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IAR Embedded Workbench supports new Renesas RX71M MCUs targeting the industrial Internet of Things

March 23, 2015

Uppsala, Sweden—March 23, 2015—IAR Systems® has released version 2.70 of its development toolchain IAR Embedded Workbench® for Renesas RX family of MCUs. In addition to new features including position-independent code and data, version 2.70 adds updated device support and example projects for the latest Renesas devices. The support includes the new Renesas RX71M group with advanced security features for the industrial Internet of Things. Renesas’ RX71M group addresses the critical importance of security in embedded design for industrial equipment where connectivity is added to more and more applications. IAR Systems is the only tool vendor to provide high-performance … Read More → "IAR Embedded Workbench supports new Renesas RX71M MCUs targeting the industrial Internet of Things"

Innodisk Unveils DDR4 Memory for Industrial Applications on Upcoming Skylake Platform

March 19, 2015

March 19, 2015 — Taipei, Taiwan – Innodisk, the service driven flash and DRAM provider, is introducing DDR4 memory modules designed for industrial applications on Intel’s upcoming Skylake platform. The new unbuffered long DIMM and compact SO-DIMM memory offerings will feature significantly lower power consumption and higher performance than comparable DDR3 modules and will have ECC error correction available for industrial and embedded applications. An extra thick 30u gold connector, on-board thermal sensors and conformal coatings make these JEDEC-compliant DDR4 modules especially suited for the next generation of industrial systems.

Better Embedded Performance</ … Read More → "Innodisk Unveils DDR4 Memory for Industrial Applications on Upcoming Skylake Platform"

Advantech Launches Compact, High Performance PICMG 1.3 Half-Size System Host Board

March 19, 2015

Irvine, CA, March 17, 2015—Advantech, the leading supplier of industrial systems, today announced its PCE-4 series, a breakthrough product line employing PICMG 1.3 half-size form factor and support for Intel® work station-grade CPUs which offer a higher base frequency than desk-top CPUs and ECC memory support. The first product, PCE-4128, supports Intel® 4th generation Xeon® E3, Core™i7/i5/i3 CPU and is equipped with 4th-gen Intel® C226 with ECC memory support offering an ideal solution for high performance industrial applications.

PCE-4128 fulfills the needs of applications requiring compact size, high performance and flexible expandability such as machine vision … Read More → "Advantech Launches Compact, High Performance PICMG 1.3 Half-Size System Host Board"

Xilinx Announces Availability of 100G RS-FEC IP for Data Center, Service Provider, and Enterprise Applications

March 19, 2015

SAN JOSE, Calif., March 18, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced availability of  its 100G IEEE 802.3bj Reed-Solomon FEC (RS-FEC) IP for data center, service provider, and enterprise applications. The 100G RS-FEC IP enables new emerging optical solutions such as SR4, CWDM4, PSM4 or ER4f. Using the Xilinx 100G IEEE 802.3bj RS-FEC LogiCORE™ IP,  customers can accelerate designs and be first to market while meeting the increased demands of mobile and cloud traffic. This solution also delivers on the … Read More → "Xilinx Announces Availability of 100G RS-FEC IP for Data Center, Service Provider, and Enterprise Applications"

Free Software Tool from STMicroelectronics Includes Accurate Dynamic Simulation for VIPower Devices

March 19, 2015

Geneva, March 19, 2015 –  TwisterSIM is a unique free software suite that includes a Smart Interactive Selector and a Dynamic Electro-Thermal Simulator for Automotive Low/High-side driver/switches and H-bridges for motor control built using ST’s proprietary VIPower™ technology. The tool allows complex evaluations with accurate dynamic simulations of load-compatibility, wiring-harness optimization, fault condition impact analysis, diagnostic behavior analysis and Dynamic Thermal performance in just a few clicks.

TwisterSIM considerably reduces the cost and time needed to select … Read More → "Free Software Tool from STMicroelectronics Includes Accurate Dynamic Simulation for VIPower Devices"

Software Development Kit for SmartMesh IP Accelerates Development of Wireless Sensor Industrial Internet of Things Applications

March 19, 2015

MILPITAS, CA – March 19, 2015 – Linear Technology’s SmartMesh IPTM wireless sensor networking products now provide the ability to program industrial Internet of Things (IoT) applications directly on the embedded ARM Cortex-M3, running Micrium’s µC/OS-II real-time operating system. Users no longer need a separate processor for sensor interface and edge data analytics, reducing the cost, footprint and power consumption of the integrated wireless sensor node. Application development time is accelerated with a library of reference code and source code examples. Based on 6LoWPAN, SmartMesh IP mesh networking products include a pre-compiled networking stack that delivers >99.999% network reliability at … Read More → "Software Development Kit for SmartMesh IP Accelerates Development of Wireless Sensor Industrial Internet of Things Applications"

Intersil Announces Industry’s First Fully Encapsulated 50A Digital Power Module

March 18, 2015

CHARLOTTE, N.C., March 16, 2015 – APEC – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions today announced the industry’s first 50A fully encapsulated digital DC/DC PMBus power module. The ISL8272M is a complete step-down power supply that delivers up to 50A of output current from industry standard 12V or 5V input power rails, and four modules can be combined to support up to 200A rails. It provides point-of load conversions for … Read More → "Intersil Announces Industry’s First Fully Encapsulated 50A Digital Power Module"

AVX Introduces High Performance Single Tine IDC Contacts for Harsh Environment Applications

March 18, 2015

GREENVILLE, S.C. (March 17, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced a single contact version of its proven 9176 Series insulation displacement connectors (IDCs), which are widely recognized for providing highly reliable, gas-tight wire-to-board connections in a range of harsh environment applications. Backward compatible with existing 9176 Series connectors with regard to contact and footprint, the new 9176-65X single tine IDC contacts exhibit the same robust, reliable performance the series is known for while reducing cost by 25%, width by 50% (2.5mm vs. 5.0mm), and height by 10% (5.05mm vs. 5.6mm), the latter of which is especially … Read More → "AVX Introduces High Performance Single Tine IDC Contacts for Harsh Environment Applications"

Mouser and Analog Devices Sponsor “Create the Future” Design Contest for Engineers

March 18, 2015

March 17, 2015 – Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, is once again sponsoring the 13th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser is being joined in this sponsorship by Analog Devices, Inc. The contest is produced by Tech Briefs Media Group, an SAE International Company.

Create 2015The grand prize winner will receive global recognition and a cash prize of $20,000 for an innovative product that benefits society and the economy. Previous contests have produced more than 10,000 design ideas from … Read More → "Mouser and Analog Devices Sponsor “Create the Future” Design Contest for Engineers"

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