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Applied Materials Introduces High-Performance ALD Technology for the 3D Era

July 24, 2015
  • Innovative Olympia(TM) system positions Applied at the forefront of ALD* technology
  • Unique architecture expands portfolio of high-quality ALD films, enables critical low-temperature processes without compromising productivity
  • Systems installed at leading chipmakers for multiple logic and memory device applications

SANTA CLARA, Calif., July 13, 2015 – Applied Materials, Inc. today unveiled the Applied Olympia(TM) ALD system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.  … Read More → "Applied Materials Introduces High-Performance ALD Technology for the 3D Era"

CSR and SK Telecom Launch World’s First Smart Lighting Beacon with CSRmesh™

July 24, 2015

San Jose, California and Cambridge, UK –July 15, 2015 – CSR plc (LSE: CSR; NASDAQ: CSRE) today announced that its CSRmesh™ technology has been used by SK Telecom to enable the world’s first range of smart LED lightbulbs which also function as Bluetooth® Smart beacons networked together using CSRmesh. The intelligent CSRmesh lighting system will allow an almost unlimited number of smart lightbulbs to be simply controlled and networked together in-store while … Read More → "CSR and SK Telecom Launch World’s First Smart Lighting Beacon with CSRmesh™"

Mentor Graphics Announces Flowmaster with Enhanced Multi-Arm Tank Component and 1D Pipe Stress Links

July 23, 2015

WILSONVILLE, Ore., July 22, 2015—Mentor Graphics Corporation (NASDAQ: MENT) today announced the newest version of the Flowmaster® 1D computational fluid dynamics (CFD) software product for fast and accurate thermo-fluid systems design. The new Flowmaster solution features several key new and enhanced functionalities including an improved multi-arm tank component, and integration with complementary 1D pipe stress products such as CAESAR II and CAEPIPE for pipe fluid-force predictions. Overall product enhancements to usability and increases in physical modeling capabilities provide unparalleled accuracy and ease-of-use to the automotive, aerospace, power generation and gas turbine markets.

The enhanced usability … Read More → "Mentor Graphics Announces Flowmaster with Enhanced Multi-Arm Tank Component and 1D Pipe Stress Links"

Researchers Boost Wireless Power Transfer with Magnetic Field Enhancement

July 23, 2015

Research from North Carolina State University and Carnegie Mellon University shows that passing wireless power transfer through a magnetic resonance field enhancer (MRFE) – which can be as simple as a copper loop – can boost the transfer efficiency by at least 100 percent as compared to transferring through air alone. MRFE use could potentially boost transfer efficiency by as much as 5,000 percent in some systems, experts say.

Wireless power transfer works by having a transmitter coil generate a magnetic field; a receiver coil then draws energy from that magnetic field. One of the major roadblocks for development of marketable … Read More → "Researchers Boost Wireless Power Transfer with Magnetic Field Enhancement"

Applied Materials’ New Etch System Provides Atomic-Level Precision

July 23, 2015
  • New Centris(TM) Sym3(TM) Etch system’s innovative chamber architecture enables precision removal of materials to the atomic level
  • Already installed as a production tool of record with multiple customers, the new system is experiencing the fastest adoption rate for etch in Applied’s history

SANTA CLARA, Calif., July 13, 2015 – Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris(TM) Sym3(TM) Etch Read More → "Applied Materials’ New Etch System Provides Atomic-Level Precision"

congatec adds new AMD G-Series motherboards to its Mini?ITX portfolio

July 22, 2015

San Diego, California, July 21, 2015   * * *   congatec, Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announces the expansion of its industrial-grade Mini-ITX motherboard portfolio with two highly efficient low-power conga-IGX variants that are based on the Gen 2 AMD Embedded G-Series SoC processor (codenamed “Steppe Eagle”) and feature powerful SoC integrated AMD Radeon graphics.

The new low-power motherboards are widely scalable with a TDP ranging between 5 and 15 watts max. The powerful AMD Radeon graphics offers, among other benefits, support for up to two independent displays and up to 4 … Read More → "congatec adds new AMD G-Series motherboards to its Mini?ITX portfolio"

New Multifunction High-Speed USB Module Provides Optimized Digital I/O for Economical Digital Control and Monitoring

July 22, 2015

July 22, 2015—SAN DIEGO, CA — ACCES I/O Products, Inc. reveals its newest USB digital I/O module—Model USB-DIO24-CTR6. This multifunction, high speed USB device is an ideal solution for adding portable, easy-to-install, industrial strength digital I/O and counter capabilities to any PC or embedded system with a USB port. An ideal choice for embedded system and test designers, the USB-DIO24-CTR6 can be used in an assortment of USB-based embedded applications including light, motion, and process controls.

The USB-DIO24-CTR6 features 24 lines of CMOS/LVTTL high-current digital I/O with two fully-undedicated 82C54’s, … Read More → "New Multifunction High-Speed USB Module Provides Optimized Digital I/O for Economical Digital Control and Monitoring"

Redpine Signals Announces Multi-Protocol Wireless Connectivity Support in Mini PCIe Form Factor for IoT Devices

July 22, 2015

NEWS HIGHLIGHTS

Renesas Electronics Introduces 16- and 32-Megabit Advanced Low Power SRAMs with Over 500 Times the Resistance to Soft Errors Compared to Full CMOS Memory Cells

July 22, 2015

Düsseldorf, July 22, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid. Fabricated using the 110-nanometer (nm) process, the new RMLV1616A Series of 16-megabit (Mb) devices and the RMWV3216A Series of 32 Mb devices feature an innovative memory cell technology that dramatically improves reliability … Read More → "Renesas Electronics Introduces 16- and 32-Megabit Advanced Low Power SRAMs with Over 500 Times the Resistance to Soft Errors Compared to Full CMOS Memory Cells"

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