News – Page 1514 – EEJournal

High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus

June 10, 2015

CHANDLER, Ariz., June 9, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo a combined analog and digital current sensor—the PAC1921. This new device is the world’s first high-side current sensor with both a digital output, as well as a configurable analog output that can present power, current or voltage over the single output pin. Simultaneously, all power related output values are also available over the 2-Wire digital bus, which is compatible with I< … Read More → "High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus"

Imec Presents Large Area Industrial Crystalline Silicon n-PERT Solar Cell with a Record 22.5 Percent Efficiency

June 10, 2015

Leuven (Belgium)—June 10, 2015—Nano-electronics research center imec announced today at Intersolar Europe, a new efficiency record for its large area n-type PERT (passivated emitter, rear totally diffused) crystalline silicon (Cz-Si) solar cell, now reaching 22.5 percent (calibrated at ISE CalLab). It is the highest efficiency achieved for a two-side-contacted solar cell processed on six inch commercially available n-type Cz-Si wafers without the use of passivated contacts.

N-type silicon solar cells are considered as promising alternatives to p-type solar cells for next generation highly … Read More → "Imec Presents Large Area Industrial Crystalline Silicon n-PERT Solar Cell with a Record 22.5 Percent Efficiency"

Green Hills Software Announces INTEGRITY® RTOS Multicore Support for OCTEON® III Family of SoC Processors from Cavium

June 10, 2015

SANTA BARBARA, CA and SAN JOSE, CA — June 10, 2015 — Green Hills Software, the largest independent software vendor of embedded software solutions for high assurance operating systems, and Cavium, Inc. (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking, today announced the availability of Green Hills Software’s multicore development solutions for Cavium’s OCTEON® III family of multicore processors.

Green Hills Software’s portfolio of optimized software solutions and comprehensive services … Read More → "Green Hills Software Announces INTEGRITY® RTOS Multicore Support for OCTEON® III Family of SoC Processors from Cavium"

STMicroelectronics Launches Voice-Over-Bluetooth Low Energy for Wearable and Remote-Control Applications

June 10, 2015

Geneva, June 10, 2015 – Voice control that can make wearable technology simpler and more battery-friendly just became easier to add with software-based innovations from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

The wearables sector is taking off, with the arrival of sophisticated new products such as smart watches. Research firm IHS predicts^{^[1]} the market will reach 135 million units by 2019 and sees designs becoming smarter and more sensor-rich to support advanced functions. Ease of … Read More → "STMicroelectronics Launches Voice-Over-Bluetooth Low Energy for Wearable and Remote-Control Applications"

LeddarTech introduces LeddarCore sensor ICs for high-volume applications

June 10, 2015

QUEBEC CITY, CANADA, June 10, 2015 – LeddarTech today announced the upcoming launch of LeddarCore™, a new line of sensor ICs designed to offer unmatched integration capabilities for the development and production of high-volume applications.

LeddarCore is intended to give integrators and OEMs the flexibility to develop fully optimized sensor solutions or systems perfectly adapted to their specific applications. Combining … Read More → "LeddarTech introduces LeddarCore sensor ICs for high-volume applications"

Precision Set & Readback PMBus-Compatible, Dual 9A or Single 18A µModule Regulator

June 10, 2015

MILPITAS, CA – June 10, 2015 – Linear Technology Corporation announces the LTM4675, dual 9A or single 18A, µModule^® (micromodule) step-down DC/DC regulator with PMBus serial digital … Read More → "Precision Set & Readback PMBus-Compatible, Dual 9A or Single 18A µModule Regulator"

High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus

June 9, 2015

CHANDLER, Ariz., June 9, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo a combined analog and digital current sensor—the PAC1921. This new device is the world’s first high-side current sensor with both a digital output, as well as a configurable analog output that can present power, current or voltage over the single output pin. Simultaneously, all power related output values are also available over … Read More → "High-Side Current/Power Sensor From Microchip is World’s First to Feature Both a Configurable Analog Output and a 2-Wire Digital Bus"

Tektronix Adds Advanced Analysis, Characterization Support for HDMI Receiver Testing

June 9, 2015

BEAVERTON, Ore., June 9, 2015 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that it has expanded its portfolio of HDMI test solution with the addition of advanced analysis and characterization support for HDMI 2.0 receiver testing. The new HDMXpress provides complete support for HDMI test pattern generation, auto-calibration and margin testing, eliminating the needs for manual pattern creation.

HDMI (High-Definition Multimedia Interface) has emerged as the de-facto industry standard for transferring video data to display … Read More → "Tektronix Adds Advanced Analysis, Characterization Support for HDMI Receiver Testing"

Cadence Announces Collaboration with TSMC on IoT IP Subsystem

June 9, 2015

SAN JOSE, Calif., 08 Jun 2015 — Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) intellectual property (IP) subsystem demonstration platform for TSMC’s ultra-low power (ULP) process. Targeting wearable, home automation, always-on and industrial control applications, this IP subsystem, with the support of the Cadence® suite of digital and custom/analog tools, provides the opportunity to simplify IoT designs and accelerate the time to market for mutual customers.

Initially targeting the TSMC 55ULP process, the flexible Cadence … Read More → "Cadence Announces Collaboration with TSMC on IoT IP Subsystem"

Keysight Technologies to Demonstrate Latest RF Circuit, System and 3D Electromagnetic Design and Simulation, Device Modeling Solutions at 52nd Annual DAC

June 9, 2015

SANTA ROSA, Calif., June 8, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today announced it will demonstrate its latest electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications at the Design Automation Conference (DAC) 2015, Booth 2020, San Francisco, June 8-10.

Keysight EEsof EDA technical experts and application engineers will be available to discuss and demonstrate:

New capabilities and productivity improvements … Read More → "Keysight Technologies to Demonstrate Latest RF Circuit, System and 3D Electromagnetic Design and Simulation, Device Modeling Solutions at 52nd Annual DAC"