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Renesas Electronics Introduces RZ/G Series HMI Solution for Multiple-Image Processing and 3-D Graphics Tasks

Düsseldorf, October 7, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the availability of the RZ/G microprocessor (MPU) Series, which enables rapid development of high-performance Linux and Android applications. Designed for industrial, home appliances, and office equipment employing a human machine interface (HMI), the RZ/G series extends the capabilities of the successful RZ/A Series MPUs – which supports 2D graphics at up to WXGA resolution – to deliver high-end performance in applications such as image processing, video sensing, and 3-D graphics and multimedia at up to 1080p resolution. 

Key features … Read More → "Renesas Electronics Introduces RZ/G Series HMI Solution for Multiple-Image Processing and 3-D Graphics Tasks"

SiTime’s High-performance Oscillators Provide Timing for Lattice Semiconductor FPGA Development Boards

SUNNYVALE, Calif. – October 7, 2015 – SiTime Corporation, a MEMS and analog semiconductor company, today announced that its high performance SiT9120 and SiT8256 oscillators are being used by Lattice Semiconductor on their ECP5™ Versa FPGA development board. The SiT9120 differential oscillator is used to drive the DDR3 memory on the board and the SiT8256 oscillator feeds Lattice’s ispClock™ device, a programmable PLL that drives multiple functions on the board. Lattice Semiconductor is also using SiTime’s low power SiT1602 oscillator in their HDR-60 video camera development kit (HDR-60 baseboard and NanoVesta headboard) and their iCE40 UltraLite™ breakout board.

< … Read More → "SiTime’s High-performance Oscillators Provide Timing for Lattice Semiconductor FPGA Development Boards"

IAR Systems provides tools for new Atmel MPU series targeting industrial IoT and wearable applications

Uppsala, Sweden—October 7, 2015—IAR Systems® announces that the world-leading development toolchain IAR Embedded Workbench® for ARM® now supports the Atmel | SMART SAMA5D2 series. With its highly optimizing build tools and comprehensive debugging capabilities, IAR Embedded Workbench enables developers to fully leverage the high performance of the new series.

The Atmel | SMART SAMA5D2 series is based on the high-end ARM Cortex®-A5 core and features an ARM NEON™ engine. ARM NEON is a Single Instruction Multiple Data (SIMD) architecture extension providing the top performance that is crucial to developers working for example with multimedia and signal … Read More → "IAR Systems provides tools for new Atmel MPU series targeting industrial IoT and wearable applications"

Imec and Cadence Complete Tapeout of First 5nm Test Chip

LEUVEN, Belgium and SAN JOSE, Calif., October 7, 2015—Nano-electronics research center imec and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence® Innovus™ Implementation System. Using a processor design, imec and Cadence successfully taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography, … Read More → "Imec and Cadence Complete Tapeout of First 5nm Test Chip"

Avnet Introduces PicoZed Software-Defined Radio SOM

PHOENIX– Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today introduced the PicoZed™ SDR Z7035/AD9361, a rugged, low-power, small footprint system-on-module (SOM) that integrates critical RF signal path and high-speed programmable logic, enabling designers to dramatically reduce cycle times for development of the RF-to-baseband signal processing core for wireless communications systems. The fully verified PicoZed Software-Defined Radio SOM provides frequency-agile wideband 2×2 receive and transmit paths in the 70 MHz to 6.0 GHz range, making it suitable for both fixed and mobile SDR applications. Click Read More → "Avnet Introduces PicoZed Software-Defined Radio SOM"

Leti Joins GLOBALFOUNDRIES’ Eco-System Partners With Focus on Supporting 22FDX™ Platform

GRENOBLE, France – Oct. 07, 2015 – CEA-Leti today announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES’ 22FDX™ technology platform. 

Launched this summer, GLOBALFOUNDRIES’ 22FDX technology platform is the industry’s first 22nm FD-SOI semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices. The versatility of the 22FDX platform is a result of unmatched design flexibility and intelligence, including software-controlled transistor body-biasing that provides real-time trade-offs between power and performance. Delivering FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, the platform enables … Read More → "Leti Joins GLOBALFOUNDRIES’ Eco-System Partners With Focus on Supporting 22FDX™ Platform"

30V MOSFET from Diodes Incorporated Enables Rapid and Safe Discharge of Bulk Capacitors on FPGA Power Rails

Plano, Texas – October 6th, 2015 – The DMN3027LFG 30V N-channel MOSFET introduced by Diodes Incorporated is designed as a switch to rapidly and safely discharge large bulk capacitors used on FPGA power rails. The latest FPGAs found in telecoms equipment, servers and data centers have multiple power rails that need to be correctly sequenced to safely power these systems up and down. Designers of high-reliability DC-DC power supplies can achieve this quickly and easily with this new MOSFET from Diodes.

The DMN3027LFG has an RDS(on) of 26m? at 4.5V, which is low enough … Read More → "30V MOSFET from Diodes Incorporated Enables Rapid and Safe Discharge of Bulk Capacitors on FPGA Power Rails"

u-blox takes over manufacture and supply of Cohda Wireless pioneer V2X module

Thalwil, Switzerland and Adelaide, Australia – October 5, 2015 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, announced a further cooperation with Cohda Wireless, a global leader in connected vehicle technology and the world’s number one equipment vendor in the Cooperative Intelligent Transport Systems (C-ITS) market. To meet rapidly increasing demand for V2X modules for trials, early deployments and infrastructure roll-out, Cohda Wireless and u-blox have agreed on an exclusive license for the use of the latest MK5 module design, leveraging u-blox strengths in quality manufacture and global supply of automotive components for positioning … Read More → "u-blox takes over manufacture and supply of Cohda Wireless pioneer V2X module"

Tektronix Expands Bench Instrument Line Up with New Power Supplies, Function Generator

BEAVERTON, Ore., Oct. 6, 2015 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today introduced additions to a family of Keithley power supplies and a new 60 MHz Arbitrary Function Generator featuring best-in-class price performance that together give engineers an expanded range of options for adding essential instruments to their test bench.

Versatile, flexible and cost-effective instruments such as Tektronix oscilloscopes, signal generators and Keithley power supplies are the staples of well-equipped engineering work benches, whether in R&D labs, manufacturing facilities, repair depots or universities. Given the wide range of potential applications, it’s … Read More → "Tektronix Expands Bench Instrument Line Up with New Power Supplies, Function Generator"

Coventor Announces MEMS+ 6.0 Platform for MEMS/IoT Integration

CARY, NC– October 5, 2015 – Coventor®, Inc., the leading supplier of MEMS design automation solutions, today announced the immediate availability of MEMS+® 6.0, the latest version of its industry-leading MEMS design platform.   MEMS+ 6.0 is a significant advance toward a MEMS design automation flow that complements the well-established CMOS design flow, enabling faster integration of MEMS with electronics and packaging.  MEMS+ 6.0 features new enablement of MEMS process design kits (PDKs) and second-generation model reduction capabilities. 

“The fast growing Internet of Things market will increasingly require customization of MEMS sensors and customized package-level integration to achieve … Read More → "Coventor Announces MEMS+ 6.0 Platform for MEMS/IoT Integration"

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