News – Page 1599 – EEJournal

Mentor Graphics and TSMC Collaborate to Improve and Expand 20nm IC Physical Verification Offering

May 29, 2013

WILSONVILLE, Ore., May 28, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations. This joint effort has reduced Calibre® nmDRC™ 20nm signoff runtimes by at least a factor of 3X and memory requirements by 60% compared to initial design kits released last year. In addition, Calibre PERC™ N20 design kits are now available to TSMC customers as part of the companies’ ongoing collaboration for IC reliability improvement. The collaboration will continue as mutual customers ramp their releases of N20 production designs, with the goal of maintaining rapid turnaround … Read More → "Mentor Graphics and TSMC Collaborate to Improve and Expand 20nm IC Physical Verification Offering"

Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy And Automation Breakthroughs

May 28, 2013

CARY, North Carolina – May 28, 2013 – Coventor^®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced immediate availability of theSEMulator3D^® 2013 software platform. SEMulator3D 2013 brings unprecedented physical accuracy and predictive modeling capabilities to process development and integration. This milestone release expands the value of ‘virtual fabrication’ to the broader semiconductor … Read More → "Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy And Automation Breakthroughs"

ULIS launches thermal sensor array product line, within scope of European MIRTIC project

May 28, 2013

ULIS will demonstrate Micro80P, the first in a new generation of thermal sensor arrays, at Sensor & Test in Nuremburg, Germany, May 14 – 16, 2013 at stand 12502.

Veurey-Voroize, France, May 14, 2013 – ULIS, a manufacturer of high quality infrared (IR) imaging sensors for thermography, security & surveillance, automotive and military applications, announces today it will conclude the first of two phases in the MIRTIC (Micro Retina Thermal Infrared) project with the launch of the Micro80P™ thermal sensor array. The launch will take place at the Sensor & Test Fair in Nuremburg, Germany, May 14 – 16, 2013.

Micro80P is the first 80×80 … Read More → "ULIS launches thermal sensor array product line, within scope of European MIRTIC project"

Next Generation PCB Library Expert Released

May 28, 2013

Des Plaines, IL – PCB Libraries just release the next generation of the Footprint Expert, now called the “PCB Library Expert” version 2013 – an advanced software tool that will take component data and automatically create footprints and 3D models based on predefined settings.

The new Library Expert version 2013 now includes a “Footprint Designer” module, which allows users to create footprints for non-standard components with asymmetrical, arbitrary-style leads. “This breakthrough will basically double the amount of parts a user can create with this tool,” said Tom Hausherr, CEO and founder of PCB Libraries. “This newly developed module will enable users … Read More → "Next Generation PCB Library Expert Released"

Kilopass and UMC Align For Advanced 28nm IP

May 28, 2013

SANTA CLARA, Calif. and HSINCHU, Taiwan May 28, 2013 – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today jointly announced that they have signed a technology development agreement. The agreement calls for Kilopass to port its non volatile memory (NVM) Intellectual property (IP) to two of UMC’s leading edge 28nm processes: the High-K Metal Gate 28HPM in high demand by portable device system on chip (SoC) manufacturers and the poly … Read More → "Kilopass and UMC Align For Advanced 28nm IP"

Concept Engineering Adds SPEF Parasitic Netlist Interface to SpiceVision® PRO and StarVision® PRO

May 28, 2013

Freiburg, Germany—May 28, 2013 – Concept Engineering has added a new SPEF (standard parasitic exchange format) interface to their widely-installed debugging tools, SpiceVision® PRO and StarVision® PRO. SpiceVision PRO takes SPICE netlists and SPICE models and generates clean, easy-to-read transistor-level schematics, circuit fragments, and design documentation to speed up circuit design, circuit debugging and circuit optimization at the transistor level. StarVision PRO, an integrated debugging cockpit for Mixed-Signal design, makes … Read More → "Concept Engineering Adds SPEF Parasitic Netlist Interface to SpiceVision® PRO and StarVision® PRO"

First precise MEMS output measurement technique unveiled

May 28, 2013

Tuesday 14th May, Washington DC – The commercial application of MEMS, or micro-electro-mechanical systems, will receive a major boost today following the presentation of a brand new way to accurately measure the power requirements and outputs of all existing and future devices. The cheap and easy to apply technique will be presented for the first time today at the TechConnect World Conference 2013 by a research team from Laboratoire national de métrologie et d’essais (LNE) in France. The researchers believe it will help manufacturers improve product performance, develop new functionalities, reduce energy consumption of mass production, respond to market … Read More → "First precise MEMS output measurement technique unveiled"

Lattice’s Latest Design Software Enables Designers to Derive Big Benefits from Tiny FPGAs

May 28, 2013

HILLSBORO, OR – May 28, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced Lattice Diamond® v2.2 software, its flagship FPGA logic design software, and iCEcube2™ (v2013-03) software, the company’s design environment for the iCE40™ device family. These new releases support new additions to Lattice’s ultra-low density FPGA product line that are ideal for low-power, low-cost, space-constrained systems.

These software releases will also provide access to an array of additional new Lattice products. Moreover, iCE40 FPGA designers will now have a choice of synthesis tools … Read More → "Lattice’s Latest Design Software Enables Designers to Derive Big Benefits from Tiny FPGAs"

Avnet Electronics Marketing Releases Production-Grade ZedBoard

May 28, 2013

PHOENIX—May 28, 2013 — Avnet Electronics Marketing, an operating group of Read More → "Avnet Electronics Marketing Releases Production-Grade ZedBoard"

New power management IC from ams helps reduce thermal stress on processors in phones and tablets

May 28, 2013

Unterpremstaetten, Austria (28 May, 2013) – ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.

When paired with new AS3729 point-of-load regulators from ams, the highly-integrated AS3721 provides a complete power management system that offers a fast response to load transients for reliable processor performance, high efficiency, and flexible board layout.

The AS3721 and AS3729 are optimized for use with Tegra applications processors from Nvidia.

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