News – Page 1425 – EEJournal

Semtech New Isolated Power Switch Platform Provides Control for Home Automation, Connected Buildings and Internet of Things Applications

November 18, 2015

CAMARILLO, Calif., November 17, 2015 — Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the expansion of its revolutionary Neo-Iso™ Isolated Power Switch Platform with the addition of the TS13101, a new galvanic isolated intelligent power switch. The TS13101 is optimized for compact Internet of Things (IoT) low-voltage applications such as smart thermostats, security, intelligent sensor … Read More → "Semtech New Isolated Power Switch Platform Provides Control for Home Automation, Connected Buildings and Internet of Things Applications"

The most distance with less power – TI’s new Sub-1 GHz solution spans 20 km on a coin cell

November 18, 2015

DALLAS (Nov. 18, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today announced the availability of the next device in theSimpleLink™ ultra-low power platform, designed to help customers easily add ultra-low power, long-range connectivity to their Internet of Things (IoT) designs. The new SimpleLink Sub-1 GHz CC1310 wireless microcontrollers (MCUs) offers up to 20 years of battery life for building and factory automation, alarm and security, smart grid and wireless sensor network applications. For more information, visitRead More → "The most distance with less power – TI’s new Sub-1 GHz solution spans 20 km on a coin cell"

Intrinsic-ID to Showcase IoT Security Solution at InvenSense Developers Conference

November 18, 2015

Santa Clara, California, November 18, 2015 – Intrinsic-ID, a leader in security for cyber-physical systems, will showcase at the 2015 InvenSense Developer’s Conference being held at the Santa Clara Convention Center, November 17-18, 2015, the TrustedSensor^TM solution, a secure, sensor-based authentication system with InvenSense’s Firefly SoC.

Internet of Things (IoT) applications are often driven by data that is gathered by sensors in the field. With all this data flowing through the … Read More → "Intrinsic-ID to Showcase IoT Security Solution at InvenSense Developers Conference"

Sonics Upgrades SoC Development Environment and Flagship NoC to Improve Chip Architecture Optimization and SoC Resiliency

November 18, 2015

Milpitas, Calif. – November 17, 2015 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today introduced new versions of its SonicsStudio® system-on-chip (SoC) development environment and SonicsGN® NoC. Sonics has enhanced the Director graphical user interface in SonicsStudio release 8.1 to be more responsive with larger SoC designs and to deliver fast, static performance analysis that aids designers in optimizing their SoC architecture to satisfy their application requirements across the full range of system use cases. SonicsGN release 3.1 includes new timeout error detection capability that identifies IP cores … Read More → "Sonics Upgrades SoC Development Environment and Flagship NoC to Improve Chip Architecture Optimization and SoC Resiliency"

ClearOhm® Silver Nanowires In Breakthrough Medical Application

November 18, 2015

Nov. 17, 2015 – Sunnyvale, CA – Cambrios Technologies, the Sunnyvale, CA-based leader in silver nanowire technology, today announced its ClearOhm® silver nanowire-based flexible sensor made by Netherlands-based Claymount, are being used in a first-of-its-kind mammogram product from Amsterdam-based Sigmascreening.

Examination for breast cancer requires X-rays of flattened breast tissue. With the existing machines this process is very painful. Sigmascreening has designed a new compression plate, the Sensitive Sigma Paddle, which takes into account the size of the breast and stiffness of the breast tissue. The pressure exerted on the breast can be measured and allows technicians to stop once sufficient … Read More → "ClearOhm® Silver Nanowires In Breakthrough Medical Application"

Leti and Partners in Silicon Photonics Supply-Chain Project Announce Developments on Three Mature Platforms

November 18, 2015

GRENOBLE, France – Nov. 18, 2015 – CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.

Midway through the project, the … Read More → "Leti and Partners in Silicon Photonics Supply-Chain Project Announce Developments on Three Mature Platforms"

High Voltage Automotive Battery Stack Monitor Achieves 0.04% Measurement Accuracy, Lower Cost & Improved Safety Features

November 18, 2015

MILPITAS, CA – November 18, 2015 – Linear Technology announces the LTC6811 high voltage battery stack monitor, a drop-in replacement for the LTC6804 with higher performance and 25% lower price. The LTC6811 is a complete battery measuring IC for hybrid/electric vehicles that incorporates a deep buried Zener voltage reference, high voltage multiplexers, 16-bit delta-sigma ADCs and a 1Mbps isolated serial interface. An LTC6811 … Read More → "High Voltage Automotive Battery Stack Monitor Achieves 0.04% Measurement Accuracy, Lower Cost & Improved Safety Features"

Ericsson’s 60A digital point-of-load DC/DC converter delivers industry-leading power density and scalability

November 17, 2015

Power density of 395A/in3 delivers 60A from 0.98 x 0.55 x 0.276in package
60A single-phase point-of-load DC/DC converters can be connected in parallel to deliver up to 480A
Typically half the size than designs using discrete components
Market leading compact LGA package offers design flexibility for enhanced thermal performance
A high-performance, flexible power solution for all markets, especially ICT, telecom and industrial applications

Ericsson today announced the launch of a new 60A 3E* digital point-of-load (POL) DC/DC power module, the BMR466, designed to power microprocessors, … Read More → "Ericsson’s 60A digital point-of-load DC/DC converter delivers industry-leading power density and scalability"

New STM32 Nucleo expansion board with boostedNFC from ams provides complete hardware and software blueprint for ultra compact NFC designs

November 17, 2015

Unterpremstaetten, Austria (17 November, 2015) — ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today announced that its proven boostedNFC technology, which enables reliable NFC coupling in space-constrained devices, has been implemented in a complete system development board compatible with the popular STM32 family of microcontrollers from STMicroelectronics.

The new NFC expansion board released today by ST, which plugs into Nucleo STM32 main boards, provides a complete design blueprint for implementing NFC in applications such as IoT nodes, in which NFC can be used … Read More → "New STM32 Nucleo expansion board with boostedNFC from ams provides complete hardware and software blueprint for ultra compact NFC designs"

Express Logic’s FileX® Optimized to Improve Flash Memory Reliability and Durability

November 17, 2015

San Diego, CA — November 17, 2015 — Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOSes), today announced that FileX, its file management system, now supports the Microsoft Extended File Allocation Table (exFAT) file system. With support for exFAT, FileX helps to maximize the reliability and fault tolerance of flash memory in a variety of media devices from flat-panel TVs and media centers to compact flash and USB pen drives. … Read More → "Express Logic’s FileX® Optimized to Improve Flash Memory Reliability and Durability"

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