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Keysight Technologies’ New ADS PCI Express, USB Compliance Test Benches Solve Simulation-Measurement Correlation Challenge Unique Solution Helps Customers Gain PCI Express, USB Insights

April 7, 2015

SANTA ROSA, Calif., April 6, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today introduced the Advanced Design System PCI Express andUSB Compliance Test Benches, which enable a complete workflow for SerDes engineers, from simulation of a candidate design, through measurement of the finished prototype. The solution is ideal for semiconductor companies developing SerDes I/O blocks and OEMs integrating such chips onto their system PCBs.

Both compliance test benches are available as add-ons to the Read More → "Keysight Technologies’ New ADS PCI Express, USB Compliance Test Benches Solve Simulation-Measurement Correlation Challenge Unique Solution Helps Customers Gain PCI Express, USB Insights"

Dialog Semiconductor Launches the World’s First Bluetooth® Smart Wearable-on-Chip™

April 7, 2015

London UK, 7 April 2015 – Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth Smart wireless technology, has released details of its DA14680 ‘Wearable-on-Chip’ Bluetooth Smart (v4.2) device. The small, ultra-low power integrated circuit includes the key functionality to create a fully hosted wearable computing product. It features flexible processing power, flash memory for virtually unlimited execution space, dedicated circuitry for sensor control, analogue and digital peripherals optimised for wearable products, and an advanced power … Read More → "Dialog Semiconductor Launches the World’s First Bluetooth® Smart Wearable-on-Chip™"

Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 10nm FinFET Early Design Starts

April 7, 2015

SAN JOSE, Calif., April 6, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and custom/analog tools have achieved certification from TSMC (TWSE: 2330, NYSE: TSM) for its most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models.

The Cadence® custom/analog and digital implementation and signoff tools have been certified by TSMC on high-performance reference designs in order to provide customers with the fastest path to design closure on the 10nm FinFET process and include:

? Encounter® Digital Implementation System and Innovus? Implementation System: The Encounter Digital Implementation System has … Read More → "Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 10nm FinFET Early Design Starts"

New Ultra-Compact 100W Baseplate Cooled Power Supply

April 7, 2015

Stadium Power a leading provider of power supply solutions announces the availability of the CBM100S baseplate cooled ultra-compact 100W output power supply series. The industry standard full-brick sized power module measures just 17mm high and will deliver a full output without fan cooling. Typical applications include military COTS power solutions, rugged industrial and instrumentation systems.

The CMB100S series from Stadium Power has a universal input range from 90~264Vac, active power factor correction (PFC) meeting EN61000-3-2, high efficiency up to 91%, high power density up … Read More → "New Ultra-Compact 100W Baseplate Cooled Power Supply"

AMD Embedded R-Series APU Powers Samsung Electronics’ Digital Signage Systems

April 7, 2015

SUNNYVALE, Calif. — April 7, 2015 — AMD (NASDAQ: AMD) today announced that the AMD Embedded R-Series accelerated processing unit (APU), previously codenamed “Bald Eagle,” is powering the latest set-back-box (SBB) digital media players from Samsung Electronics, Co., Ltd. With high performance, low power, and broad connectivity, the new Samsung SBB-B64DV4 is an ideal fit for demanding signage applications that transform Samsung SMART Signage Displays into inclusive digital … Read More → "AMD Embedded R-Series APU Powers Samsung Electronics’ Digital Signage Systems"

Microsemi Announces RTG4 Radiation-tolerant FPGAs For High-speed Signal Processing Applications

April 7, 2015

ALISO VIEJO, Calif.—April 7, 2015 —Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced availability of its RTG4™ high-speed signal processing radiation-tolerant FPGA family. The RTG4’s reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, requiring no configuration scrubbing, unlike SRAM FPGA technology. RTG4 supports space applications requiring up to 150,000 logic elements and up to 300 MHz of system performance.

Typical uses for RTG4 include remote sensing space payloads, such as radar, imaging and spectrometry in civilian, scientific and commercial applications. These … Read More → "Microsemi Announces RTG4 Radiation-tolerant FPGAs For High-speed Signal Processing Applications"

Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX 10 FPGA Products

April 7, 2015

San Jose, Calif. and Hsinchu, Taiwan, R.O.C., (April 7, 2015) – Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology that provides enhanced quality, reliability and integration for Altera’s MAX® 10 FPGA products.

This approach results in an extremely thin package height of less than 0.5mm (including solder ball) that is ideal for applications where space is at a premium, such as sensor applications, small … Read More → "Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX 10 FPGA Products"

TSMC Certifies Synopsys Design Tools for 16-nm FinFET Plus Production and for 10-nm Early Design Starts

April 6, 2015

MOUNTAIN VIEW, Calif., April 6, 2015 /PRNewswire/ — 

Highlights:

Xilinx Highlights Multiple Next Generation Ethernet, SDN and Data Center Acceleration Technologies at Ethernet Technology Summit 2015

April 6, 2015

SAN JOSE, Calif., April 6, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will highlight multiple next generation Ethernet, SDN and data center acceleration technologies in presentations and demonstrations at Ethernet Technology Summit 2015. To learn more, join Xilinx at the presentations listed below or visit us at ETS Booth #100, April 15 – 16, at the Santa Clara Convention Center, Santa Clara, CA.

Xilinx Conference Participation

Wednesday, April 15</ … Read More → "Xilinx Highlights Multiple Next Generation Ethernet, SDN and Data Center Acceleration Technologies at Ethernet Technology Summit 2015"

TSMC Certifies Mentor Graphics Tools for Early Design Start in TSMC’s 10nm FinFET Technology

April 6, 2015

WILSONVILLE, Ore., April 6, 2015—Mentor Graphics Corp. (NASDAQ: MENT) today announced that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification. Calibre® physical verification and design for manufacturing (DFM) platform, and theAnalog FastSPICE™ (AFS™) Circuit Verification Platform, including AFS Mega, are certified by TSMC based on the most current version of 10nm … Read More → "TSMC Certifies Mentor Graphics Tools for Early Design Start in TSMC’s 10nm FinFET Technology"

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