News – Page 1665 – EEJournal

Reference Design from MaxLinear and STMicroelectronics to Speed Multi-Channel Ultra HD HEVC Satellite STB & Gateway Deployments

April 3, 2014

Carlsbad, CA and Geneva, Switzerland – April 3, 2014 – MaxLinear Inc. (NYSE: MXL), a leading provider of integrated radio frequency (RF) and mixed-signal integrated circuits for broadband communications applications, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announce a reference design aimed at accelerating the adoption of next-generation Ultra HD set-top boxes (STB) and gateways for satellite pay-TV operators worldwide.

The reference design accelerates OEM development of the next-generation of STBs and gateways, enabling satellite operators to deliver Ultra HD content using the high-efficiency video-coding (HEVC/ H.265) standard. The advanced design, combining … Read More → "Reference Design from MaxLinear and STMicroelectronics to Speed Multi-Channel Ultra HD HEVC Satellite STB & Gateway Deployments"

Avnet Electronics Marketing Americas Joins with Microsemi to Open New Application Design Centers That Deliver Mainstream System Solutions Using Microsemi SmartFusion2 and IGLOO2 as Well as Other Leading-Edge Microsemi Products

April 3, 2014

PHOENIX– April 3, 2014 — Avnet Electronics Marketing Americas, a business region of Read More → "Avnet Electronics Marketing Americas Joins with Microsemi to Open New Application Design Centers That Deliver Mainstream System Solutions Using Microsemi SmartFusion2 and IGLOO2 as Well as Other Leading-Edge Microsemi Products"

Econais Launches the World’s Smallest, Smartest and Most Integrated Wi-Fi (SiP) Module.

April 2, 2014

SAN JOSE, Calif., April 2, 2014 — Econais Inc., the technology leader in smart ultra low power miniature Wi-Fi module solutions for the Internet of Things, today announced the EC19W01, world’s smallest, smartest and most integrated 802.11b/g/n Wi-Fi System In Package (SiP) module. The EC19W01 offers low power drain and features fully integrated MCU, Wi-Fi, cloud connectivity, flash and antenna that is fully certified FCC, EC, IC, and TELEC. Think WiSmart.

The EC19W01 incorporates the latest Wi-Fi 802.11b/g/n standards and features … Read More → "Econais Launches the World’s Smallest, Smartest and Most Integrated Wi-Fi (SiP) Module."

Green Hills Software Announces IoT Security Advisors Program

April 2, 2014

Green Hills Software, the largest independent software supplier for the Internet of Things (IoT), has announced the launch of a new services group, IoT Security Advisors, comprised of security experts from all of Green Hills Software’s business units to provide security services for organisations that must manage the daunting privacy and security challenges associated with the IoT.

The IoT Security Advisors group is the only security organisation with experts that have successfully achieved certification to IEC 15408 (Common Criteria) Evaluation Assurance Level 6+, High Robustness, the highest software security level ever attained. All other … Read More → "Green Hills Software Announces IoT Security Advisors Program"

Pyxalis adopts Cortus APS cores for smart CMOS image sensors

April 2, 2014

Montpellier, France and Grenoble, France, 2nd April 2014 – Cortus, a technology leader in low power, silicon efficient, 32-bit processor IP, and CMOS image sensor solution company, Pyxalis, announce that Pyxalis has been using Cortus APS cores in multiple design projects.

In a range of high performance image sensor designs, Pyxalis has used Cortus processor subsystems for a high level of software integration dedicated to sensor operation management. The processors offer the possibility to integrate more application-specific … Read More → "Pyxalis adopts Cortus APS cores for smart CMOS image sensors"

STMicroelectronics Extends STM32Cube™ Development Platform to Support Market-Proven STM32 F2 Microcontrollers

April 2, 2014

Geneva, April 2, 2014 – STMicroelectronics has released a further set of middleware for its STM32Cube™ development platform announced in February, allowing developers to target STM32 F2 120MHz ARM^® Cortex^®-M3 microcontrollers. TheSTM32Cube is currently available for the STM32 F2 and F4 series and further releases will roll out during 2014, extending support to all STM32 devices.

The new middleware, when combined with the generic low-level drivers and Read More → "STMicroelectronics Extends STM32Cube™ Development Platform to Support Market-Proven STM32 F2 Microcontrollers"

Coventor Enhances SEMulator3D Virtual Fabrication Platform To Address Advanced 3D Process Development Challenges

April 2, 2014

CARY, North Carolina – March 31, 2014 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the immediate availability of the SEMulator3D® 2014 software platform. The latest version of the integrated modeling tool enhances the visibility, accuracy and performance with which engineers can analyze next-generation manufacturing technologies, and dramatically reduce the time and cost of traditional build-and-test silicon learning cycles in the 3D era.

A key feature of the 2014 release is the ability to quickly and precisely model pattern dependent etch effects, which are critical to a new generation of 3D … Read More → "Coventor Enhances SEMulator3D Virtual Fabrication Platform To Address Advanced 3D Process Development Challenges"

Zuken strengthens industry’s only product-centric design solution

April 1, 2014

1 April 2014 – Munich, Germany and Westford, MA, USA – Zuken’s CR-8000, the industry’s only product-centric design solution, continues to lead the way with next-generation tools capable of creating today’s and tomorrow’s complex product designs. Design Gateway and Design Force – the core of Zuken’s CR-8000 2D/3D multi-PCB and IC packaging design solution (which was introduced in 2011) – contain enhancements that include significant new placement and routing functionality for both conventional and high-speed designs, 3D mechanical enclosure clearance checking, and interfaces to third party simulation tools.

Mentor Graphics Announces the Questa X-Value Verification Solution

April 1, 2014

WILSONVILLE, Ore., April 1, 2014—Mentor Graphics Corp. (NASDAQ: MENT), today announced availability of a new solution for X-value verification in register transfer level (RTL) and gate level designs. X-values are symbols that represent unknown voltage levels of signals in digital IC designs. The latest version of the Questa® Verification Platform links simulation and formal verification capabilities to deliver complete X-value analysis and debug, which helps an IC design team avoid the risk of silicon and simulation failure. These new capabilities target both of the problematic effects of … Read More → "Mentor Graphics Announces the Questa X-Value Verification Solution"

Xilinx Enables “Softly” Defined Networks with New Software Defined Specification Environment

April 1, 2014

LAS VEGAS, March 31, 2014 — At Interop Las Vegas, Xilinx, Inc. (NASDAQ: XLNX) today announced the industry’s first solution for “Softly” Defined Networks, expanding programmability and intelligence from the control to the data plane. The design of the programmable data plane functions is enabled by the new Software Defined Specification Environment for Networking (SDNet), with functional specifications automatically compiled into Xilinx’s All Programmable FPGAs and SoCs.

In contrast to traditional SDN architectures, which employ fixed data plane hardware with … Read More → "Xilinx Enables “Softly” Defined Networks with New Software Defined Specification Environment"

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