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AVX Introduces New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial Leaded Capacitors

May 13, 2015

GREENVILLE, S.C. (May 12, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced the new SV Series high voltage, automotive grade, multilayer ceramic (MLC), radial-leaded capacitors. Qualified to AEC-Q200 and rated for 1,000VDC, the new SV Series capacitors are designed with C0G (NP0) Class I dielectric materials, which exhibit an extremely low dissipation factor — providing excellent high rms current handling capabilities with minimal power losses in medium to high power resonant converters — and radial leads, which enable the mechanical decoupling of the MLC chip from the board, and provide the maximum mechanical stress relief … Read More → "AVX Introduces New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial Leaded Capacitors"

Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification

May 13, 2015

SAN JOSE, Calif., 12 May 2015 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification. The complete controller and PHY integrated solution is pre-verified, which enables designers to mitigate project risk and reduce system-on-chip (SoC) integration and verification time.

For more information on Cadence® IP for USB offerings, please visit: http://www.cadence.com/news/USBIP.

Cadence offers a complete USB 3.0 solution including the controller, PHY and verification IP. The … Read More → "Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification"

Synopsys’ Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power

May 13, 2015

MOUNTAIN VIEW, Calif., May 13, 2015 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) announces the availability of Verification IP (VIP) for the DDR4 3D Stacking (3DS) specification. Synopsys VIP for DDR4 3DS, based on its native SystemVerilog UVM architecture, is architected for ease of integration and configurability. The VIP for DDR4 3DS supports all JEDEC commands and provides pre-built DIMM (UDIMM, RDIMM, LRDIMM) models with protocol and timing checks, including support for memory vendor and the JEDEC standard part configurations. Synopsys’ VIP for DDR4 3DS is natively integrated with its Verdi® Protocol Analyzer, … Read More → "Synopsys’ Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power"

LDRA and Green Hills Software Deliver Industry-Leading Multicore Development and Verification

May 13, 2015

Wirral, U.K., and Santa Barbara, CA. May 13, 2015—LDRA,the leader in standards compliance, automated software verification, source code analysis, and test tools, and Green Hills Software, the worldwide leader in high assurance operating systems, have partnered to provide high-assurance application development on multicore platforms used in safety- and security-critical markets.

The growing emergence of multicore platforms and applications paves the way for new verification tool capabilities needed to complete high-assurance safety- and security-critical compliance activities. LDRA has developed such capabilities in partnership with Green Hills Software, resulting in a solution that enables developers to fully trace … Read More → "LDRA and Green Hills Software Deliver Industry-Leading Multicore Development and Verification"

PIL Launches P43 Long Range UltraSonic Sensors

May 13, 2015

May 13, 2015 – Erlensee, Germany — PIL announces the availability of its new P43 ultrasonic sensors to measure distances. Applications include object recognition for agriculture and fluid levels, distance measuring for trucks and loading ramps, level sensing in dusty conditions, parking lot detection/barrier monitoring as well as a variety of other industrial and manufacturing applications.

The PIL P43 ultrasonic sensors provides the industry’s greatest range  – from 250 mm to up to 6000 mm. M12, M18 and M30 dimensions are available – with or without thread or cubic housing. Highly accurate, it provides a small sound cone shape, two integrated internal LED’ … Read More → "PIL Launches P43 Long Range UltraSonic Sensors"

Andes Partners with eMemory to Provide Hardware Security Solution for the Internet of Things Market

May 12, 2015

HSINCHU, Taiwan – May 12, 2015 – Andes Technology Corporation, the leading Asia-based suppliers of small, low-power, high performance 32-bit embedded CPU cores, today announced a partnership with eMemory (Stock Code: 3529) a global leader in logic non-volatile memory (Logic NVM) and silicon intellectual property (Silicon IP), to provide a hardware security solution for designers building Internet of Things system on chip (SoC) devices. The AndesCore™ S801 energy-efficient processor core with secure MPU (Memory Protection Unit) provides hardware mechanisms for code and data protection and a comprehensive protocol to manage privilege levels. The eMemory one-time programmable (OTP) NeoFuse silicon IP provides secure storage for … Read More → "Andes Partners with eMemory to Provide Hardware Security Solution for the Internet of Things Market"

Microchip’s New dsPIC33EP “GS” Family is Optimized for Digital Power Applications

May 12, 2015

CHANDLER, Ariz., May 12, 2015 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the 14-member dsPIC33EP “GS” family of Digital Signal Controllers (DSCs).  The dsPIC33EP “GS” family delivers the performance needed to implement more sophisticated non-linear, predictive and adaptive control algorithms at higher switching frequencies.  These advanced algorithms enable power supply designs that are more energy efficient and have better power supply specifications.  Higher switching frequencies enable the development of physically smaller power supplies that offer … Read More → "Microchip’s New dsPIC33EP “GS” Family is Optimized for Digital Power Applications"

SIGFOX Joins Samsung at Internet of Things World to Demonstrate Its New IoT Network

May 12, 2015

SAN FRANCISCO – May 12, 2015 –SIGFOX, the global leader in cost-effective, energy-efficient Internet of Things (IoT) connectivity, will be demonstrating their new IoT Network at Samsung’s booth during Internet of Things World to demonstrate the practical and easy-to-use features of SIGFOX’s IoT network and Samsung’s new ARTIK IoT platform.

SIGFOX, which recently deployed its IoT network in San Francisco, and the newly launched ARTIK platform that helps speed development of IoT devices and software solutions, will demonstrate a simple set up and operation for tracking stolen bicycles.

“At Samsung, we are keen to work … Read More → "SIGFOX Joins Samsung at Internet of Things World to Demonstrate Its New IoT Network"

Infineon 3D Magnetic Sensor with High Accuracy Reduces Power Consumption in Consumer and Industrial Applications

May 12, 2015

Munich, Germany – May 12, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its3D magnetic sensor TLV493D-A1B6 that features highly accurate three-dimensional sensing with extremely low power consumption in a small 6-pin TSOP package. Magnetic field detection in x, y, and z direction, allow the sensor to reliably measure three-dimensional, linear and rotation movements. The implemented digital I²C interface enables fast and bidirectional communication between sensor and microcontroller. </ … Read More → "Infineon 3D Magnetic Sensor with High Accuracy Reduces Power Consumption in Consumer and Industrial Applications"

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