News – Page 1589 – EEJournal

AlpsElectric and Qualtré, Inc. Announce Partnership for Next Generation Inertial Sensors; Strengthen Relationship with Strategic Investment

June 12, 2013

Marlborough, Massachusetts, USA, 10 June 2013 – Alps Electric and Qualtré, Inc. announced a partnership to bring to market inertial sensors based on Qualtré’s disruptive Bulk Acoustic Wave Technology, and Alps Electric moved to strengthen their relationship with Qualtré by making a strategic investment in the company. The partnership combines the strong manufacturing capabilities and global sales resources of Alps Electric with the MEMS sensor development expertise of Qualtré. The two companies have had an ongoing relationship for a number of years, and executives from both companies believe that this partnership will provide customers with innovative products and outstanding customer support.</ … Read More → "AlpsElectric and Qualtré, Inc. Announce Partnership for Next Generation Inertial Sensors; Strengthen Relationship with Strategic Investment"

TowerJazz and CMOSIS Announce Ramp to Volume Production for CMOSIS’ 12-megapixel CMV12000

June 12, 2013

ANTWERP, Belgium and MIGDAL HAEMEK, Israel, June, 11, 2013 – CMOSIS, a leading independent developer and supplier of high end CMOS image sensors for professional imaging applications, and TowerJazz, the global specialty foundry leader, today announced the ramp to volume production for CMOSIS’ 12-megapixel CMV12000, following the very successful volume production earlier of its CMV products. In 2010, CMOSIS and TowerJazz announced collaboration on the CMV product line, the flagship product family of CMOSIS. Since its introduction, the CMV product family has been very successful in gaining market share.

CMOSIS’ off-the-shelf CMV12000 is manufactured in TowerJazz’s Fab-2 … Read More → "TowerJazz and CMOSIS Announce Ramp to Volume Production for CMOSIS’ 12-megapixel CMV12000"

Carbon Expands Reach of Model Swap Technology

June 12, 2013

ACTON, MASS. –– June 12, 2013 –– Carbon Design Systems®, the leading supplier of virtual prototype and secure model solutions, announced today that its latest release of SoCDesigner™ Plus has expanded the models eligible to be used with Swap & Play™.

The Swap & Play technology enables a virtual prototype to boot an operating system, such as Linux or Android, in seconds and then debug or optimize performance with 100% implementation accuracy. The latest release of SoCDesigner Plus enables designers a way to use fabric components … Read More → "Carbon Expands Reach of Model Swap Technology"

European Robotics Leader Successfully Deploys with ITTIA DB SQL

June 12, 2013

June 12, 2013 — Bellevue, WA — ITTIA, the leader in modern database software for embedded systems and smart devices, today announced the successful deployment of ITTIA DB SQL embedded in Cow Master, an intelligent animal health care robotics system. This deployment continues the company’s constant progress in the human-to-machine and machine-to-machine sector, providing a more sophisticated and modern means for manufacturers to create new systems suitable for a 21st century lifestyle.

The incomparable Cow Master is manufactured by a leading European specialist in industrial automation with robotic-feeding systems. Cow … Read More → "European Robotics Leader Successfully Deploys with ITTIA DB SQL"

Ericsson Regulated Quarter-Brick Module Raises the Bar to 750W for High-Power Datacom Applications

June 12, 2013

Industry’s first 750W Hybrid Regulated Ratio DC/DC converter
Quarter-brick module delivers high power density of 31.12W/cm3 per cm3 (508W per cubic inch)
Highly-innovative regulated-ratio topology module delivers high-efficiency flat-curve characteristics of up to 97%

Ericsson has unveiled an industry first with its new hybrid-regulated topology. The new PKM-NH platform is optimized for datacom board applications that have a 52V/54V system bus distribution and require regulated high-power quarter-brick-format intermediate bus converters able to deliver up to 750W.

