News – Page 1514 – EEJournal

Exar Introduces Industry’s Lowest Power Fault Tolerant Transceivers with Level 4 IEC ESD Protection

November 12, 2013

Fremont, CA, November 12, 2013 – Exar Corporation (NYSE: EXAR), a leading supplier of high performance analog mixed-signal components and data management solutions, today announced the XR3070-78X family of ruggedized RS-485/RS-422 transceivers for harsh industrial environments. The analog bus pins can withstand direct shorts up to ±18V and are protected from ESD events exceeding IEC Level 4. Operating from 3.3V with an industry-leading 300?A idle current, these devices consume half the power of a comparable ±18V fault tolerant solution. The family of nine devices supports data rates … Read More → "Exar Introduces Industry’s Lowest Power Fault Tolerant Transceivers with Level 4 IEC ESD Protection"

STMicroelectronics Captures Top MEMS Awards from MEMS Industry Group

November 12, 2013

Geneva, November 11, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision. Adding to ST’s Company of the Year recognition, Executive Vice President and General Manager of ST’s Analog, MEMS & Sensors Group, Benedetto Vigna, was acknowledged as Executive of the Year, and the LSM303C 2mmx2mm … Read More → "STMicroelectronics Captures Top MEMS Awards from MEMS Industry Group"

Programmable 800 and 1500 Watt PSUs provides constant current output down to almost zero volts

November 12, 2013

XP Power today announced the HDS series of 800 and 1500 Watt highly efficient programmable AC-DC power supplies. With a typical efficiency of up to 93%, these single output low profile supplies measure 9.80 x 5.00 x 1.61 inches (249.0 x 127.0 x 40.9 mm) for the 800 Watt models and 11.02 x 5.0 x 2.5 inches (280 x 127 x 63.5 mm) for the 1500 Watt range and fit into an industry standard 1U or 2U profile. Two front mounted variable speed fans, included in the above dimensions, help conserve energy and keep noise to a minimum. The power density of these compact units is greater than 10 Watts per cubic inch.

ADLINK Launches Extreme Rugged™ HPERC-IBR for Reduced SWaP Requirements

November 12, 2013

SAN JOSE, CA – November 12, 2013 – ADLINK Technology, Inc., a leading provider of embedded computing products and Application Ready Intelligent Platforms (ARIP), today announced release of the new Extreme Rugged™ HPERC-IBRsystem. The HPERC™ Series is a high performance Extreme Rugged computer system offering a compact, highly reliable and efficient processing unit to meet challenging SWaP (Size, Weight and Power) requirements for modern ground … Read More → "ADLINK Launches Extreme Rugged™ HPERC-IBR for Reduced SWaP Requirements"

Optomec Launches Entry Level Research System for Printed Electronics

November 12, 2013

Albuquerque, New Mexico, 1 November 2013: Optomec announced today availability of a new entry level offering in its line-up of systems for printed electronics, the Aerosol Jet 200 bench top. This new system is built using Optomec’s patented Aerosol Jet core technology, but in a bench top form factor ideally suited for research applications, such as prototyping small electronic devices, or developing and certifying new printable inks. The system was developed specifically in response to growing world-wide interest in printed electronics, including the need to train a new generation of workers in additive manufacturing technology.

TI helps make customer system design easier with TI Designs, the industry’s most extensive reference design library

November 12, 2013

DALLAS (Nov. 11, 2013) – Today Texas Instruments (TI) (NASDAQ: TXN) introduced TI Designs, the industry’s most extensive reference design library, spanning TI’s broad portfolio of analog, embedded processor and connectivity products for industrial, automotive, consumer, communications and computing applications, among others. TI Designs are comprehensive, with each including test data, a schematic or block diagram, bill of materials (BOM) and design files that help explain the circuit’s function and performance. Support material may also include models, software, code examples, design guides, evaluation modules and more to take system designers even further down the design path. To learn more … Read More → "TI helps make customer system design easier with TI Designs, the industry’s most extensive reference design library"

Cadence Introduces Voltus IC Power Integrity Solution, Delivering Exceptional Performance and Capacity in Power Signoff

November 12, 2013

Highlights:

New power integrity analysis engine with massively parallel execution brings up to 10X faster performance
New hierarchical architecture supports very large designs up to 1 billion instances
Tightly integrated with key Cadence tools throughout the design flow, including Cadence Tempus Timing Signoff Solution, for the fastest design closure in the industry

SAN JOSE, Calif., Nov. 12, 2013—Addressing the critical power challenges faced by electronics developers, Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced Voltus™ IC … Read More → "Cadence Introduces Voltus IC Power Integrity Solution, Delivering Exceptional Performance and Capacity in Power Signoff"

Pentek Introduces 2-Channel Analog RF Tuner for Communications, Radar and Signal Intelligence Systems

November 12, 2013

Wide RF signal tuning range from 400 MHz to 4 GHz
Amplifies RF input levels as low as -60 dBm
Output signal bandwidths to 390 MHz
Available in PMC/XMC, AMC, VPX, cPCI and PCIe formats

Synopsys and CEVA Deliver Superior Performance, Power and Area for CEVA DSP Cores with DesignWare HPC Design Kit

November 12, 2013

MOUNTAIN VIEW, Calif., Nov. 12, 2013 /PRNewswire/ —

Highlights:

CEVA and Synopsys collaborated to develop highly optimized DSP core implementations for wireless communications applications including base stations and handsets
Results enabled by Synopsys’ DesignWare HPC Design Kit, a processor optimization kit that includes more than 125 standard cells and memory instances, and an ultra-high density memory compiler
CEVA achieved an 8 percent performance improvement (worst-case operating conditions) over previous results, and a maximum performance of 1.3 GHz in a 28-nm process while … Read More → "Synopsys and CEVA Deliver Superior Performance, Power and Area for CEVA DSP Cores with DesignWare HPC Design Kit"

Wind River Delivers Android Expertise to Clarion AX1 Automotive IVI Device

November 12, 2013

ALAMEDA, Calif. – Nov. 12, 2013 – Wind River®, a world leader in embedded software for intelligent connected systems, announced that Clarion Malaysia is using Wind River Android software and expertise in their new Clarion AX1 automotive in-vehicle infotainment (IVI) device.

As the connected car is becoming a more common reality, cars are quickly adopting new features to create a consumer electronics experience. Wind River provided Clarion with a customized Android software platform and software integration services to develop a high-quality … Read More → "Wind River Delivers Android Expertise to Clarion AX1 Automotive IVI Device"

featured blogs

How Synopsys IP and TSMC’s N12e Process are Driving AIoT

May 8, 2024

Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....