News – Page 15 – EEJournal

Imec unveils 7‑bit, 175GS/s massively time-interleaved slope- ADC – pairing record-small footprint and low conversion energy with top sampling speed

Patented linearization and switched input buffer techniques ensure precise signal conversion and wide bandwidth at high speeds

February 17, 2026

At IEEE ISSCC 2026, imec introduces a 7-bit, 175GS/s wireline ADC implemented in 5nm FinFET technology, combining a record-small footprint (250 x 250µm²) and low conversion energy (2.2 pJ per sample).
The design builds on the massively time–interleaved slope–ADC architecture imec debuted in 2024, now enhanced with patented linearization and switched input buffer techniques to ensure precise signal conversion and wide bandwidth at ultra-high sampling rates.

STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules

Standard and wide package options meet isolation, insulation, and creepage/clearance specifications

February 17, 2026

Geneva, Switzerland, February 17, 2026 — STMicroelectronics’ STGAP2SA and Read More → "STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules"

Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands

February 17, 2026

Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond
Impress leverages insights and engineering expertise from NearStack OTS, with over one million units delivered to date
Compact footprint and enhanced durability simplify maintenance and upgrades to future-proof high-density systems

LISLE, IL – February 17, 2026 – Read More →

TDK launches high‑reliability automotive NTC thermistors rated for +175 °C

February 17, 2026

Guarantees operation in high‑temperature environments up to +175 °C

Adopts AgPd terminals compatible with conductive‑glue mounting

AEC‑Q200 compliant (automotive grade)

February 17, 2026

Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds

February 17, 2026

HUNTSVILLE, Ala., February 17, 2026 — Operations at sea and in the air depend on reliable, adaptable hardware to deliver mission-critical intelligence quickly and securely. Abaco Systems, a leader in rugged, mission-critical embedded computing, meets that challenge with the new FMC600 fiber optic module carrier featuring two PAM4 Optical Modules. With up to eight bi-directional channels, the FMC600 enhances real-time situational awareness and supports faster decision-making by rapidly processing and transmitting vast amounts … Read More → "Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds"

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

Solution addresses design bottleneck by automating complex workflows

February 17, 2026

SANTA ROSA, Calif.–(BUSINESS WIRE)–Read More → "Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs"

Infineon and BMW Group join forces to shape the future of software-defined vehicles with the Neue Klasse

February 16, 2026

Infineon plays an important role in the innovative architecture of BMW Group’s Neue Klasse with components for central computing, high-speed connectivity, efficient power management and distribution
Centralized computing delivers faster processing and lower latency, allowing smoother handling, extended range, and improved updateability
Zonal design reduces wiring by 600 meters and improves efficiency by approximately 20 percent via smart power distribution

Munich, Germany – 16 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) plays an … Read More → "Infineon and BMW Group join forces to shape the future of software-defined vehicles with the Neue Klasse"

Altus Expands Advanced X-ray Inspection at Prototype Electronics

February 16, 2026

Altus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported CEM, Prototype Electronics, with the installation of a Scienscope X-ray inspection system, strengthening non-destructive inspection capability for complex electronic assemblies.

As assemblies increasingly incorporate bottom-terminated devices and dense multilayer PCB structures, Prototype Electronics identified the need to extend inspection beyond surface-level techniques. X-ray inspection enables verification of hidden solder joints and internal connections, providing additional assurance where conventional optical inspection is limited.

Following a competitive evaluation process involving demonstrations, sample validation and formal scoring against multiple suppliers, Prototype … Read More →

Intelligent automotive high-side driver from STMicroelectronics powers and protects during severe voltage transients

Meets car industry’s stringent quality standard for electrical and electronic components

February 16, 2026

Geneva, Switzerland, February 16, 2026 — With 4V minimum operating voltage, STMicroelectronics’ VNQ9050LAJ 4-channel automotive high-side driver powers through disturbances including extreme cold cranking operation down to 2.7V, boosting vehicle reliability and ensuring superior user experiences. This resilience when exposed to severe transients meets the latest version of LV124, the automotive industry’s stringent quality standard for electrical and electronic components.

Designed to power 12V ground-connected loads, the Read More → "Intelligent automotive high-side driver from STMicroelectronics powers and protects during severe voltage transients"

Taoglas Debuts ‘World-First’ AI-Powered Antenna Selection Platform at embedded world 2026

February 16, 2026

San Diego, CA – February 16, 2026 – Taoglas®, a trusted provider of advanced RF and antenna solutions, will introduce the world’s first AI-driven Antenna Product Recommendation Engine at embedded world 2026 in Nuremberg, … Read More → "Taoglas Debuts ‘World-First’ AI-Powered Antenna Selection Platform at embedded world 2026"