November 4, 2013 – Mouser Electronics, Inc., a leading engineering resource and global distributor for semiconductors and electronic components, today announced they will be a major sponsor and participant of the Read More → "Mouser Sponsors World’s Largest Summit on Energy Harvesting"
TUALATIN, Ore. — November 5, 2013 — CUI Inc has announced one of the industries smallest 50 W dc-dc converters, the PQA50-D. The series’ feature set makes it ideally suited for IT equipment, telecom and industrial systems.
The dc-dc converter series is a low cost, high performance family with a 2 x 1 inch (50.8 x 25.4 mm) footprint – an industry standard size for less powerful devices. It incorporates six sided metal shielding for improved EMC performance and efficiency up to 93%.
The converters maintain high efficiency … Read More → "Ultra-Compact 50 W Dc-Dc Converter Cuts Board Space And Cost In Telecommunications, Industrial And ITE Applications"
Leuven, November 4, 2013—Imec, a leading nanoelectronics research center, announced today that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers, through a unique silicon fin replacement process. The achievement illustrates progress toward 300mm and future 450mm high-volume wafer manufacturing of advanced heterogeneous CMOS devices, monolithically integrating high-density compound semiconductors on silicon. The breakthrough not only enables continual CMOS scaling down to 7nm and below, but also enables new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
“To our knowledge, this is the world’s first functioning CMOS compatible IIIV … Read More → "Imec Demonstrates World’s First III-V FinFET Devices Monolithically Integrated on 300mm Silicon Wafers"
Taipei, Taiwan, November 5, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that MitraStar Technology, the world leader in the networkingDMS (Design and Manufacturing Service) industry, has selected ST’s STiH273 system-on-chip to produce set-top boxes (STBs) for Kbro Broadband, one of Taiwan’s largest cable television operators. ST’s highly-integrated, secure and optimized HD cable chipset is set to accelerate Taiwan’s transition to digital TV.
ST’s newest set-top box chips enable the delivery of innovative DVB and Internet-based services to price-sensitive market segments, broadening consumer access … Read More → "STMicroelectronics’ Chips Selected by MitraStar Technology for Newest Set-Top Boxes from Kbro Broadband"
San Jose, Calif., November 5 2013—Altera Corporation (NASDAQ: ALTR) today announced the release of its Quartus® II software version 13.1, extending its industry leadership in software productivity by delivering on average 30 percent and up to 70 percent reduction in compile times compared to the previous version, through significant algorithm optimization and increased parallelization. The software also includes the newly available Rapid Recompile feature for customers making small source code changes on Altera Stratix® V FPGA designs. With Rapid Recompile, customers can reuse previous compilation results to preserve performance, without … Read More → "Altera Quartus II Software v13.1 Delivers Up to 70 Percent Reduction in Compile Times"
RALEIGN, N.C. and LONDON – November 5, 2013 – Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services and Digital Matter Telematics, a South African-based provider of innovative technology in design, development and deployment of embedded electronic devices and software, today announced that Digital Matter Telematics’ self-powered G52 Solar and the company’s OEM Server … Read More → "Digital Matter Telematics to Embed Telit Cellular Technology in Rugged Remote Monitoring & Tracking Device – G52 Solar"
MOUNTAIN VIEW, Calif., Nov. 5, 2013 /PRNewswire/ —
Highlights:
HILLSBORO, OR Nov. 5, 2013 – Lattice Semiconductor Corp. (NASDAQ: LSCC) today announced a portfolio of programmable solutions for building smart, low-power cellular equipment needed to support the global rollout of Heterogeneous Networks (HetNet). In collaboration with Azcom Technology, the Lattice HetNet Solutions Portfolio enables system designers to implement best-in-class solutions for connectivity, control path and power management while accelerating their development with system-level reference designs for multi-mode LTE small cells.
Service providers around the world are deploying a mosaic of wireless equipment in both indoor and outdoor environments including office buildings, public facilities and underground areas to support the … Read More → "Lattice Announces HetNet Solutions Portfolio for Accelerating Deployment of Next Generation Wireless Infrastructure"
Rockville, MD — October 29, 2013 — Hillcrest Labs today announced it has designed a new sensor hub product to change how consumers use their smartphones and other portable electronics. Sensor hubs are a separate class of chips designed to offload sensor management from the main processor. Hillcrest’s SH-1 sensor hub is a turn-key software solution that provides ‘always on’ features such as context awareness and gesture recognition to augment the consumer experience and minimize system power consumption. At launch, Hillcrest’s software will be paired with a cost-effective, low power SAM D20 ARM(R) Cortex(R) M0+ based microcontroller from … Read More → "Hillcrest Labs Launches Low Power Sensor Hub for Smartphones, Tablets, Wearables and the Internet of Things"
WILSONVILLE, Ore., October 29, 2013—Mentor Graphics Corp. (NASDAQ: MENT)
today announced that the Calibre® PERC™ reliability verification product has been added to the TSMC9000 IP quality program. TSMC and Mentor Graphics jointly developed electrical checks to help improve IP dependability as part of the TSMC9000 qualification process. The companies are also collaborating on an offering that will allow IP partners to access TSMC9000-compliant checking on a per-use basis. This extends the capabilities customers enjoy today with the Calibre PERC product to TSMC’s IP partners, enabling further pre-verification of third-party IP and increasing the coherence … Read More → "Mentor Graphics Calibre PERC Reliability Checking Solution Used for IP Quality Program by TSMC"
