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Kilopass’ XPM Antifuse Embedded Non-Volatile Memory IP Successfully Completes TSMC9000 Qualification for TSMC 55nm HV Process

Santa Clara, Calif. – September 3, 2014 – Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced successful TSMC9000 qualification of its XPM one-time programmable (OTP) antifuse eNVM IP core.  Kilopass eNVM IP provides cost-effective storage for applications that require few if any changes over the life of a product such as: boot code; encryption keys; and parametric data storage.

Kilopass antifuse technology in TSMC 55HV offers four major advantages over floating gate flash technology. First, unlike floating gate that is sensitive to temperature, antifuse offers wide temperature tolerance. Second, while floating … Read More → "Kilopass’ XPM Antifuse Embedded Non-Volatile Memory IP Successfully Completes TSMC9000 Qualification for TSMC 55nm HV Process"

Taoglas Unveils First Embedded 4X4 MIMO Antenna for IoT and M2M Applications that Delivers High Speed Wi-Fi Throughput

CTIA Super Mobility Week, Las Vegas, September 4, 2014 – TaoglasUSA, Inc. (www.taoglas.com), a provider of antenna solutions to the M2M and IoT market, today launched the Venti FXP.524 Embedded 4×4 MIMO Antenna, which is optimized to comply with the latest IEEE 802.11ac standard to deliver the fastest throughput speeds and highest bandwidth for Wi-Fi communication. The antenna solution is easy to install and integrate, and is the first to combine four high-efficiency, high-performance Wi-Fi antennas in one small, flexible, off-the-shelf … Read More → "Taoglas Unveils First Embedded 4X4 MIMO Antenna for IoT and M2M Applications that Delivers High Speed Wi-Fi Throughput"

QuickLogic Delivers First Smartphone and Wearable Sensor Hub with Under 150 microWatt Active Power and Programmable Flexibility

  • ArcticLink 3 S2 delivers 2X Customer Specific Programmable Logic Capacity, 4X Computational Performance, 4X Algorithm Capacity, 8X Sensor Data Buffer
  • Industry leading active power consumption of <150uW at 1.2V
  • Fully pin-for-pin and software-compatible with previous generation ArcticLink 3 S1

Sunnyvale, CA September 3, 2014 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), today introduced its new ArcticLink® 3 S2 platform, the second CSSP solution in its Sensor Hub roadmap.  This next-generation platform delivers double the customer-specific … Read More → "QuickLogic Delivers First Smartphone and Wearable Sensor Hub with Under 150 microWatt Active Power and Programmable Flexibility"

Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology

Ottawa, Canada – (September 4, 2014) – Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

“Sidense’s embedded one-time programmable memory macros have been licensed in customers’ designs from 0.18-micron down to 28nm and have been proven at the 20nm process node as well,” said Wlodek Kurjanowicz, Sidense Founder and CTO. “Our split-channel 1T-OTP macros were designed to be highly scalable with shrinking process nodes. It is gratifying to see our theories proven … Read More → "Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology"

Primary-Side Switcher from Diodes Incorporated Cuts Power Supply Size and Cost While Improving Efficiency and Performance

Plano, Texas – September 4th, 2014 – Diodes Incorporated has announced the AP3988 off-line, side-switching controller designed to cut costs and improve power supply performance in chargers, ADSL adapters and home appliance supplies.  By providing primary-side control, the device eliminates the requirement for opto-couplers and secondary-side control circuitry, reducing component count, board space requirements and cost.  Primary-side regulation results in higher efficiency with less heat generated in the power supply, which increases reliability. Additional benefits include improved output voltage and current accuracy, enhanced over-voltage and short-circuit protection, and better … Read More → "Primary-Side Switcher from Diodes Incorporated Cuts Power Supply Size and Cost While Improving Efficiency and Performance"

Altis Semiconductor and TSI Semiconductor join eSilicon’s online multi-project wafer quote system

SAN JOSE, Calif. — September 4, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of two foundries — Altis Semiconductor and TSI Semiconductor — to its automated, instant online quote system for multi-project wafer (MPW) shuttles. The service, accessed through user-friendly web or smartphone interfaces, instantly generates executable MPW quotes. Typically it can take up to a week to get a quote using the traditional manual process.

eSilicon’s Read More → "Altis Semiconductor and TSI Semiconductor join eSilicon’s online multi-project wafer quote system"

TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization

Highlights:

  • Output libraries meet TSMC’s stringent accuracy targets for 16nm FinFET STA correlation
  • 16nm FinFET v1.0 libraries characterized by Cadence solution are now deployed for production and STA tool certification
  • 16nm FinFET library characterization tool setting available at TSMC-Online

SAN JOSE, Calif., 03 Sep 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has adopted Cadence® solutions for 16nm FinFET library characterization. Developed in collaboration between Cadence and TSMC, the library characterization tool setting is available to TSMC … Read More → "TSMC Adopts Cadence Solutions for 16nm FinFET Library Characterization"

4DSP Announces Recent and Upcoming Improvements to its StellarIP FPGA Firmware Development Tool

September 4, 2014 – Austin, TX – 4DSP is proud to announce a number of improvements to StellarIP that expand its feature set while also making it more user-friendly. StellarIP is an essential productivity tool that simplifies FPGA firmware design by relying on proven IP cores. 4DSP reference designs leverage the extensive library of firmware at the heart of StellarIP to ensure that customers are up and running … Read More → "4DSP Announces Recent and Upcoming Improvements to its StellarIP FPGA Firmware Development Tool"

PLS’ Universal Debug Engine supports all functions of Freescale’s latest Qorivva automotive SoCs

Irvine / Lauta (Germany), September 4, 2014 – In parallel to Freescale’s presentation of its latest Qorivva derivates, PLS Programmierbare Logik & Systeme now provides system developers with its Universal Debug Engine (UDE) for the multicore System-on-Chips (SoCs) MPC5746M, MPC5777M, MPC5748G, MPC5746C, MPC77xK and MPC574xP. PLS is one of the first tool suppliers to offer development tools specifically optimized for the features and functions of these multicore SoCs.

Several already prepared configurations of the UDE ensure an uncomplicated first … Read More → "PLS’ Universal Debug Engine supports all functions of Freescale’s latest Qorivva automotive SoCs"

Taoglas Launches Iridium Certified Spartan M2M Smart Antenna Transceiver

CTIA Super Mobility Week, Las Vegas, Sept 4th, 2014 – For M2M and IoT companies working in oil & gas, mining, maritime, construction and emergency services, Taoglas, a leading M2M and IoT antenna provider, today launched an Iridium certified smart antenna transceiver that will leverage the Iridium® satellite network’s reliable, global, low-latency coverage to provide connectivity in remote or extreme environments. Called the Spartan STS.01, it includes an Iridium certified Taoglas antenna complete with an Iridium 9602 SBD … Read More → "Taoglas Launches Iridium Certified Spartan M2M Smart Antenna Transceiver"

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