industry news archive
Subscribe Now

New ASSET InterTech eBook explains how QPI self-healing bus can hinder circuit board quality

Richardson, TX (December 17, 2014) ? According to a new eBook from ASSET® InterTech, circuit boards with self-healing buses like Intel® QuickPath Interconnect (QPI) can be a challenge to test and assure board quality unless JTAG boundary-scan (IEEE 1149.1) tests are included in manufacturing. ASSET (www.asset-intertech.com) is the leading supplier of debug, validation and test tools based on embedded instrumentation for software, chips and systems. 

?For circuit board manufacturers, self-healing can mean self-defeating,? … Read More → "New ASSET InterTech eBook explains how QPI self-healing bus can hinder circuit board quality"

Semtech Partners with Link Labs On New Radio Module Featuring Long Distance LoRa™ Technology

CAMARILLO, Calif., Dec. 17, 2014 — Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced it has teamed up with Link Labs, a wireless connectivity product design company based near Washington, D.C., for the LL-LP-20 radio module featuring Semtech’s LoRa™ long distance radio transceiver technology.

The Link Labs LL-LP-20, is a compact, low power, bidirectional radio module for the 915 MHz ISM band and 868 MHz frequency band, and features the LoRaMAC software stack for integration with … Read More → "Semtech Partners with Link Labs On New Radio Module Featuring Long Distance LoRa™ Technology"

Microsemi Announces Successful Completion of Nine NIST Cryptographic Algorithm Validation Program Certifications

ALISO VIEJO, Calif.—Dec. 16, 2015—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the completion of nine new National Institute of Standards and Technology (NIST) Cryptographic Algorithm Validation Program (CAVP) certifications.

The AES encryption/decryption, SHA message digest, HMAC message authentication code and ECC-CDH key establishment algorithms, whose implementations were certified, are all part of the NIST “Suite B” collection, with key and digest sizes approved for United States government use at up to the Secret Level, as well as for use in the private sector. The … Read More → "Microsemi Announces Successful Completion of Nine NIST Cryptographic Algorithm Validation Program Certifications"

Torquing Group Taps Lantronix xPico Wi-Fi Embedded IoT Enabling Solution to Help Aerial Nano Drone Fly at CES 2015

IRVINE, CA–(Marketwired – Dec 16, 2014) – UK-based Torquing Group has tapped Lantronix, Inc. (NASDAQ: LTRX), a leading global provider of smart IoT (Internet of Things) solutions, to provide secure, onboard Wi-Fi technology for its new Read More → "Torquing Group Taps Lantronix xPico Wi-Fi Embedded IoT Enabling Solution to Help Aerial Nano Drone Fly at CES 2015"

Library Expert Enhanced Support for Altium Designer

There have recently been major enhancements to the Library Expert’s output to Altium Designer. This latest update of the Library Expert (v2015) offers users a very streamlined method of creating high quality IPC-7351 compliant Footprints, 3D STEP models, and Footprint Attributes for Description and Height – simultaneously – in Altium Designer.

The new “Script” interface allows the Altium Designer user to import Footprints and 3D STEP into an existing library or a new library with one part at a time or 10,000 parts in minutes while automatically applying user-defined User Preferences for pad shapes for each component family, working … Read More → "Library Expert Enhanced Support for Altium Designer"

Synopsys and Imec Expand TCAD Collaboration to 5 nm and Beyond

MOUNTAIN VIEW, Calif. and LEUVEN, Belgium, Dec. 16, 2014 /PRNewswire/ — Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the expansion of its collaboration with nanoelectronics research center imec to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond. The agreement enables Synopsys to deliver accurate, process-calibrated models for its Sentaurus™ TCAD (technology computer aided design) tools to semiconductor manufacturers for use during 5-nm technology node research and development. This latest agreement … Read More → "Synopsys and Imec Expand TCAD Collaboration to 5 nm and Beyond"

PNI Sensor’s Becky Oh Explores Getting to Low Power and Maximum Functionality through Sensor Fusion at 2015 CES

What: Getting to Low Power and Maximum Functionality through Sensor Fusion – an executive industry panel representing the MEMS/sensors supply chain

When: January 6, 2015, from 3:30-4:30 p.m. A post-conference reception will be co-sponsored by PNI Sensor.

Where: Sensors & MEMS Technology conference track, presented by MEMS Industry Group, Venetian, Level 1, Marco Polo 702

Why:</ … Read More → "PNI Sensor’s Becky Oh Explores Getting to Low Power and Maximum Functionality through Sensor Fusion at 2015 CES"

Imec Demonstrates Broadband Graphene Optical Modulator on Silicon

SAN FRANCISCO—Dec. 15, 2014—At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed. Combining low insertion loss, low drive voltage, high thermal stability, broadband operation and compact footprint, the device marks an important milestone in the realization of next-generation, high-density low-power integrated optical interconnects.

Integrated optical modulators with high modulation speed, small footprint and broadband athermal operation are highly desired for future chip-level optical interconnects. … Read More → "Imec Demonstrates Broadband Graphene Optical Modulator on Silicon"

Crossbar Unveils Another Breakthrough Innovation Behind Its Ultra-High Density 3D RRAM Solutions at IEDM 2014

  • Enables very high-density storage solutions with faster response time and lower power consumption
  • Solves one of the greatest technical challenges faced by developers of high-density RRAM
  • Proven in silicon; signals Crossbar’s 3D RRAM readiness for commercialization of Terabyte storage-on-a-chip

SANTA CLARA, California, December 15, 2014 – Achieving another major milestone needed to bring terabyte storage-on-a-chip to market, Crossbar, Inc., a start-up company pioneering 3D Resistive < … Read More → "Crossbar Unveils Another Breakthrough Innovation Behind Its Ultra-High Density 3D RRAM Solutions at IEDM 2014"

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....