industry news archive
Subscribe Now

ADLINK Sets New Standard for Fanless Embedded Computing With Outstanding Performance, Manageability and Ruggedized Design

SAN JOSE, CA – January 22, 2014 – ADLINK Technology, Inc., a leading global provider of intelligent computing platforms, today announced its new Matrix MXE-5400 fanless embedded computer with industry-leading performance, based on 4th generation Intel® Core™ i7-4700EQ quad-core processor. The MXE-5400 delivers outstanding performance, excellent manageability, optimized connectivity, and rugged design in a compact package. Maintaining the ingenious design principles of ADLINK’s Matrix series for withstanding harsh environments, plus implementation of ADLINK’s proprietary SEMA (Smart Embedded Management Agent) remote management tool, the MXE-5400 maximizes manageability and security for a wide range of applications, making it an ideal solution … Read More → "ADLINK Sets New Standard for Fanless Embedded Computing With Outstanding Performance, Manageability and Ruggedized Design"

Pentek Introduces Industry’s First FMC/VPX Carrier with Optical Backplane Interface

  • 3U VPX FMC carrier with Virtex-7 FPGA
  • VITA 66.4 MT optical backplane interconnect option
  • 4 Ch 250 MHz, 16-bit A/D, 2 Ch 800 MHz, 16-bit D/A FMC module
  • Ruggedized versions for harsh military environments available

PHOENIX, AZ, Embedded Tech Trends?January 20, 2014?Pentek, Inc., today introduced the first members of its Flexor™ line of FMC (FPGA Mezzanine Card) carriers and FMC modules: the Model 5973 3U VPX FMC carrier with a Virtex-7 FPGA and the Model 3312 multichannel, high speed data converter FMC. They combine the high performance … Read More → "Pentek Introduces Industry’s First FMC/VPX Carrier with Optical Backplane Interface"

Zuken’s global conferences harness the “Power of Innovation”

23 January 2014 – Munich, Germany and Westford, MA, USA – Zuken announces the expansion of its annual Zuken Innovation World conferences following the success of previous years. This year’s theme is “Power of Innovation”, which has already inspired confirmed speakers from companies around the globe.

The call for papers for North American and European conferences is now open and the conference programs are taking shape. Incorporating sessions presented by Zuken technology experts, customers, and industry partners, the previous conference series drew more than 1,200 attendees around the globe. Registration for … Read More → "Zuken’s global conferences harness the “Power of Innovation”"

Low-Cost Bluetooth® Smart Starter Development Kit Launched by CSR

San Jose, California and Cambridge, UK –CSR plc (LSE: CSR; NASDAQ: CSRE) today announces the launch of a new low-cost development kit aimed at developers looking to get Bluetooth® Smart prototypes up and running fast then move quickly to production. Based on the proven CSR µEnergy® platform, the Starter Development Kit provides a complete environment for … Read More → "Low-Cost Bluetooth® Smart Starter Development Kit Launched by CSR"

Silicon Labs to Unveil Ultra-Low-Energy Solutions for the Internet of Things at Embedded World

AUSTIN, Texas – Jan. 17, 2014 – Silicon Labs (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, will showcase an array of semiconductor, software and systems solutions for the Internet of Things market at Embedded World 2014 in Nuremburg, Germany, Feb. 25 – 27at Booth 4A-118. Targeting connected device applications for the IoT, the mixed-signal technology leader will demonstrate its latest energy-friendly ARM® based microcontrollers (MCUs), ZigBee® and sub-GHz wireless connectivity solutions, high-accuracy sensors and its next-generation embedded development platform.

“The embedded industry recognizes that 2014 will be the … Read More → "Silicon Labs to Unveil Ultra-Low-Energy Solutions for the Internet of Things at Embedded World"

Dialog Semiconductor collaborates with Qualcomm Technologies for higher efficiency rapid smartphone charging

London, UK, 20 January 2014 – Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC, solid state lighting and short-range wireless technologies, is debuting its high efficiency AC/DC adapter interface IC for Qualcomm® Quick Charge 2.0 power supplies. The new iW620 rapid charge interface IC resides on the secondary side of the AC/DC charger power supply and works with Dialog’s iW1760 PrimAccurateTM primary-side digital … Read More → "Dialog Semiconductor collaborates with Qualcomm Technologies for higher efficiency rapid smartphone charging"

Altera JESD204B Solutions Simplify Integration of Leading-edge Data Converters in FPGA-based Systems

San Jose, Calif., January 23, 2014 – Altera Corporation (Nasdaq: ALTR) today announced the availability of a broad range of JESD204B solutions designed to simplify the integration of Altera FPGAs and high-speed data converters in systems using the latest JEDEC JESD204B standard. The interface standard is used across many applications, including radar, wireless radioheads, medical imaging equipment, software defined radios and industrial applications. Altera’s JESD204B solutions include intellectual property (IP) cores, reference designs, development boards and interoperability reports for the industry’s latest data converters. … Read More → "Altera JESD204B Solutions Simplify Integration of Leading-edge Data Converters in FPGA-based Systems"

Industry’s fastest 16-bit DAC sprints to 2.5 GSPS, supports 12.5 Gbps JESD204B

DALLAS (Jan. 23, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today unveiled the industry’s fastest 16-bit digital-to-analog converter (DAC). The 4-channel, 2.5-GSPS DAC38J84 is 66 percent faster than the competition and supports the JEDEC JESD204B serial interface standard for data converters up to 12.5 Gbps. The pin-compatible 2-channel, 16-bit DAC38J82 also runs at 2.5 GSPS, 25 percent faster than existing 16-bit dual DACs. For more information about the DACs and to learn more about TI’s growing JESD204B portfolio, visit  Read More → "Industry’s fastest 16-bit DAC sprints to 2.5 GSPS, supports 12.5 Gbps JESD204B"

Xilinx Experts to Highlight High-Performance 7 Series and UltraScale FPGA Designs at DesignCon 2014

SAN JOSE, Calif.Jan. 22, 2014 — Xilinx, Inc. (NASDAQ: XLNX) experts will highlight high-performance FPGA design techniques including 28Gbps backplane transceiver design, 3D stacked silicon package design, and comprehensive DDR4 signal-integrity analysis using high-performance UltraScale™ FPGA silicon and packaging at DesignCon 2014. Through a series of tutorials and paper presentations, Xilinx experts will share their insights for overcoming system-design challenges and increasing system performance. Learn more about Xilinx® UltraScale multi-Gigabit transceivers, 3D stacked silicon, and advanced signal-integrity techniques atwww. … Read More → "Xilinx Experts to Highlight High-Performance 7 Series and UltraScale FPGA Designs at DesignCon 2014"

featured blogs
Jan 29, 2026
Most of the materials you read and see about gyroscopic precession explain WHAT happens, not WHY it happens....