News – Page 1469 – EEJournal

congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics

July 16, 2015

San Diego, California, July 14, 2015 * * * congatec, Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the latest addition to its COM Express Basic portfolio: the new conga-TS97 computer module with either Intel® Core™ or Intel® Xeon® processors (codename Broadwell) manufactured in 14nm technology. The new conga-TS97 COM Express Basic module in the Intel® Xeon® version delivers server-grade performance for the first time and, compared to its predecessors, excels not only with its overall performance but particularly in terms of graphics due to the featured Intel® Iris™ Pro technology. … Read More → "congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics"

Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT

July 16, 2015

SAN JOSE, Calif., July 15, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) announced today that it has joined the Industrial Internet Consortium (IIC) to collaborate and drive common architectures and frameworks within the Industrial IoT (IIoT). Xilinx’s All Programmable, standards-based solutions combine software programmability, real-time processing, hardware optimization, and any-to-any connectivity with security and safety required by IIoT systems. The Industrial Internet Consortium was founded in 2014 by AT&T, Cisco, General Electric, IBM, and Intel to catalyze and coordinate the priorities and enabling … Read More → "Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT"

Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive

July 16, 2015

Taipei, Taiwan, July 16, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced its 5-channel power-management IC (L7292) has been selected byKingston Technology Company, Inc., the independent world leader in memory products, for its enthusiast-class HyperX Savage solid-state drive (SSD). Compared with designs using low drop-out regulators (LDO) or other multi-channel power-management ICs, ST’s L7292 offers the highest … Read More → "Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive"

Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development

July 16, 2015

Düsseldorf, July 16, 2015 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today introduced the smallest R-Car-based development kit to date – the ADAS Starter Kit – based on Renesas’ high-end R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications.

Complementing Renesas’ current R-Car V2H-based ADAS development boards, the new ADAS Starter Kit will enable users and partner companies to experience the enhanced computer vision performance of Renesas SoCs and accelerate the development of dedicated … Read More → "Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development"

Digi-Key Partners with ARM University Program to Offer ‘Lab-in-a-Box’ for Participating Universities Worldwide

July 16, 2015

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, today announced their partnership with the ARM University Program to distribute the innovative ‘Lab-in-a-Box’ (LiB) to higher educational institutions around the globe.

The LiB contains ARM-based technology and high quality, rigorous training materials that support electronics and computer engineering courses. Since its launch in February 2014, ARM LiBs have been successfully deployed in hundreds of universities worldwide, enabling an easy migration path for academics wanting to upgrade their existing curricula to state-of-the-art technologies from … Read More → "Digi-Key Partners with ARM University Program to Offer ‘Lab-in-a-Box’ for Participating Universities Worldwide"

2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current

July 16, 2015

MILPITAS, CA – July 16, 2015 – Linear Technology Corporation announces the LT8494, a current mode, fixed frequency SEPIC/boost DC/DC converter with an internal 2A, 70V switch. Ultralow quiescent current of only 7µA makes the device ideal for always-on automotive or other industrial battery powered systems. The LT8494 starts up from an input voltage range of 2.5V to 32V and once running it … Read More → "2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current"

Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems

July 15, 2015

SANTA ROSA, Calif., July 13, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today announced a new version of its U1092A AcqirisMAQS Multichannel Acquisition Software. This application, providing unique features for massively multichannel acquisition systems, evolved together with all Keysight’s latest technologies, including the newly introduced M9709A AXIe 8-bit high-speed digitizer.

AcqirisMAQS proven software, designed specifically for large multichannel acquisition, enables configuration management as well as visualization of data for hundreds of channels from a … Read More → "Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems"

Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression

July 15, 2015

Leuven (Belgium) and Radfeld (Austria) —July 14, 2015—Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5 … Read More → "Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression"

crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios

July 15, 2015

July 14, 2015 – San Francisco, CA (Intersolar North America) –Vienna, Austria-based flexible photovoltaic film (PV) innovator, crystalsol GmbH, andCambrios Technologies, the Sunnyvale, CA-based leader in silver nanowire technology, today announced that crystalsol has successfully developed fully printed flexible solar cells using silver nanowires from Cambrios. Solar cells from the pilot production line at crystalsol are shipping into low volume consumer products. crystalsol expects large volume product shipment into building integrated photovoltaics market to begin in the near future.

“Our proprietary printed solar cell technology successfully achieves highly efficient solar cells that are thin, lightweight … Read More → "crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios"

Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line

July 15, 2015

Plano, Texas – July 15th, 2015 – Four new multifunction gates from Diodes Incorporated feature user-customized logic configurations so that a single part can replace multiple devices. This product line expansion adds a new level of versatility to Diodes Incorporated’s existing 74AUP1G logic family and provides valuable space and weight saving benefits in space-constrained applications such as fitness wearables, smartphones and other portable consumer electronic devices.

The 74AUP1G57, 74AUP1G58, 74AUP1G97 and 74AUP1G98 provide various base gate arrangements with three … Read More → "Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line"

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