News – Page 1586 – EEJournal

Plextek Consulting appointed by Xilinx as Premier Design Services Partner

June 13, 2013

Cambridge, UK 13th June 2013: Plextek Consulting (Plextek) has announced today that it has earned a promotion to Premier tier in the Xilinx Alliance Program. This distinction elevates Plextek to among the top dozen Xilinx partners globally and confers significant benefits including elevated support and specialised training from Xilinx. With nearly 20 years’ experience delivering FPGA solutions to customers, Plextek has been recognised by Xilinx as its ideal partner to deliver full system level design and manufacturing service capabilities to existing and … Read More → "Plextek Consulting appointed by Xilinx as Premier Design Services Partner"

STMicroelectronics Reveals Longer-Lasting EEPROMs for Simpler, Tougher Systems

June 13, 2013

Geneva, June 13, 2013 – The latest EEPROM family from STMicroelectronics, the world’s no.1 EEPROM supplier, guarantees endurance of up to 4 million erase/write cycles – whereas competing devices offer only 1 million cycles giving designers extra freedom to update stored data more frequently and extend system lifetime, even at high temperatures.

ST’s advanced CMOSF8H 0.15 µm process is key to the EEPROM’s enhanced endurance. Devices are available in industrial or automotive-qualified variants with specified endurance of 4 million cycles per byte at 25°C, and 400,000 cycles per byte at 150°C. … Read More → "STMicroelectronics Reveals Longer-Lasting EEPROMs for Simpler, Tougher Systems"

Online simulation tool allows motor designers to evaluate TI’s InstaSPIN™-FOC breakthrough motor control technology

June 13, 2013

Houston, TX (June 13, 2013) – Today, Texas Instruments Incorporated (TI) (NASDAQ: TXN), unveils a free, interactive online simulation tool that enables motor designers to assess TI’s InstaSPIN™-field-oriented-control (FOC) technology. This online simulation allows users to fully evaluate TI InstaSPIN-FOC’s superior software-sensor-based “sensorless” control for variable speed and load applications using three-phase, synchronous or asynchronous motors. Within the online simulation, evaluators can select from a library of motors, customize speed and load profiles and obtain simulation results … Read More → "Online simulation tool allows motor designers to evaluate TI’s InstaSPIN™-FOC breakthrough motor control technology"

Microsemi Announces System Builder Design Tool for ARM-based SmartFusion2 SoC FPGA Designs

June 13, 2013

ALISO VIEJO, Calif.—June 13, 2013—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced SmartFusion®2 SoC FPGA users can now benefit from its newly released design tool, System Builder. System Builder is a powerful new design tool within the Libero System-on-Chip (SoC) Design Environment version 11.0 and is specifically targeted at accelerating customer definition and implementation of ARM®-based systems using SmartFusion2 SoC FPGAs.

“The System Builder tool significantly simplifies the design process for … Read More → "Microsemi Announces System Builder Design Tool for ARM-based SmartFusion2 SoC FPGA Designs"

Tektronix Showcases New and Enhanced Optical Test Solutions at ECOC 2013

June 13, 2013

BRACKNELL, UK – June 10, 2013 – Tektronix, the world’s leading manufacturer of oscilloscopes, announced today that the company will be showcasing a wide-range of optical test and measurement products at ECOC 2013 (Stand 638, Hall N8-N10), which takes place from 23.-25.09.2013 in London, UK. The Tektronix products on display will address a wide range of applications, from multi-channel pattern generation <http://www.tek.com/ppg3000> and multi-channel BERT testing <Read More → "Tektronix Showcases New and Enhanced Optical Test Solutions at ECOC 2013"

Fairchild Semiconductor’s Global Power ResourceSM Center Develops Innovative BLDC Motor Control Reference Design

June 13, 2013

SAN JOSE, Calif., – June 10, 2013 – R&D engineers worldwide face various issues as their local industries align with the global trend toward BLDC electric motors, transitioning away from traditional AC designs. To help designers meet these challenges, Fairchild Semiconductor’s (NYSE: FCS) China-based Global Power Resource^SM Center (GPRC) has developed a reference design for Brushless DC (BLDC) motor controller applications using SPM® smart power modules, and incorporating Power Factor Correction (PFC), to enable designers to simplify design, reduce Bill of Material (BOM) costs and develop rapid prototypes.</ … Read More → "Fairchild Semiconductor’s Global Power ResourceSM Center Develops Innovative BLDC Motor Control Reference Design"

Zenverge Works to Advance RDK Transcoding Architecture

June 13, 2013

SANTA CLARA, Calif., June 10, 2013 — Zenverge, a leading developer of advanced content networking ICs, announced today it is developing the first RDKtranscoder plugin.

The RDK from Comcast is a pre-integrated software bundle that creates a common framework for powering tru2way^®, IP or hybrid set-top boxes and gateway devices and accelerates the development and deployment of next-generation video services.

The RDK is supported by Zenverge’s ZN200, the world’s most advanced quad stream content networking system-on-chip (SoC) that can transcode up to four HD streams simultaneously with the least amount of DDR memory … Read More → "Zenverge Works to Advance RDK Transcoding Architecture"

Imec shows multiple enhancement options for next-generation FinFETs

June 13, 2013

Leuven (Belgium)– June 13, 2013 – At this week’s VLSI 2013 Symposium in Kyoto, Japan, imec highlighted
new insights into 3D fin shaped field effect transistors (FinFETs) and high mobility channels scaling for the 7nm and 5nm technology node.

At the VLSI 2013 symposium, imec presented the first strained Germanium devices based on a Si-replacement process, where a Ge/SiGe quantum-well heterostructure is grown by epitaxially replacing a conventional Si-based shallow trench isolation (STI). The technique allows for highly-versatile means of heterogeneous material … Read More → "Imec shows multiple enhancement options for next-generation FinFETs"

Arasan Chip Systems introduces USB 3.0 SSIC Bridge IP

June 13, 2013

San Jose, CA – June 12, 2013 – Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today the release of its SSIC Adapter IP, supporting the USB 3.0 specification for USB Superspeed Inter-Chip (SSIC).

The SSIC IP provides low power, high speed chip to chip interconnect which leverages existing investments in USB software and system investments. High performance and reduced power are achieved by using the MIPI® M-PHY as the physical layer interface. Leveraging the MIPI M-PHY power management, the SSIC interface lowers the active power and idle power. The SSIC adapter layer IP … Read More → "Arasan Chip Systems introduces USB 3.0 SSIC Bridge IP"

Altera Announces Breakthrough Advantages with Generation 10

June 12, 2013

Stratix 10 FPGAs and SoCs leverage Intel’s 14 nm Tri-Gate process and an enhanced architecture to deliver core performance two times higher than current high-end FPGAs, while enabling up to 70 percent power savings.
Arria 10 FPGAs and SoCs reinvent the midrange by simultaneously surpassing high-end FPGAs in performance while delivering 40 percent lower power than today’s midrange devices.

San Jose, Calif., June 10, 2013 –Altera Corporation (NASDAQ: ALTR) today introduced its Generation 10 FPGAs and SoCs, offering system … Read More → "Altera Announces Breakthrough Advantages with Generation 10"

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