News – Page 1637 – EEJournal

TI speeds and simplifies design of automotive emergency call systemswith new reference design

March 21, 2013

DALLAS (March 20, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a complete reference design that provides designers all the analog and embedded processing integrated circuits (ICs) required for automotive emergency call (eCall) systems. Vehicles equipped with eCall systems will automatically place calls to an emergency service center in the event of an accident. Customers can accelerate the design of their eCall systems by taking advantage of this reference solution comprised of AEC-Q100 qualified analog ICs from TI.

Featuring the TPA3111D1-Q1 high efficiency mono Class D audio amplifier and the TPS43330-Q1, single-boost, dual synchronous buck … Read More → "TI speeds and simplifies design of automotive emergency call systemswith new reference design"

NXP Unveils GreenChip for Compact, Energy-Efficient Mobile Charging

March 21, 2013

Eindhoven, Netherlands and Long Beach, California, March 20, 2013 – While the line between “smartphones” and “tablets” becomes increasingly blurry, it’s clear that the charger for either device needs to be as small, lightweight and efficient as possible. At APEC 2013 today, NXP Semiconductors N.V. (NASDAQ: NXPI) introduced its new GreenChip™ solution designed to make smartphone and tablet chargers more compact, energy-efficient and cost-effective – without sacrificing reliability. Used together, the GreenChip TEA1720A and TEA1705 are high-performance, … Read More → "NXP Unveils GreenChip for Compact, Energy-Efficient Mobile Charging"

QuickLogic’s ArcticLink III VX6 Supports Embedded and External Displays from a Single Processor Display Output

March 20, 2013

Drive on-board display and HDMI/MHL transmitters from a single Application Processor display signal
Includes display bridging functions for seamless connectivity of varying interfaces
Integrated VEE and DPO technologies allow for sunlight viewability & system-level power savings

Sunnyvale, CA – March 20, 2013 – QuickLogic Corporation (NASDAQ: QUIK), the innovator in low-power Customer Specific Standard Products (CSSPs), announced today the immediate availability of its new ArcticLink® III VX6 solution platform device. This product integrates … Read More → "QuickLogic’s ArcticLink III VX6 Supports Embedded and External Displays from a Single Processor Display Output"

IAR Systems makes major updates to leading tools for low-power Renesas MCUs

March 20, 2013

Uppsala, Sweden—March 19, 2013—Today, IAR Systems® releases a new version of its development tool suite IAR Embedded Workbench for Renesas RL78. The new version 1.30 adds a large amount of new functionality for code writing and debugging.

For simplified code writing, the new version uses IAR Systems’ new text editor and source browser, which includes user-friendly features such as auto-completion, parameter hints, code folding, block select and indent, bracket matching, zooming and word/paragraph navigation. Also added is project connections functionality for automated integration with device configuration tools. This makes it possible to import … Read More → "IAR Systems makes major updates to leading tools for low-power Renesas MCUs"

TI’s flyback controller surpasses Energy Star 5 standby power requirementsfor 10- to 65-W AC adapters

March 20, 2013

DALLAS (March 19, 2013) – Expanding its line of energy-efficient, no-load adapter power controllers, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the industry’s first flyback controller that exceeds Energy Star 5 standby power requirements for 10- to 65-W AC/DC adapters used with notebooks, motor control, smart meters, micro-inverters and other high-powered applications. Used in conjunction with TI’s award-winning WEBENCH^® online design tool, the LM5023 flyback controller simplifies and speeds high-voltage DC/DC designs. For more information, visit: Read More → "TI’s flyback controller surpasses Energy Star 5 standby power requirementsfor 10- to 65-W AC adapters"

RoweBots MCU Wireless Connectivity Becomes Latest Addition to the Embedded Software Store

March 20, 2013

WATERLOO, Canada, March 18, 2013— RoweBots Research Inc., a leading supplier of tiny, embedded, Linux-compatible real-time operating system (RTOS) products, today announced the availability of its Unison™ OS wireless components on the Embedded Software Store (ESS). These components provide out of the box support for Wi-Fi, Bluetooth, UHF, cellular networks and 6loWPAN for wireless connectivity in just 10 minutes for either free evaluation or commercial licensing.

Wireless protocols provide one of the key building blocks embedded designers need to implement Internet of Things (IoT) applications focused on the edge, that require both sensor technologies and low energy MCU devices.

< … Read More →

Remcom Announces Breakthrough MPI + GPU Technology for High-Performance Simulation of Massive Electromagnetic Calculations In XFdtd

March 20, 2013

State College, PA (PRWEB) March 20, 2013

Remcom announces a breakthrough in current industry standards for electromagnetic simulation performance with MPI + GPU technology and unlimited memory support for XFdtd® Electromagnetic Simulation Software (XF7). These capabilities are now available with the latest version of XF7, Release 7.3.1. By combining Message Passing Interface (MPI) technology with XStream® GPU Acceleration, multiple high-performance graphical processing units (GPUs) in separate computers can be linked … Read More → "Remcom Announces Breakthrough MPI + GPU Technology for High-Performance Simulation of Massive Electromagnetic Calculations In XFdtd"

New Ericsson power interface modules integrate digital communication abilities to simplify energy monitoring

March 20, 2013

New I2C- and PMBus-compliant Power Interface Modules optimized for AdvancedTCA Blade and embedded computing systems
Integrated input-current monitoring negates need for additional components
PIM delivers output power up to 648W
Optimized for high efficiency – typically 98.7% at 10A output load

Ericsson has announced an extension of its 3E digital power module family with two new digital-communication-bus-enabled 540-648W low-profile quarter-brick Power Interface Modules (PIMs). Compliant with the 300W de facto industry-standard footprint and offering both I2C- and PMBus-based serial bus communications, … Read More → "New Ericsson power interface modules integrate digital communication abilities to simplify energy monitoring"

Tektronix Real-Time Oscilloscopes to Achieve 70 GHz Performance

March 20, 2013

BEAVERTON, Ore., March 19, 2013 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that lab testing has shown that its next generation performance oscilloscopes – due for availability in 2014 – will deliver real-time bandwidth of 70 GHz, with significant upside potential. The new oscilloscope platform will deliver the performance and signal fidelity needed for applications such as 400 Gbps and 1 Tbps optical communications and fourth generation serial data communications. Tektronix also announced an investment program that will give customers a cost-effective migration path to the new platform.

The extraordinary gain in bandwidth performance, with improved signal fidelity, … Read More → "Tektronix Real-Time Oscilloscopes to Achieve 70 GHz Performance"

Silicon Craft Technology Introduces the Best Performing Half-Duplex Transponder Integrated Circuit

March 20, 2013

Silicon Craft Technology (SIC), a leading designer and supplier in the RFID IC industry, has proudly added the innovative and advanced SIC7999 product to its Life Form Identification line, which is compliant to the ISO 11784/5 Animal Id data structure.

The SIC7999 is a fully integrated Half-Duplex Radio Frequency Identification (RFID) ASIC IC, designed by taking advantage of SIC’s patented Energy Harvesting technique, which can achieve a 15% longer read range than its previous generation IC. According to the test results at the PTEC (Electrical and Electronics Product testing center), SIC7999 tags have been tested … Read More → "Silicon Craft Technology Introduces the Best Performing Half-Duplex Transponder Integrated Circuit"

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How Synopsys IP and TSMC’s N12e Process are Driving AIoT

May 8, 2024

Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....