News – Page 1634 – EEJournal

Tektronix Rolls Out HDMI 2.0 Compliance Test and Debug Support

June 10, 2014

BEAVERTON, Ore., June 10, 2014 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that a new Method of Implementation (MOI) leveraging a fully automated compliance test and debug solution for the recently released HDMI 2.0 specification has been approved by the HDMI forum as the official compliance solution. The Tektronix solution provides comprehensive coverage of the required HDMI 2.0 transmitter and receiver electrical PHY tests to ensure consistent interoperability between suppliers in this fast-growing industry.

Pentek Introduces Affordable Talon Value Series Recorders with Quick Delivery

June 10, 2014

Single-channel multiband recording and playback system
Provides 4 TB hot swappable storage
Real-time sustained recording and playback rates up to 400 MB/sec
Affordable recorder ships immediately from stock

UPPER SADDLE RIVER, NJ-June 9, 2014 – Pentek, Inc., today introduced the first member of the Talon^® recorder series, the Model RTV 2601 single-channel multiband recording and playback system. This recorder is part of the new Talon Value Series of rackmount recorders for laboratory and benign environments.

The RTV 2601 represents Pentek’s best value in … Read More → "Pentek Introduces Affordable Talon Value Series Recorders with Quick Delivery"

QuickLogic Announces Wearable-Specific Sensor Hub Gesture Algorithms

June 10, 2014

QuickLogic-developed “Tap-to-Wake” and “Rotate-Wrist-To-Wake” gesture algorithms to support wearable devices
Available with QuickLogic’s out-of-the-box S1 Wearables Catalog CSSP and
ArcticLink® 3 S1 sensor hub platforms, and designed with forward compatibility to silicon platform roadmap

Sunnyvale, CA June 9, 2014 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low-power programmable Customer Specific Standard Products (CSSPs), today announced the immediate availability of its new wearable-specific sensor hub gesture algorithms.

Delivering long battery life is critical for wearable devices. QuickLogic’s “Tap-to-Wake” and “Rotate-Wrist-To-Wake” algorithms … Read More → "QuickLogic Announces Wearable-Specific Sensor Hub Gesture Algorithms"

Spansion Eliminates Need for Batteries and Fuels a Greener Internet of Things with Energy Harvesting Solution

June 10, 2014

SUNNYVALE, Calif., June 5, 2014 /PRNewswire/ — Spansion Inc. (NYSE: CODE), a global leader in embedded systems, today announced a new family of power management integrated circuits (PMICs) for energy harvesting that can enable a greener Internet of Things (IoT) by eliminating the need for or extending the life of batteries in a multitude of IoT devices from individual wearable electronics to the nodes in wireless sensor networks.</ … Read More → "Spansion Eliminates Need for Batteries and Fuels a Greener Internet of Things with Energy Harvesting Solution"

Agilent Technologies Announces Collaboration with Nippon Avionics to Develop Enhanced Thermal Imager Solutions

June 10, 2014

SANTA CLARA, Calif., June 9, 2014 – Agilent Technologies Inc. (NYSE: A) today announced its collaboration with Nippon Avionics (Avio) on the co-development of enhanced thermal imager solutions. The first product of their collaboration is the Agilent U5855A TrueIR thermal imager, ahandheld thermal imager solution.

The two companies jointly developed the unique U5855A, fusing the best of each company’s technology and expertise.

Avio, a provider of high-quality thermography solutions … Read More → "Agilent Technologies Announces Collaboration with Nippon Avionics to Develop Enhanced Thermal Imager Solutions"

Semtech Announces Hybrid Memory Cube Compliant PHY IP

June 10, 2014

CAMARILLO, Calif., June 10, 2014—Semtech Corporation (NASDAQ: SMTC) today announced the company has successfully completed electrical compliance testing of its Snowbush^® 28nm Platform Physical Layer IP, in support of the Hybrid Memory Cube (HMC) specification for ultra fast, next-generation memory.

The Snowbush Platform IP has met the interoperability requirements of the HMC standard with significant margin and passed the rigorous testing required by Micron, a co-founder of the Hybrid Memory Cube Consortium. This ensures compliance and enables system designers to deploy I/O … Read More → "Semtech Announces Hybrid Memory Cube Compliant PHY IP"

Texas Instruments creates new power line communication (PLC) modems to support all three major standards across multiple spectrum bands

June 10, 2014

DALLAS (June 10, 2014) – Easing the burden of supporting multiple regions with one device, Texas Instruments (TI) (NASDAQ: TXN) today announced a new power line communication (PLC) modem platform that supports the G3, PRIME and IEEE-1901.2 standards across both CENELEC and ARIB frequency bands. The new optimized TMDSPLCKITV4 kits provide developers with a smaller low-cost design to evaluate any narrowband orthogonal frequency-division multiplexing (OFDM) PLC technology standard for use in a variety of industrial systems such as smart grid … Read More → "Texas Instruments creates new power line communication (PLC) modems to support all three major standards across multiple spectrum bands"

Avnet Electronics Marketing Introduces New Artix-7 50T FPGA Evaluation Kit

June 10, 2014

PHOENIX– June 10, 2014 — Avnet Electronics Marketing, an operating group of Read More → "Avnet Electronics Marketing Introduces New Artix-7 50T FPGA Evaluation Kit"

Imec and Samsung Join to Accelerate Innovation in Digital Health with New Open Reference Sensor Module

June 9, 2014

Imec Technology Forum—BRUSSELS (Belgium)— June 6, 2014 — Imec, the world-leading nano-electronics research center announced that it is collaborating with Samsung Electronics to accelerate innovation and collaboration among technology companies and researchers working in the burgeoning mobile wearable field.

The announcement comes as part of Samsung’s recently announced digital health initiative, which aims to facilitate the development of wearable sensors that can help users gain new insights into their own wellness and enable them to live healthier lives. A centerpiece of the announcement is Samsung’s Simband platform, which includes an open reference sensor module … Read More → "Imec and Samsung Join to Accelerate Innovation in Digital Health with New Open Reference Sensor Module"

congatec launches new computer modules offering yet greater performance per watt

June 9, 2014

San Diego, California, June 4th, 2014 * * * congatec, Inc., a leading technology and ODM company for embedded computer modules and single board computers, has expanded its Qseven and COM Express product range with modules based on the 2-nd generation of AMD Embedded G-Series SOC (System-on-Chip) processors. Compared to the current AMD Embedded G-Series SOC platform, they provide higher performance and a lower power draw thanks to an improved Jaguar+ CPU architecture and AMD RadeonT 8000 graphics core. Graphics engine speed has been increased up to 800 MHz and the DDR3 interface up to 1866 MT/s. A new function of the G-Series includes … Read More → "congatec launches new computer modules offering yet greater performance per watt"