Fairchild’s High-Current, High Efficiency MOSFETs Available in TO-Leadless Packaging for Automotive
SAN JOSE, Calif., March 2, 2015 /MobilityWire/ — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small … Read More → "Fairchild’s High-Current, High Efficiency MOSFETs Available in TO-Leadless Packaging for Automotive"

