News – Page 1619 – EEJournal

Introducing Thread: A New Wireless Networking Protocol for the Home

July 23, 2014

SAN RAMON, Calif. – July 15, 2014 – Recognizing the need for a new and better way to connect products in the home, seven companies today announced that they’ve joined forces to form the Thread Group (www.threadgroup.org) and develop Thread, a new IP-based wireless networking protocol. The charter of the Thread Group is to guide the adoption of the Thread protocol. Thread Group founding members consist of industry-leading companies including Yale Security, Silicon Labs, Samsung Electronics, Nest Labs, Freescale® Semiconductor, Big Ass Fans and ARM.

While currently available 802.15.4 networking technologies have their own advantages, each also has critical … Read More → "Introducing Thread: A New Wireless Networking Protocol for the Home"

Mentor Graphics Launches New Xpedition Data Management Design Solution to Ensure Flow-Wide PCB Data Accuracy, Integrity, and Security for the Enterprise

July 23, 2014

WILSONVILLE, Ore., July 23, 2014 —Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced its next offering in the new Xpedition® platform, the Xpedition Data Management (xDM) product suite. The xDM Design product suite provides a flow-wide information hub that manages the PCB design data that is created, reused, imported, or released from the Mentor Graphics® Xpedition Enterprise platform. As a single, comprehensive data management solution, the xDM Design solution manages design data for work-in-progress designs, and library … Read More → "Mentor Graphics Launches New Xpedition Data Management Design Solution to Ensure Flow-Wide PCB Data Accuracy, Integrity, and Security for the Enterprise"

Laird Offers Combined Solution for Rapid Integration of Bluetooth and Wi-Fi Connectivity

July 23, 2014

July 23, 2014 – Laird, a global technology company, announced the release of the 45 Series Enterprise-Grade Wi-Fi modules and Read More → "Laird Offers Combined Solution for Rapid Integration of Bluetooth and Wi-Fi Connectivity"

Compact vibration harvester power supply with highest efficiency opens door to “fix-and-forget” sensor nodes

July 23, 2014

LEUVEN (Belgium) – July 23, 2014 – OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency. The prototype will be demonstrated at the TECHNO-FRONTIER2014 exhibition in Tokyo from July 23rd tillJuly 25th. Combining OMRON’s electret energy harvester with a Holst Centre/imec power management IC, it can convert and store … Read More → "Compact vibration harvester power supply with highest efficiency opens door to “fix-and-forget” sensor nodes"

Intersil Announces Highly Accurate Digital Power Monitor Capable of Industry’s Widest Common Mode Input Voltage Range

July 23, 2014

Milpitas, Calif. – July 21, 2014 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the ISL2802x family of digital power monitors capable of supporting a wide common mode input voltage range of 0V to 60V. The ISL2802x family is comprised of three devices offering a range of capability including full featured bi-directional, high-side and low-side digital current sense and voltage monitors with a serial interface with a high level of integration. Precision measurements are enabled by an integrated 16-bit ADC. Available in a tiny solution footprint and with a wide … Read More → "Intersil Announces Highly Accurate Digital Power Monitor Capable of Industry’s Widest Common Mode Input Voltage Range"

ASSET and SoftIron collaborate on rapid debugging for 64-bit ARM-based enterprise servers using AppliedMicro’s X-Gene technology

July 23, 2014

Richardson, TX, and Southhampton, UK (July 23, 2014) ? ASSET® InterTech (www.asset-intertech.com) collaborated with SoftIron® Ltd., Southampton, UK, to quickly debug and bring up the industry?s first 64-bit ARM server motherboard based on AppliedMicro?s X-Gene® Server on a Chip?. SoftIron?s 64-0800 is an ultra-low power, high-performance server motherboard for the enterprise computing and data center market.

The development team at SoftIron selected ASSET?s SourcePoint? debugger because it gives … Read More → "ASSET and SoftIron collaborate on rapid debugging for 64-bit ARM-based enterprise servers using AppliedMicro’s X-Gene technology"

Best-in-Class Rad-Hard Devices from STMicroelectronics Boast Qualification for Use in US Projects

July 22, 2014

Geneva, July 21, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that it has added to its available JANS / JANSR^{^[1]} products a range of DLA (Defense Logistics Agency)-qualified JANSR bipolar transistors with additional up-screening at the recent Nuclear and Space Radiation Effects Conference (NSREC) in Paris. Best-in-class radiation hardness makes ST’s new transistors ideal for aerospace and Hi-Rel systems, including satellites, as well as nuclear physics and medical applications.</ … Read More → "Best-in-Class Rad-Hard Devices from STMicroelectronics Boast Qualification for Use in US Projects"

Real Intent Unveils Debug Enhancements in New Version of Ascent IIV for Static Verification of Digital Designs

July 22, 2014

SUNNYVALE, Calif. – July 22, 2014 – Real Intent, Inc., a leading provider of EDA software products today announced a new version of its Ascent Implied Intent Verification (IIV) tool for static functional analysis of digital IC designs, delivering new debug enhancements for users. Ascent products find elusive bugs and eliminate sources of uncertainty that are difficult to uncover using traditional Verilog or VHDL simulation, leading to both improved QoR and productivity of design teams.

Coilcraft Flyback Transformer for 30 Watt POE Plus Applications

July 22, 2014

Cary, IL, USA – Coilcraft’s Read More → "Coilcraft Flyback Transformer for 30 Watt POE Plus Applications"

5th International Workshop on Bismuth-containing Semiconductors hosted by the Tyndall National Institute

July 22, 2014

July 21^st 2014 – From the 21^st to the 23^rd July, Professor Eoin O’Reilly, Chief Scientist of the Tyndall National Institute, Cork, will chair the 5^th International Workshop on Bismuth-containing Semi-conductors, bringing together over fifty physicists, chemists, material scientists and engineers from around the world to discuss this emerging academic and industrial area.

The workshop is sponsored by the EU FP7 project, BIANCHO (Bismide and Nitride Components for High Temperature Operation). BIANCHO is a four-year, €2.19m European research project, working to tackle the energy challenges presented by the exponential growth … Read More → "5th International Workshop on Bismuth-containing Semiconductors hosted by the Tyndall National Institute"