To meet the challenge of packing a 750 … Read More → "Ericsson Regulated Quarter-Brick Module Raises the Bar to 750W for High-Power Datacom Applications"

Ranplan’s new in-building wireless network design and optimisation tools meet indoor data demand

June 12, 2013

London, UK – June 12th, 2013. With up to 80 percent of data traffic already being consumed indoors, Ranplan has launched iBuildNet® and iBuildNet-Fi® for in-building wireless network design, simulation, optimisation and deployment. The new Ranplan tools revolutionise the design of 2G/3G/4G(LTE) and Wi-Fi networks, along with Tetra and PMR systems for single buildings such as hotels, offices and shopping centres, as well as combined indoor-outdoor facilities including campuses, CBDs (Central Business Districts), stadiums, airports and stations. With powerful 3 … Read More → "Ranplan’s new in-building wireless network design and optimisation tools meet indoor data demand"

Imec and Holst Centre unveil fully-organic imager

June 12, 2013

Leuven (Belgium) – June 12, 2013 – At this week’s International Image Sensor Workshop (IISW 2013, Snowbird, US, June 12-16 2013), imec and Holst Centre present a large-area fully-organic photodetector array fabricated on a flexible substrate. The imager is sensitive in the wavelength range suitable for x-ray imaging applications.

Because of their very high absorption coefficient, organic semiconductors allow extremely thin active layers (10 to 50 nm). Also, given their low processing temperature, they can be processed … Read More → "Imec and Holst Centre unveil fully-organic imager"

Silicon Craft Technology Launches Revolutionary “NFC Enabler” Tag

June 12, 2013

Silicon Craft Technology, having successfully marketed the NFC product worldwide, has recently introduced and will soon launch the NFC Enabler (SIC4310), a dual-interface NFC tag that is compliant to ISO 14443A.

The SIC4310 is designed to be a protocol converter in relaying signals between RFID and the embedded world through UART interface. This device avails system designers to make existing UART devices NFC- enabled and provide a full bi-directional communication between them.

The SIC4310 is a fully integrated dual-interface NFC tag that is accessed by NFC/RFID devices and implantable … Read More → "Silicon Craft Technology Launches Revolutionary “NFC Enabler” Tag"

Xilinx Spotlights 100G & 400G Solutions for Smarter Networks at WDM Conference 2013

June 12, 2013

SAN JOSE, Calif., June 12, 2013 – Xilinx, Inc. (NASDAQ: XLNX) will demonstrate 400G (4x100G) OTN single-chip applications based on its All Programmable Virtex®-7 FPGAs and SmartCORE™ IP portfolio. These demonstrations highlight Xilinx’s commitment to helping customers scale their networks and deliver significant end-product differentiation. Optimized for high speed and low power, Xilinx OTN solutions make it possible for networks to be ever smarter and more programmable, configurable and adaptable. Visit Xilinx (stand #21) … Read More → "Xilinx Spotlights 100G & 400G Solutions for Smarter Networks at WDM Conference 2013"

Huanor Adopts Cypress’s EZ-USB® FX3™ Peripheral Controller For USB 3.0 Industrial Camera Development Kit

June 12, 2013

SAN JOSE, Calif., June 12, 2013, – Cypress Semiconductor Corp. (NASDAQ: CY) today announced that Beijing Huanor-Mingke Electronic Tech Center has selected Cypress’s EZ-USB^® FX3™ solution for the Huanor U3CAMEN USB 3.0 industrial camera development kit. The kit provides a complete hardware and software solution to accelerate designs with a Field Programmable Gate Array (FPGA), USB firmware, and device driver, enabling rapid development of 5-Megapixel USB 3.0 industrial cameras. The FX3 solution provides the kit with 5 Gbps USB 3.0 bandwidth, enabling streaming of high-definition images.

The Huanor U3CAMEN … Read More → "Huanor Adopts Cypress’s EZ-USB® FX3™ Peripheral Controller For USB 3.0 Industrial Camera Development Kit"

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