World’s lowest power microcontrollers now deliver big benefits in tiny packages
DALLAS (April 7, 2014) – Enabling developers to save valuable board space, Texas Instruments (TI) (NASDAQ: TXN) today announced it has expanded the availability of tiny package sizes to several new families of ultra-low power MSP430™ microcontrollers (MCUs). Developers can now design smaller products with TI’s ultra-low power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in addition to the five existing MSP430 MCU families with tiny package options.
These tiny package sizes make MSP430 MCUs … Read More → "World’s lowest power microcontrollers now deliver big benefits in tiny packages"

