News – Page 1575 – EEJournal

Imagination’s Ensigma Series4 universal communications IP cores shipping now to multiple licensees

June 27, 2013

London, UK – 27 June 2013 – Imagination Technologies (IMG.L), a leading multimedia, processor, communications and cloud technologies company, announces that its Ensigma Series4 radio processor unit (RPU) IP core family is now available for licensing, and has already been supplied to lead partners.

The new Series4 family of RPUs introduces a highly efficient and high-bandwidth architecture, enabling support for the most demanding communications standards such as 802.11ac 2×2 MIMO and DVB-T2 in an optimal and low-power implementation. By adding new highly-specialised data processors combined with a significantly upgraded internal data fabric, … Read More → "Imagination’s Ensigma Series4 universal communications IP cores shipping now to multiple licensees"

STMicroelectronics Launches Virtual Laboratory for Audio Innovators

June 27, 2013

Geneva, June 27, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is putting sophisticated audio design and evaluation capabilities within reach of all engineers using its SoundTerminal™ audio chips and digital MEMS microphones, by publishing a complete virtual audio laboratory that can be downloaded free of charge at www.st.com/apworkbench.

SEMATECH Advances Device Processing Techniques to Enable III-V Manufacturing

June 27, 2013

ALBANY, N.Y. – June 27, 2013 – SEMATECH announced today that researchers have made significant advances in post-epitaxial growth backside clean processing that will prepare III-V technology for high-volume manufacturing. The research leading to these accomplishments was conducted at SEMATECH’s facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, NY.

Following a two-year effort to improve process parameters and validating III-V on 200 mm Si VLSI process flows, technologists have identified the key mechanisms to enable a robust backside cleaning process and made significant progress in reducing the likelihood of process cross-contamination that could impact a high-volume … Read More → "SEMATECH Advances Device Processing Techniques to Enable III-V Manufacturing"

10A µModule Step-Down Regulator Delivers Full Current with 86% Efficiency at up to 83°C Ambient

June 27, 2013

MILPITAS, CA – June 27, 2013 – Linear Technology Corporation announces the LTM4649, a 10A step-down µModule® regulator with high operating efficiency and low temperature rise in a 9mm x 15mm x 4.92mm BGA (ball grid array) package. The LTM4649 requires no heat sink, airflow or output current derating at full power from 0°C to 83°C … Read More → "10A µModule Step-Down Regulator Delivers Full Current with 86% Efficiency at up to 83°C Ambient"

X-FAB Introduces New Analog/Mixed-Signal Reference Kit for Rapid Adoption of Advanced Cadence Design Flows

June 27, 2013

Erfurt, Germany – June 27, 2013 – Leading analog/mixed-signal foundry supplier X-FAB Silicon Foundries today announced its new A/MS Reference Kit supporting advanced methodology for analog/mixed-signal design. The Kit enables rapid adoption of constraint-driven design, mixed-signal simulation, floorplanning, schematic-driven layout, automated routing, timing-driven digital block implementation and signoff. It is entirely based on the latest mixed-signal flow from Cadence Design Systems, Inc., a leader in global design innovation.

The Kit includes an OpenAccess PDK to enable mixed-signal designs for 180nm and other technologies, … Read More → "X-FAB Introduces New Analog/Mixed-Signal Reference Kit for Rapid Adoption of Advanced Cadence Design Flows"

IAR Systems extends industry-leading ARM tools offering with support for Renesas Electronics’ new RZ family

June 27, 2013

Uppsala, Sweden—June 27, 2013—Today, IAR Systems® announces full coverage for the RZ/A ARM® Cortex™-A9 microprocessor units (MPUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugger features, including innovative Power Debugging technology, in a reliable and easy-to-use integrated development environment with excellent worldwide technical support.

Renesas’ RZ family of embedded MPUs is designed to meet the need for high-performance processing of 400 MHz and higher. The first launch in the family—the RZ/ … Read More → "IAR Systems extends industry-leading ARM tools offering with support for Renesas Electronics’ new RZ family"

Atmel Expands CryptoAuthentication Portfolio with Elliptical Curve Asymmetric Key Authentication Solutions

June 26, 2013

San Jose, CA, June 24, 2013 – Atmel Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the expansion of its CryptoAuthentication™ portfolio to include the ATECC108 solution with elliptical curve (ECC) asymmetric key algorithm.

Atmel’s ATECC108 solution delivers advanced security features to support some of the latest security standards from theNational Institute of Standards and Technology (NIST) including the P256, B283 and K283 … Read More → "Atmel Expands CryptoAuthentication Portfolio with Elliptical Curve Asymmetric Key Authentication Solutions"

New Cadence Energy-Efficient PCI Express IP Helps Reduce Power Consumption for Datacenter and Enterprise Applications

June 26, 2013

SAN JOSE, CA–(Marketwired – June 26, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTS: Cadence Design Systems, Inc. (NASDAQ: CDNS)

Innovative circuit calibration technique in new Cadence® PCI Express® 3.0 solution enables customers to meet aggressive active power goals.
Advanced power and clock management capabilities reduce standby current by 100X
Optimized transition time latency between active and sleep states

< … Read More →

Silicon Labs Introduces the Industry’s First Single-Die MEMS Oscillator

June 26, 2013

AUSTIN, Texas – June 26, 2013 — Silicon Labs (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most highly integrated MEMS-based oscillators designed to replace general-purpose crystal oscillators (XOs) in cost-sensitive, low-power and high-volume industrial, embedded and consumer electronics applications such as digital cameras, storage and memory, ATM machines, point-of-sale equipment and multi-function printers. The new Si50x oscillators are based on Silicon Labs’ patented CMEMS® technology – the first to enable MEMS structures to be built directly on top of standard CMOS wafers in high-volume fabs, resulting in fully integrated, highly reliable monolithic “CMOS+MEMS” IC … Read More → "Silicon Labs Introduces the Industry’s First Single-Die MEMS Oscillator"

Zuken improves design productivity and IP management with CR-8000 2013

June 26, 2013

25 June 2013 – Munich, Germany and Westford, MA, USA – Zuken addresses the needs of global design teams and their downstream partners with new versions of its Design Force and Design Gateway software, part of the CR-8000 multi-board design solution. With an emphasis on productivity enhancements and new intellectual property (IP) management capabilities, hardware engineers and PCB designers can collaborate efficiently and securely with all project participants. Design Force includes new embedded permission controls for … Read More → "Zuken improves design productivity and IP management with CR-8000 2013"

featured blogs

MaxLinear Is Staying at the Forefront of Connectivity Solutions with Cadence

Apr 19, 2024

In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...