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IAR Systems provides support for Texas Instruments’ new EnergyTrace technology

June 24, 2014

Uppsala, Sweden—June 24, 2014—Today, IAR Systems® announces that early support for Texas Instruments new EnergyTrace technology is available in the world-leading development toolchain IAR Embedded Workbench for MSP430. By combining IAR Systems’ excellent Power Debugging technology with Texas Instruments’ EnergyTrace, developers are able to investigate and optimize power consumption and fully take advantage of the ultra-low-power capabilities of the MSP430 microcontrollers. 

Power Debugging provides software developers with information about how the software implementation in an embedded system affects system level power consumption. Because software … Read More → "IAR Systems provides support for Texas Instruments’ new EnergyTrace technology"

Imec Joins Graphene Flagship

June 23, 2014

To coincide with Graphene Week 2014, the Graphene Flagship is proud to announce that today one of the largest-ever European research initiatives is doubling in size. 66 new partners are being invited to join the consortium following the results of a €9 million competitive call. While most partners are universities and research institutes, the share of companies, mainly SMEs, involved is increasing. This shows the growing interest of economic actors in graphene. The partnership now includes more than 140 organisations from 23 countries. It is fully set to take ‘wonder material’ graphene and related layered materials from academic laboratories to everyday use.</ … Read More → "Imec Joins Graphene Flagship"

Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes

June 23, 2014

MOUNTAIN VIEW, Calif., June 23, 2014 /PRNewswire/ —

Highlights:

  • HAPS Connect Program enables prototypers to leverage proven solutions from hardware and service vendors for fast prototype bring-up
  • Network of approved third party hardware and service vendors provides daughter boards that are optimized for HAPS systems
  • The initial partners of the HAPS Connect Program include Back9 Design, eInfochips, Fidus, Gigafirm, hd Lab and Sarokal

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used … Read More → "Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes"

Xilinx and Pico Computing Announce Industry’s First 15Gb/s Hybrid Memory Cube Interface

June 23, 2014

SAN JOSE, Calif., June 23, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) and Pico Computing, Inc., both members of the Hybrid Memory Cube Consortium (HMCC), today announced the industry’s first 15Gb/s Hybrid Memory Cube (HMC) interface for All Programmable UltraScale™ devices. The Xilinx® UltraScale™ devices support the full HMC bandwidth of 4 lanes, comprised of 64 transceivers running up to 15Gb/s. Pico Computing’s HMC controller IP yields exceptionally high memory bandwidth and outstanding performance/watt in a small … Read More → "Xilinx and Pico Computing Announce Industry’s First 15Gb/s Hybrid Memory Cube Interface"

Long-life Paper-Thin Batteries from STMicroelectronics to Power Tomorrow’s Tiny Tech

June 23, 2014

Geneva, June 23, 2014 – STMicroelectronics has begun limited production of its EnFilm™ advanced rechargeable batteries that are less than 0.25mm thick. These paper-thin batteries free designers from the constraints of standard battery sizes and are ideal for use in powering the next generation of personal technology and Internet-of-Things (IoT) devices.

At just 220µm thick and measuring 25.7mm x 25.7mm, ST’s EFL700A39 EnFilm™ solid-state lithium thin-film battery is perfectly suited for use in ultra-low-profile devices. Surface-mount terminals allow direct attachment to the circuit board, which simplifies assembly and … Read More → "Long-life Paper-Thin Batteries from STMicroelectronics to Power Tomorrow’s Tiny Tech"

Hillcrest Labs Selected by Coolpad for Low Power Sensor Hub in New Smartphones

June 23, 2014

Rockville, MD — June 23, 2014 — Hillcrest Labs today announced that Coolpad Group (previously China Wireless), the seventh-largest global smartphone OEM[1], is using Hillcrest’s sensor hub software to enable always on sensing on Coolpad smartphones. Specifically, Hillcrest’s Freespace(R) software will run on Atmel’s low-power microcontroller solutions to provide high performance sensor fusion, gesture recognition, and always on context awareness capabilities, with dramatically lower power consumption and extended battery life. Additional details, such as smartphone models or pricing, were not disclosed.

“Coolpad … Read More → "Hillcrest Labs Selected by Coolpad for Low Power Sensor Hub in New Smartphones"

Altera and Cavium Deliver Pre-Verified Packet Classification Solution for Networking Appliances

June 23, 2014

San Jose, Calif., June 23, 2014—Altera Corporation (NASDAQ: ALTR) today announced its Interlaken Look-Aside intellectual property (IP) core has been tested and is compatible with Cavium’s NEURON Search™ Processor. This deployment-ready, pre-verified solution provides networking OEMs a low-latency, high-performance packet interface for use in networking appliances, including routers, switches, firewalls, and security storage. The Interlaken Look-Aside IP core is offered today as part of Altera’s portfolio of best-in-class IP cores which are optimized to provide superior performance, latency and area utilization when integrated within Altera’ … Read More → "Altera and Cavium Deliver Pre-Verified Packet Classification Solution for Networking Appliances"

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control

June 23, 2014

SAN JOSE, Calif., 23 Jun 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and QNX Software Systems, a subsidiary of BlackBerry and a world leader in software platforms for in-car electronics, today announced that QNX has ported its QNX® Acoustics for Active Noise Control (ANC) software to the Cadence® Tensilica® HiFi Audio/Voice digital signal processing (DSP) core. The Tensilica HiFi Audio/Voice DSP from Cadence is available immediately.

QNX Acoustics for ANC is a high-performance software solution … Read More → "Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control"

X-FAB to Exhibit 3-Axis Inertial Sensor Technology at Sensors Expo 2014

June 20, 2014

ERFURT, Germany – Jun. 20, 2014 –

Who

X-FAB, the leading analog/mixed-signal and MEMS foundry

What

Will exhibit its open-platform MEMS 3-axis inertial sensor process that is now available for volume manufacturing. This MEMS technology is suitable for a wide range of applications such as mobile devices, consumer goods, games and toys, automotive and robotics applications, and industrial and medical equipment that use 3D accelerometers or gyroscopes. The 3-axis inertial sensor technology comes with a complete set of design rules, … Read More → "X-FAB to Exhibit 3-Axis Inertial Sensor Technology at Sensors Expo 2014"

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