News – Page 1588 – EEJournal

Imec Presents Ultralow Power RFID Transponder Chip in Thin-Film Transistor Technology on Plastic at IEDM 2014

December 18, 2014

IEEE International Electron Devices Meeting (IEDM) 2014 (San Francisco)—Dec. 17, 2014 — At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip. Operating at sub 1V voltage and realized in thin-film transistor technology (TFTs) on plastic film, the chip paves the way for universal sensing applications, such as item level RFID tagging, body area networks (BAN) and environmental monitoring, that require prolonged remote autonomy, and ultimate thinness, flexibility and robustness.

One of the major drivers of the semiconductor industry is the Internet of Things (IoT). Market … Read More → "Imec Presents Ultralow Power RFID Transponder Chip in Thin-Film Transistor Technology on Plastic at IEDM 2014"

Econais Rolls Out New WiSmart EC19W01 Wi-Fi Software, Modules and Development Kits

December 18, 2014

SAN JOSE, Calif., Dec 18, 2014 — Econais Inc. (www.econais.com), the technology leader in smart Wi-Fi module solutions for the Internet of Things, today announced large-scale availability of the newest EC19W01 WiSmart software, modules and development kits.

The newest EC19W01 802.11b/g/n Wi-Fi modules offer lower power drain (12.33uA) and feature a fully integrated 32 bit MCU, Wi-Fi, cloud connectivity, flash memory and antenna certified for FCC, EC, IC, and RoHS/REACH.

For ease of use and configuration, the EC19W01 modules now support Apple … Read More → "Econais Rolls Out New WiSmart EC19W01 Wi-Fi Software, Modules and Development Kits"

Spansion and Sensoplex Launch High-Performance, Low-Power Wearable Development Platform

December 17, 2014

SUNNYVALE, Calif., Dec. 16, 2014 /PRNewswire/ — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions and Sensoplex, a world leader in the design and production of high performance wearable devices for sports, fitness, wellness and mHealth companies, today announced a partnership to jointly develop and market an evaluation and development kit platform (EVK and SDK) that will allow customers to quickly develop innovative wearable applications that can combine inertial, bio and environmental sensors, Bluetooth Low Energy (BLE), and ANT+[1] wireless protocols with ultra low-power processing. The companies will … Read More → "Spansion and Sensoplex Launch High-Performance, Low-Power Wearable Development Platform"

GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process

December 17, 2014

SAN JOSE, Calif., 17 Dec 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology. GLOBALFOUNDRIES utilized Cadence® tools exclusively to achieve 2.0GHz processor performance at typical operating conditions, which matched pre-silicon design performance predicted by Cadence Tempus™ Timing Signoff Solution analysis.

The Cadence tools used in this successful design … Read More → "GLOBALFOUNDRIES and Cadence Deliver First SoC Enablement Solution Featuring ARM Cortex-A17 Processor in 28nm-SLP Process"

PLDA ultra-compact System-on-Module Enables Lighthouse Imaging to Speed Up Design Turn-around for Image Acquisition and Processing

December 17, 2014

SAN JOSE, CA – December 16, 2014 – Lighthouse Imaging, which provides all-inclusive design and manufacturing services for medical imaging and visualization, is using PLDA’s SoMZ-7045 platform to create commercial products for their clients in record time. PLDA designs and sells intellectual property (IP) cores, prototyping tools and system-on-module components. SoMZ is a highly-integrated system-on-module based on the Xilinx Zynq-7045 All Programmable system-on-chip (SoC).

Featuring an ARM® dual-core Cortex®-A9 MPCore and up to 350K of advanced low-power FPGA logic cells, the Read More → "PLDA ultra-compact System-on-Module Enables Lighthouse Imaging to Speed Up Design Turn-around for Image Acquisition and Processing"

Industrial cybersecurity expert warns that not enough is being done to prevent risk of highly destructive cyberattack on critical infrastructure

December 17, 2014

Research Triangle Park, North Carolina, USA (16 December 2014) — Inadequate training and a culture of complacency among many owners and operators of critical infrastructure are significantly raising the risks of highly damaging cyberattack throughout the world.

That’s the viewpoint expressed by Steve Mustard, an industrial cybersecurity subject-matter expert of the International Society of Automation (ISA) and a UK registered Chartered Engineer and European registered Eur Ing and consultant with extensive development and management experience in real-time embedded equipment and automation systems.

Mustard, fresh off a trip to the Caribbean where he delivered a Read More → "Industrial cybersecurity expert warns that not enough is being done to prevent risk of highly destructive cyberattack on critical infrastructure"

IAR Systems reports major interest for integrated runtime analysis product

December 17, 2014

Uppsala, Sweden—December 17, 2014—IAR Systems announces that its runtime analysis add-on product C-RUN is gaining major interest from customers. The add-on is integrated with the complete development toolchain IAR Embedded Workbench for ARM and the number of customers who have downloaded evaluation versions of the tools with C-RUN now exceeds 30,000.

C-RUN was made available in May 2014. It is sold as an add-on product and performs runtime analysis by monitoring application execution directly within IAR Embedded Workbench. Thanks to the tight integration with the … Read More → "IAR Systems reports major interest for integrated runtime analysis product"

5A, 20VIN Step-Down µModule Regulator’s Entire Solution Fits within 0.5cm²

December 17, 2014

MILPITAS, CA – December 17, 2014 – Linear Technology launched the LTM4625, a 5A, 20V_IN step-down µModule® (micromodule) regulator in a 6.25mm x 6.25mm x 5.01mm BGA … Read More → "5A, 20VIN Step-Down µModule Regulator’s Entire Solution Fits within 0.5cm²"

Altium Announces Expanded Benefits to Subscription Customers

December 17, 2014

San Diego, California – December 17, 2014Altium Limited, a global leader in Electronic Design Automation, Native 3D PCB design systems (Read More → "Altium Announces Expanded Benefits to Subscription Customers"

Synopsys’ PrimeTime ADV Achieves Rapid Adoption for Fastest Timing Closure

December 17, 2014

MOUNTAIN VIEW, Calif., Dec. 17, 2014 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced its PrimeTime® ADV advanced timing closure and signoff solution has been adopted by more than 70 leading semiconductor companies and enabled more than 50 successful tapeouts in just nine months since it became generally available. The key to its rapid adoption is ease of integration into existing timing closure flows, fast turnaround time and the ability to significantly reduce the number of timing … Read More → "Synopsys’ PrimeTime ADV Achieves Rapid Adoption for Fastest Timing Closure"