ProPlus Design Solutions Strengthens Leadership Position with Re-Innovated, Long-Lived BSIMProPlus SPICE Modeling Platform
SAN JOSE, CALIF. –– November 5, 2014 –– ProPlus Design Solutions Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions, today introduced the latest release (2014.2) of the re-innovated BSIMProPlus™, the leading SPICE modeling platform for nanometer devices.
“Our goal was to continue our long-term commitment to our 100+ worldwide customers and strengthen BSIMProPlus’ leadership position with several key projects started a few years ago,” remarks Dr. Zhihong Liu, chairman and chief executive officer of ProPlus Design Solutions. “We achieved our goal, the result of our … Read More → "ProPlus Design Solutions Strengthens Leadership Position with Re-Innovated, Long-Lived BSIMProPlus SPICE Modeling Platform"

