Matched WLAN Front End Module for IEEE 802.11a/n/ac Applications

December 18, 2013

CHANDLER, Ariz., Dec. 17, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced its new 5 GHz, 50 ohm Matched WLAN Front End Module (FEM)—theSST11LF04—for high data rate mobile device applications. The SST11LF04 features a transmitter power amplifier, a receiver low-noise amplifier with bypass and a low-loss, single-pole two-throw antenna switch for 5 GHz WLAN connectivity into one integrated, compact 2.5×2.5×0.4 mm, 16-pin QFN package, making it ideal for high-data-rate mobile … Read More → "Microchip Announces New 5 GHz 50 ohm Matched WLAN Front End Module for IEEE 802.11a/n/ac Applications"