News – Page 1588 – EEJournal

Analog Devices’ MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health

June 5, 2013

NORWOOD, Mass.– Analog Devices, Inc. (ADI) today introduced a wireless vibration sensing system that allows industrial systems operators to remotely monitor production equipment health, improve system performance, and reduce maintenance costs. The new networked system includes the Read More → "Analog Devices’ MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health"

Atrenta Ships 5.1 Release of SpyGlass® Platform

June 5, 2013

SAN JOSE, Calif — Jun 5, 2013 — Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, announced today the 5.1 release of its SpyGlass^® and GenSys^®platforms. The release contains significant usability improvement and enhancements to address complexity, size and performance challenges for the next wave of SoC designs. The release also offers unique new capabilities enabled by … Read More → "Atrenta Ships 5.1 Release of SpyGlass® Platform"

IAR Systems adds major new functionality to simplify development for Renesas V850 MCUs

June 5, 2013

Uppsala, Sweden – June 4, 2013 – Today, IAR Systems® launches a new version of its high-performance development tool suite IAR Embedded Workbench® for V850. In addition to improved optimizations and updated device support, version 4.10 adds plenty of user-friendly functionality. Further, the IAR C/C++ Compiler™ for V850 now supports the ISO/IEC 9899:1999 standard, known as C99.

Version 4.10 also adds IAR Systems’ new text editor and source browser. The new text editor include features such as auto-completion, parameter hints, code folding, block select, block indent, bracket matching, zoom and word/paragraph navigation, while the new source browser adds … Read More → "IAR Systems adds major new functionality to simplify development for Renesas V850 MCUs"

Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms

June 5, 2013

San Jose, CA, June 5, 2013 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has signed an agreement with Sensinode, a pioneer and world leader in technology and software solutions, to license 6LoWPAN software solutions that will enable the rapid development of smart, connected wireless products that help make up The Internet of Things.

In this agreement, Sensinode will license its 6LoWPAN stack and router solutions, the NanoStackTM 2.0 and NanoRouterTM 3.0, to be used with Atmel’ … Read More → "Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms"

MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013

June 5, 2013

ROSEMONT, Ill., June 5, 2013 (GLOBE NEWSWIRE) — MEMSIC Inc. (Nasdaq:MEMS), a leading sensor solution provider, announced today at Sensors Expo (Booth #417) the availability of its MMC246xMT Two-Axis Magnetic Sensor. This fully integrated high performance part is provided in a miniature 2.0 mm. x 2.0 mm. x 1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply. It offers the industry’s best performance at the lowest power consumption for a two-axis magnetic sensor, making it ideal for portable applications. Applications include electronic compassing, in-vehicle GPS assist, GPS wristwatches and industrial field measurements including traffic control … Read More → "MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013"

Ayla Networks Raises $5.4 Million, Unveils Platform to Allow Manufacturers to Create a New Generation of Connected Devices

June 5, 2013

June 5, 2013—Sunnyvale, Calif.—Ayla Networks, a leader in technology and cloud-based services for the Internet of Things, formally unveiled the Ayla Platform, which allows manufacturers and service providers to transform thermostats, appliances, lighting and other everyday products into interactive connected devices quickly, easily and economically.

SINA, the most recognized Internet brand name among Chinese communities globally with more 500 million registered users worldwide, has incorporated Ayla’s technology into its Wi-Fi Weather Station. The Sunnyvale, Calif.-based company also announced that it has raised $5.4 million in Series A financing led by investors Voyager Capital and Crosslink Capital.

< … Read More →

GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology

June 4, 2013

GLOBALFOUNDRIES announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs). Manufactured using GLOBALFOUNDRIES’ leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today’s electronic devices.

TSVs are vertical vias etched in a silicon wafer that are … Read More → "GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology"

Epitaxial SiC Films Grown on 300mm Si Wafers

June 4, 2013

NEWPORT, England and BRISBANE, Australia — The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on 300mm silicon wafers. This breakthrough is the result of over 10 years research at QMF on low temperature SiC deposition on silicon and the joint development by QMF and SPTS of a commercial reactor to extend the epitaxial growth process to commercial scale production of SiC coated silicon wafers.

ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor

June 4, 2013

June 4, 2013 – SAN JOSE, CA – Today ADLINK Technology, Inc., a leading provider of embedded computing products and application-ready intelligent platforms, announced availability of its initial offerings on the 4th generation Intel® Core™ processor family (formerly codenamed “Haswell”) with Intel® 8-series chipsets. The first products featuring the new generation processor are the Express-HL and Express-HL2 (COM Express®), NuPRO-E42 (PICMG 1.3), cPCI-3510 (CompactPCI®), and Matrix MXE-5400, enabling enhanced embedded applications in medical, defense, transportation, and industrial automation.

“The 4th generation Intel® Core™ processor-based platform allows ADLINK Technology to deliver up to double the graphics performance over … Read More → "ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor"

Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform

June 4, 2013

WATERLOO, Ontario – June 4, 2013 – Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices. The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

“Our MIDIS™ platform is a break-through … Read More → "Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform"

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