ALAMEDA, Calif. & PHOENIX— September 4, 2013 — Wind River®, a world leader in embedded and mobile software, has entered into a distribution agreement with Avnet Embedded, a division of Read More → "Avnet Embedded and Wind River Announce Distribution Agreement in the Americas"
San Jose, Calif., and Boise, Idaho, September 4, 2013—Altera Corporation (NASDAQ: ALTR) and Micron Technology, Inc. (NASDAQ: MU) (“Micron”) today announced they have jointly demonstrated successful interoperability between Altera Stratix® V FPGAs and Micron’s Hybrid Memory Cube (HMC). This technology achievement enables system designers to evaluate today the benefits of HMC with FPGAs and SoCs for next-generation communications and high-performance computing designs. The demonstration provides an early proof point that production support of HMC will be delivered with Altera’s Generation 10 portfolio, in alignment with market … Read More → "Altera and Micron Lead Industry with FPGA and Hybrid Memory Cube Interoperability"
DALLAS (Sept. 3, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a low-power, half-duplex RS-485 transceiver with the fastest automatic bus-polarity correction time. In many industrial applications, such as e-metering networks, DMX512 networks, industrial automation, HVAC systems and process control, it is easy to connect wires incorrectly, which can cause system failure. For large networks, miswiring without quick correction can cause production delays, resulting in significant revenue loss. When hot-plugged, the SN65HVD888 provides cross-wire immunity 80 percent faster than the competition, detecting and correcting the bus polarity within 76 milliseconds of bus idling. For more information and to order samples, visit Read More → "TI introduces RS-485 transceiver with fastest automatic polarity correction"
Highlights:
SAN JOSE, Calif., Sept. 4, 2013—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981), mainland China’s largest and most advanced semiconductor … Read More → "SMIC Adopts Cadence Digital Flow with Advanced Features for Improving Area, Power and Performance"
CAMBRIDGE, Mass. – September 3, 2013 – Sand 9, Inc., today announced the first micro-electromechanical systems (MEMS) timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications such as 3G/4G cellular and GPS/GNSS as well as low-power wireless connectivity applications such as Bluetooth® Smart. Sand 9’s TM361 and TM061 are also the only timing products that support integration with mobile and wireless connectivity chipsets, conserving board space and reducing bill of materials.
“Our vision is to disrupt the timing market by completely eliminating … Read More → "Sand 9 Challenges Dominance of Quartz Timing Devices in Mobile Applications"
MILPITAS, CA – September 3, 2013 – Linear Technology announces the LTC5551, an ultrahigh dynamic range RF down-converting mixer for applications that demand the very best in performance. The LTC5551 offers very high linearity of +36dBm IIP3, (input third-order intercept), and low 9.7dB noise figure comparable to the highest IIP3 passive mixers available. Unlike passive mixers which typically have 7dB to 9dB of conversion loss, the LTC5551 boasts 2.4dB of conversion gain, substantially improving … Read More → "+36dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain"
Geneva, September 3, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is joining with sponsors Berkeley Sensor and Actuator Center, EEWeb, Electronic Engineering Journal, MEMS-Exchange, MEMS Industry Group, MEPTEC and Mouser Electronics to host a one-day interactive summit to discuss theFuture of MEMS and Sensors. The conference will be held on September 10, 2013 at the Marriot Hotel in Santa Clara, California.
The summit will feature more than 25 distinguished panelists and speakers, including business leaders and top technologists who will demonstrate how they are adopting sensors to enable applications, augment the user experience, … Read More → "MEMS and Sensors Summit Brings Industry Leaders Together to Share Opportunities to Shape the Future of Electronics"
Regensburg, Germany, 03 September 2013 — Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year’s Semicon West to demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus. Amicra will exhibit at TWTC Nangang Exhibition Hall in Booth 1024.
Amicra’s high-accuracy NOVA Plus and AFC system are perfectly suited for die and flip-chip processing including 3D and stack-die, covering the full scope of high-volume micro/nano assembly applications. They are … Read More → "Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013"
Geneva, September 3, 2013 – STMicroelectronics has unveiled its second generation of tandem diodes, which enable designers to cost-effectively enhance the energy efficiency of equipment such as power supplies, solar inverters, and e-transportation charging points.
Compared to first-generation devices, the new diodes have even lower reverse-recovery charge (QRR) to minimize switching losses, further extending their efficiency advantage over standard ultrafast diodes. The lower QRR also speeds up the fine-tuning of circuit designs, … Read More → "New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide"
WILSONVILLE, Ore., September 3, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced that Advanced Wireless Semiconductor Company (AWSC) has selected the Calibre® nmDRC™ and nmLVS™ products as their golden signoff physical verification solution for GaAs ICs targeted for mobile and other wireless applications. As part of their foundry offering, AWSC will provide the Calibre design rule decks to its customers to help them ensure their designs are error free and meet all foundry requirements before submitting them to AWSC manufacturing.
“We moved to Calibre … Read More → "Advanced Wireless Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs"
